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Courtney R Furnival, ~555126 N Mountain View Cir, Cedar City, UT 84721

Courtney Furnival Phones & Addresses

5126 N Mountain View Cir, Cedar City, UT 84721    435-8659796   

4561 Mule Train Dr, Enoch, UT 84720    435-8651448   

Lake Arrowhead, CA   

29675 Vallejo Ave, Temecula, CA 92592    909-6768865   

Mcminnville, TN   

Smithville, TN   

Orlando, FL   

Mentions for Courtney R Furnival

Publications

Us Patents

Integrated Packaged Having Magnetic Components

US Patent:
7307341, Dec 11, 2007
Filed:
Jan 10, 2006
Appl. No.:
11/329934
Inventors:
Donald Humbert - Santa Clara CA,
Courtney R. Furnival - Lake Arrowhead CA,
Assignee:
IXYS Corporation - Santa Clara CA
International Classification:
H01L 23/34
US Classification:
257728, 257678, 257684, 257690, 257693, 257723
Abstract:
A packaged device is obtained using an innovative package approach that allows integration of miniature planar magnetics into standard low-cost semiconductor packages (BGA, PDIP, SOIC, etc. ) with electronic and electrical components, where those components can be C&W and/or SMD types. The packaged device includes a planar magnetic substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon. A magnetic component is provided in the substrate. A package material provided at least partly around the substrate and the magnetic component to protect the substrate and magnetic component. The magnetic component is an inductor or transformer. The packaged device further includes at least one semiconductor component provided on the first dielectric layer.

Semiconductor Package With Embedded Magnetic Component And Method Of Manufacture

US Patent:
8094458, Jan 10, 2012
Filed:
Mar 23, 2009
Appl. No.:
12/383468
Inventors:
Courtney R. Furnival - Lake Arrowhead CA,
Assignee:
Microsemi Corporation - Aliso Viejo CA
International Classification:
H05K 1/18
H01F 5/00
US Classification:
361761, 29832, 29846, 174260, 257678, 257723, 336200, 336232
Abstract:
A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate.

Power Train Partition For 10 Horsepower Motor Controller

US Patent:
5914577, Jun 22, 1999
Filed:
Apr 18, 1997
Appl. No.:
8/845078
Inventors:
Courtney Furnival - Temecula CA
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H05K 702
US Classification:
318538
Abstract:
A power train assembly for delivering electrical power to a driven device such as a motor is constructed of an IMS board and a PCB. A considerably smaller and standardized IMS board is obtained by limiting the components on the IMS board to include only inverter transistors, input rectifiers and a thermistor. The only other component is a connector for effecting a simple vertical connection to the overhead printed circuit board which contains the device control and drive components. The power train assembly realizes surface board savings on the order of between 40% to 50% in the IMS. The height of the IMS is also reduced, which makes it possible to replace the usual potting compound with a thin surface coating.

Pressure Assembled Motor Cube

US Patent:
6081039, Jun 27, 2000
Filed:
Dec 5, 1997
Appl. No.:
8/985508
Inventors:
Courtney Furnival - Temecula CA
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H01L 2352
US Classification:
257785
Abstract:
A pressure assembled power module is provided with first and second die, the first and second die being stacked atop one another and sandwiched between first and second conductive sheets, where the die are separated by a relatively flat central conductive lead. Integral to the central conductive lead are spring elements which bias the die against both the conductive sheets and the central conductive lead. Consequently, electrical and thermal interconnections are achieved between semiconductor devices and between the semiconductor devices and a heat sink or substrate.

High Power Semiconductor Device Module With Low Thermal Resistance And Simplified Manufacturing

US Patent:
5408128, Apr 18, 1995
Filed:
Sep 15, 1993
Appl. No.:
8/122052
Inventors:
Courtney Furnival - Temecula CA
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H01L 2348
H01L 2940
US Classification:
257690
Abstract:
A high power semiconductor module has an IMS substrate which carries the semiconductor die to be interconnected within the housing. A terminal board carries the terminals for connection to the substrate with a snap connection, with the terminals positioned above respective solder pads on the IMS board. Integral breakaway pins on the terminal board position the board relative to the IMS during soldering. A central opening in the terminal board allows the loading of a soft silicone into the space between the IMS substrate and bottom of the terminal board. The terminal board has bosses extending upwardly over its top surface adjacent each power terminal, and the bottom of a top housing assembly has ribs which enclose the bosses on the top of the terminal board. A silicone glue is poured onto the top of the terminal board and into the spaces between and around the bosses. The ribs project into this glue to provide a good insulation seal around the power terminals projecting through the terminal board.

Adaptable Planar Module

US Patent:
6147869, Nov 14, 2000
Filed:
Nov 20, 1998
Appl. No.:
9/197078
Inventors:
Courtney Furnival - Temecula CA
Assignee:
International Rectifier Corp. - El Segundo CA
International Classification:
H05K 720
US Classification:
361719
Abstract:
An Adaptable Planar Module (APM) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is formed in an opening in a support base and extends at or below a bottom surface of a base to allow for thermal contact with a heatsink. A circuit board for supporting and interconnecting lower power devices is mounted above and spaced from the support base and has an opening therein which is located above the IMS. The circuit board has bonding pads which are electrically connected to the low power devices. Bonding wires provide an electrical connection between the bonding pad of the printed circuit board and the power devices on the IMS substrate. Integral or procured terminals are also provided for external connections. Additional circuit boards may also be provided in the module and arranged co-planar with or above the first circuit board.

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