Lynn K Wiese, 763534 Butcher Dr, Santa Clara, CA 95051

6987915, Jan 17, 2006

Mar 18, 2004

10/803804

Stephen P. Merrick - San Jose CA, US
Lynn Wiese - Santa Clara CA, US
Kalberer Martin - Redwood City CA, US
John Zhang - Santa Clara CA, US

G02B 6/26

385 52, 385 33, 385147, 356123, 356609

An embodiment described herein provides a technique to determine a focus point of a lense. Light is directed from a light source through the lense and onto a target surface. The light source and target surface may be positioned on opposite sides of the lense. The target surface may correspond to the position of where a primary light source for the particular application is to be located. A reflection passing through the lense from the reflective target surface may be located. A determination is then made as to whether the position where the reflection was located also could also corresponds to a focus point for the lense, if the primary light source was to be located at or near the target surface.

7223964, May 29, 2007

May 30, 2003

10/449763

Lynn Karl Wiese - Santa Clara CA, US
Matthew Glenn Peters - Menlo Park CA, US

JDS Uniphase Corporation - Milpitas CA

H01J 5/02
H01J 40/14

250239, 250214 R

A storage information system is disclosed for keeping archival information on the individual active optoelectronic components that are used in telecommunication equipment. The system involves enclosing a nonvolatile memory chip inside the hermetic package of the active optoelectronic component. A memory chip is used to keep the relevant information about the active optoelectronic component such as serial number, part number and specifications. Sensors can also be included inside the hermetic package to monitor the operating conditions of the optoelectronic component. The information system is capable of storing information that is relevant to the component reliability such as: hours of operation, maximum current or voltage, and maximum temperature. The information storage system has the advantage that the archived information is intimately associated with the optoelectronic component thereby lessening the likelihood that information is lost or tampered with. The information system eliminates need for keeping paper records on individual optoelectronic components.

7540188, Jun 2, 2009

May 1, 2006

11/380985

Lynn Karl Wiese - Santa Clara CA, US
Earl M. Jensen - San Jose CA, US

G01D 11/24

73431, 324156

A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway.

7555948, Jul 7, 2009

May 5, 2006

11/381992

Lynn Karl Wiese - Santa Clara CA, US
Earl M. Jensen - San Jose CA, US

G01D 11/24

73431

A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway. Sensors may be located on the exterior of the process condition measuring device with conductive leads extending to shielded electronic components.

7698952, Apr 20, 2010

Sep 25, 2007

11/861119

Wayne G. Renken - San Jose CA, US
Mei H. Sun - Los Altos CA, US
Aron Abramowski Mason - San Mateo CA, US
Lynn Karl Wiese - Santa Clara CA, US

KLA-Tencor Corporation - San Jose CA

G01L 1/00

73780

At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.

8232541, Jul 31, 2012

Jul 8, 2009

12/499723

Lynn K. Wiese - Santa Clara CA, US
Nikhil Kelkar - Saratoga CA, US
Viraj Patwardhan - Milpitas CA, US

Intersil Americas Inc. - Milpitas CA

G02B 27/00
H01J 40/14

250551, 250239

An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.

8324602, Dec 4, 2012

Dec 21, 2009

12/643831

Lynn K. Wiese - Santa Clara CA, US
Nikhil Kelkar - Saratoga CA, US
Viraj Patwardhan - Milpitas CA, US

Intersil Americas Inc. - Milpitas CA

G02B 27/00
H01J 40/14

250551, 250239

An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.

8564012, Oct 22, 2013

Mar 27, 2012

13/431466

Seshasayee S. Ankireddi - San Jose CA, US
Lynn K. Wiese - Santa Clara CA, US

Intersil Americas LLC - Milpitas CA

H01L 33/00

257100, 257 81, 257 88, 257 98, 257 99, 257744, 257745, 257787, 257E21502, 257E21503, 257E33055, 257E33059, 257E33065, 257E33066, 438 25, 438 26, 438 28, 438106, 438110, 438112, 438118, 438124, 438127

A method for manufacturing an optoelectronic apparatus includes attaching bottom surfaces of first and second packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e. g. , a tape) so that there is a space between the first and second POSDs. An opaque molding compound is molded around portions of the first and second POSDs attached to the carrier substrate, so that peripheral surfaces of the first POSD and the second POSD are surrounded by the opaque molding compound, the space between the first and second POSDs is filled with the opaque molding compound, and the first and second POSDs are attached to one another by the opaque molding compound. The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the first and second POSDs are exposed. A window for each of the POSDs is formed during the molding process or thereafter.