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Xi GuoLas Vegas, NV

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Las Vegas, NV   

Portland, OR   

Beaverton, OR   

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Medicine Doctors

Xi Guo

Specialties:
Neurology
Work:
Greater Ann Arbor Nrlgy AssocNeurology Associates Southeast
7305 Grand Riv Rd STE 550, Brighton, MI 48114
810-5345599 (phone) 810-5345999 (fax)
Education:
Medical School
Beijing Med Univ, Beijing City, Beijing, China
Graduated: 1987
Procedures:
Lumbar Puncture, Neurological Testing, Sleep and EEG Testing
Conditions:
Alzheimer's Disease, Bell's Palsy, Carpel Tunnel Syndrome, Dementia, Diabetic Peripheral Neuropathy, Epilepsy, Hemorrhagic stroke, Insomnia, Intracranial Injury, Ischemic Stroke, Migraine Headache, Multiple Sclerosis (MS), Myasthenia Gravis (MG), Obstructive Sleep Apnea, Parkinson's Disease, Peripheral Nerve Disorders, Restless Leg Syndrome, Tempromandibular Joint Disorders (TMJ), Tension Headache, Transient Cerebral Ischemia
Languages:
English
Description:
Dr. Guo graduated from the Beijing Med Univ, Beijing City, Beijing, China in 1987. She works in Brighton, MI and specializes in Neurology. Dr. Guo is affiliated with St Joseph Mercy Ann Arbor.

Xi Guo resumes & CV records

Resumes

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Xi Guo

Xi Guo Photo 26

Xi Guo

Publications & IP owners

Us Patents

Electronic Device Package On Package (Pop)

US Patent:
2021003, Feb 4, 2021
Filed:
Jul 2, 2016
Appl. No.:
16/306884
Inventors:
Jiun Hann Sir - Gelugor, MY
Min Suet Lim - Bayan Lepas, MY
Xi Guo - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/367
H01L 23/498
H01L 25/065
H01L 21/48
Abstract:
Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.

Cooling Solution For A Dock

US Patent:
2020015, May 21, 2020
Filed:
Oct 21, 2019
Appl. No.:
16/658827
Inventors:
- Santa Clara CA, US
Mark J. Gallina - Hillsboro OR, US
Catharina Biber - Portland OR, US
Xi Guo - Hillsboro OR, US
Gabriele C. Garbarino - Portland OR, US
International Classification:
G06F 1/20
G06F 1/16
Abstract:
The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

Cooling Solution For A Performance Dock

US Patent:
2019001, Jan 10, 2019
Filed:
Mar 19, 2018
Appl. No.:
15/924796
Inventors:
- Santa Clara CA, US
Mark J. Gallina - Hillsboro OR, US
Catharina Biber - Portland OR, US
Xi Guo - Hillsboro OR, US
Gabriele C. Garbarino - Portland OR, US
International Classification:
G06F 1/20
G06F 1/16
Abstract:
The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

Flexible Heat Spreader

US Patent:
2018009, Mar 29, 2018
Filed:
Sep 29, 2016
Appl. No.:
15/280746
Inventors:
Bo Qiu - Hillsboro OR, US
Xi Guo - Hillsboro OR, US
James C. Raupp - Hillsboro OR, US
Michael Ahrens - San Jose CA, US
David Pidwerbecki - Hillsboro OR, US
Steven J. Lofland - Portland OR, US
George H. Daskalakis - Forest Grove OR, US
Stacy L. Yee - Portland OR, US
Mark MacDonald - Beaverton OR, US
International Classification:
H05K 7/20
H05K 5/00
H05K 5/02
G06F 1/20
G06F 1/16
H05K 1/02
H05K 1/18
Abstract:
Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

Cooling Solution For A Dock

US Patent:
2017018, Jun 29, 2017
Filed:
Dec 24, 2015
Appl. No.:
14/998063
Inventors:
- Santa Clara CA, US
Mark J. Gallina - Hillsboro OR, US
Catharina Biber - Portland OR, US
Xi Guo - Hillsboro OR, US
Gabriele C. Garbarino - Portland OR, US
Assignee:
INTEL CORPORATION - Santa Clara CA
International Classification:
G06F 1/20
G06F 1/16
Abstract:
The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

Possible Relatives

Donglin Guo  Elena Guo  Fangfang Guo  Fei Guo  Frank T Guo  Guang J Guo  Xi W Li  Xi Liu  Xi H Pan 

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