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Lynn K Wiese, 713534 Butcher Dr, Santa Clara, CA 95051

Lynn Wiese Phones & Addresses

3534 Butcher Dr, Santa Clara, CA 95051   

Cadiz, CA   

Davis, CA   

6560 King Way, Dublin, CA 94568   

6560 King Way, Dublin, CA 94568   

7317 Parkwood Cir, Dublin, CA 94568   

Pleasanton, CA   

Languages

English

Mentions for Lynn K Wiese

Professional Records

Medicine Doctors

Lynn Wiese Photo 1

Lynn Wiese, Palo Alto CA - LMFT

Specialties:
Marriage & Family Therapy
Address:
208 Parkside Dr, Palo Alto, CA 94306
650-8563761 (Phone)
Languages:
English

Resumes

Resumes

Lynn Wiese Photo 2

Plant Controller At Umicore

Position:
Plant Controller at Umicore
Location:
Miami, Oklahoma
Industry:
Accounting
Work:
Umicore since Jun 2010
Plant Controller
Vesuvius USA 2002 - Jun 2010
Nafta Costing Manager
Vesuvius USA 1992 - 2002
Regional Controller
Vesuvius USA 1990 - 1992
Cost Accountant
Revereware 1980 - 1990
Manager of General Accounting
Oak Industires, Inc. 1979 - 1980
Cost and Budget Accountant
Miles Laboratories 1976 - 1979
Cost Accountant
Education:
University of Illinois Springfield 1974 - 1976
Bachelor of Science, Accounting
Lynn Wiese Photo 3

Engineer At Intersil

Position:
Staff Engineer at Intersil
Location:
San Francisco Bay Area
Industry:
Semiconductors
Work:
Intersil - Intersil, Milpitas since Aug 2007
Staff Engineer
SensArray (now KLA) Nov 2004 - Aug 2007
Sr. Product Development Engineer
Silicon Light Machines - Sunnyvale, CA Apr 2004 - Oct 2004
Program Manager -HID device
FO Pack - Santa Clara, CA 2003 - 2004
Engineering Manager - Optoelectronic modules
/Infineon - Cupertino/San Jose 1999 - 2001
Packaging Engineering Manager
Siemens Components - Cupertino 1984 - 2001
Package Engineering Manager
Siemens Microelectronics 1984 - 2001
Package Engineering Manager
National Semiconductor 1974 - 1980
QA Engineering Manager
Education:
University of California, Santa Barbara 1965 - 1969
Bachelor's, Physics

Business Records

Name / TitleCompany / ClassificationPhones & Addresses
Lynn Wiese
Owner
Wiese, Lynn Ma Lmfc 4151 Middlefield Rd, Palo Alto, CA 94303

Publications

Us Patents

Apparatus And Technique For Determining Placement Of Optical Components In Optical Communication Applications

US Patent:
6987915, Jan 17, 2006
Filed:
Mar 18, 2004
Appl. No.:
10/803804
Inventors:
Stephen P. Merrick - San Jose CA,
Lynn Wiese - Santa Clara CA,
Kalberer Martin - Redwood City CA,
John Zhang - Santa Clara CA,
International Classification:
G02B 6/26
US Classification:
385 52, 385 33, 385147, 356123, 356609
Abstract:
An embodiment described herein provides a technique to determine a focus point of a lense. Light is directed from a light source through the lense and onto a target surface. The light source and target surface may be positioned on opposite sides of the lense. The target surface may correspond to the position of where a primary light source for the particular application is to be located. A reflection passing through the lense from the reflective target surface may be located. A determination is then made as to whether the position where the reflection was located also could also corresponds to a focus point for the lense, if the primary light source was to be located at or near the target surface.

Method For Producing Displays And Modular Components

US Patent:
4890383, Jan 2, 1990
Filed:
Apr 14, 1989
Appl. No.:
7/338720
Inventors:
Marvin Lumbard - Los Gatos CA
Lynn K. Wiese - Santa Clara CA
Assignee:
Simens Corporate Research & Support, Inc. - Iselin NJ
International Classification:
H01L 2156
H05B 4300
US Classification:
29841
Abstract:
Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

Method Of Making A Semiconductor Chip

US Patent:
5344794, Sep 6, 1994
Filed:
Sep 29, 1993
Appl. No.:
8/128424
Inventors:
David Whitney - San Jose CA
Lynn Wiese - Santa Clara CA
Assignee:
Siemens Components, Inc. - Iselin NJ
International Classification:
H01L 2160
US Classification:
437209
Abstract:
An optically-triggered silicon controlled rectifier (SCR) device (21) mounted on a lead frame (34). The SCR device contains a cathode layer (24), an optical gate or control layer (23), and an anode layer (31) formed on a semiconductor substrate (22). The device is soldered onto a pedestal (33) formed on the lead frame. To connect the device to the lead frame, solder is deposited upon the anode layer and the solder fixes the anode layer to the pedestal on the lead frame. The pedestal may be formed by etching or stamping a depression (35) in the lead frame. The device is centered on the pedestal such that the edges of the device are located adjacent the depression, and are spaced from the lead frame.

