Darin W Peterson, 45Boise, ID

6673692, Jan 6, 2004

Aug 30, 2001

09/945315

Darin L. Peterson - Boise ID

Micron Technology, Inc. - Boise ID

H01L 2176

438401

Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device comprises a microelectronic die having an integrated circuit, a hidden marking layer superimposed relative to the die, and a cover layer over the hidden marking layer. The hidden marking layer can be applied to a surface of the die and/or a surface of a package encasing at least a portion of the die such that in either situation the hidden marking layer is superimposed relative to the die. In one embodiment, the hidden marking layer is a material that (a) can be removed by a scribing energy (e. g. , incinerated or otherwise consumed), and/or (b) is at least partially opaque to an exposure energy. The hidden marking layer can also have a depression defining an identification mark through which at least a portion of the exposure energy can penetrate.

6731016, May 4, 2004

Jun 25, 2002

10/183192

Darin L. Peterson - Boise ID

Micron Technology, Inc. - Boise ID

H01L 23544

257797, 438401

Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device includes a first exterior surface, a second exterior surface having a contact array with a plurality of contacts, and an integrated circuit coupled to the contacts. The microelectronic device can further include a marking medium applied to the first exterior surface of the device. In one embodiment, the marking medium includes a contrast film section having an underlying contrast film applied to the first exterior surface and an outer contrast film applied to the underlying contrast film. In another embodiment, the marking medium can include a contrast film section having only an outer contrast film applied to the first exterior surface of the device. The outer contrast film can have a high optical contrast with respect to the underlying contrast film or the first exterior surface of the device, and the outer contrast film can be changed by a selected radiation so that a portion of the outer contrast film can be selectively removed from the device.

6744144, Jun 1, 2004

Feb 27, 2003

10/377552

Darin L. Peterson - Boise ID

Micron Technology, Inc. - Boise ID

H01L 23544

257797

Method and apparatus for marking microelectronic devices, such as bare microelectronic dies and packaged devices, to enhance the identification and automatic handling of wafers, dies and packaged devices. In one embodiment, a microelectronic device comprises a microelectronic die having an integrated circuit, a hidden marking layer superimposed relative to the die, and a cover layer over the hidden marking layer. The hidden marking layer can be applied to a surface of the die and/or a surface of a package encasing at least a portion of the die such that in either situation the hidden marking layer is superimposed relative to the die. In one embodiment, the hidden marking layer is a material that (a) can be removed by a scribing energy (e. g. , incinerated or otherwise consumed), and/or (b) is at least partially opaque to an exposure energy. The hidden marking layer can also have a depression defining an identification mark through which at least a portion of the exposure energy can penetrate.

6866470, Mar 15, 2005

Nov 1, 2001

10/035375

Darin L. Peterson - Boise ID, US
Michael R. Slaughter - Boise ID, US
Keith P. McCall - Meridian ID, US

Micron Technology, Inc. - Boise ID

B65G059/06

414801, 221222, 221297, 4147887, 4147981

Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

6921860, Jul 26, 2005

Mar 18, 2003

10/391725

Darin L. Peterson - Boise ID, US
Richard W. Wensel - Boise ID, US
Choon Kuan Lee - Singapore, SG
James A. Faull - Boise ID, US

Micron Technology, Inc. - Boise ID

H01L023/552

174 522, 22818022, 257780, 26437211

The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.

7066708, Jun 27, 2006

Oct 19, 1999

09/420659

Darin L. Peterson - Boise ID, US
Michael R. Slaughter - Boise ID, US
Keith P. McCall - Meridian ID, US

Micron Technology, Inc. - Boise ID

B65G 59/06

4147981, 221222, 221237, 4147957, 414907

Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

7086562, Aug 8, 2006

Nov 1, 2001

09/999032

Darin L. Peterson - Boise ID, US
Michael R. Slaughter - Boise ID, US
Keith P. McCall - Meridian ID, US

Micron Technology, Inc. - Boise ID

B65G 59/00

221297, 221222, 221237

Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element.

2002003, Mar 21, 2002

Nov 1, 2001

09/999335

Darin Peterson - Boise ID, US
Michael Slaughter - Boise ID, US
Keith McCall - Meridian ID, US

B65G059/06
B65G057/30

414/798100, 414/795300

Devices and methods for holding a tray stack having a plurality of trays configured to carry and store microelectronic devices. Several devices in accordance with the present invention are particularly applicable to carrying a stack of JEDEC trays that have been loaded with a plurality of microelectronic devices. In one embodiment, the device is a tray retainer including a guide structure configured to allow the tray stack to move in a direction of a load/unload path, and to restrict lateral movement of the tray stack with respect to the load/unload path. The guide structure can have a first end, a second end, and an opening at least proximate to the second end. The guide structure, for example, can have first and second channel sections extending in the direction of the load/unload path. The second channel section can also face the first channel section. The tray retainer can also include a cross-member and a moveable retaining element. The cross-member can extend transverse to the load/unload path at least partially across a first region of the guide structure between the first and second channel sections. The cross-member can be spaced apart from the opening toward the first end of the guide structure. The moveable retaining element is positioned at a second region of the guide structure spaced apart from the cross-member. The retaining element can move between a storage position in which it obstructs the load/unload path and a load/unload position in which it does not obstruct the load/unload path.