Optical Semiconductor Device Having Plural Encapsulating Layers

US Patent:
5986317, Nov 16, 1999
Filed:
Sep 29, 1995
Appl. No.:
8/537063
Inventors:
Lynn Wiese - Santa Clara CA
Assignee:
Infineon Technologies Corporation - San Jose CA
International Classification:
H01L 3300
H01L 310203
H01L 330232
H01L 2329
US Classification:
257433
Abstract:
A data access arrangement (DAA) that includes a substrate and an optically-active component disposed on the substrate. The component is encapsulated with a radiation-transmissive material to form an optical medium. The DAA also includes a layer of opaque material disposed around the substrate and the optically-active component so that the substrate and the component are sealed from the outside environment. A lead frame is attached to the substrate that extends through and beyond the opaque material layer to enable electrical contact with the substrate and the component.

Modular Surface Mount Component For An Electrical Device Or Led's

US Patent:
RE36614, Mar 14, 2000
Filed:
Jul 17, 1998
Appl. No.:
9/120591
Inventors:
Marvin Lumbard - Los Gatos CA
Lynn K. Wiese - Santa Clara CA
Assignee:
Infineon Technologies Corporation - San Jose CA
International Classification:
H01L 3300
US Classification:
313500
Abstract:
Processing techniques for various surface mount modular components provide various structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

Localized Illumination Device

US Patent:
5785404, Jul 28, 1998
Filed:
Jun 29, 1995
Appl. No.:
8/496821
Inventors:
Lynn Wiese - Santa Clara CA
Assignee:
Siemens Microelectronics, Inc. - Cupertino CA
International Classification:
F21V 704
US Classification:
362 32
Abstract:
Illumination apparatus for use in localized illumination applications, such as an automobile dashboard. The apparatus includes a light emitting diode mounted on a metallized circuit board; a TIR lens mounted over the light emitting diode to collect light emitted from the light emitting diode and to direct the light in a single direction; and a light pipe disposed over the light emitting diode and the TIR lens. The light pipe has walls extending from the circuit board to a plane above the circuit board such that directed light from the TIR lens is channeled through the light pipe to the plane. The apparatus can also include a cover disposed in the plane over the light pipe. The cover may be integrally molded to the light pipe and have an icon configured therein, such that the icon is illuminated by the light from the light emitting diode. A lens may also be placed over the cover of the light pipe to create a focused image of the icon, thereby maximizing the light emitted by the light emitting diode at the focused image.

A Modular Surface Mount Component For An Electrical Device Or Led's

US Patent:
4843280, Jun 27, 1989
Filed:
Jan 15, 1988
Appl. No.:
7/144370
Inventors:
Marvin Lumbard - Los Gatos CA
Lynn K. Wiese - Santa Clara CA
Assignee:
Siemens Corporate Research & Support, Inc. - Iselin NJ
International Classification:
H01L 3300
US Classification:
313500
Abstract:
Processing techniques for various surface mount modular components provide various structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

Semiconductor Device And Lead Frame Combination

US Patent:
5506425, Apr 9, 1996
Filed:
Dec 13, 1994
Appl. No.:
8/355452
Inventors:
David Whitney - San Jose CA
Lynn Wiese - Santa Clara CA
Assignee:
Siemens Components, Inc. - Iselin NJ
International Classification:
H01L 2774
H01L 31111
US Classification:
257177
Abstract:
An optically-triggered silicon controlled rectifier (SCR) device (21) mounted on a lead frame (34). The SCR device contains a cathode layer (24), an optical gate or control layer (23), and an anode layer (31) formed on a semiconductor substrate (22). The device is soldered onto a pedestal (33) formed on the lead frame. To connect the device to the lead frame, solder is deposited upon the anode layer and the solder fixes the anode layer to the pedestal on the lead frame. The pedestal may be formed by etching or stamping a depression (35) in the lead frame. The device is centered on the pedestal such that the edges of the device are located adjacent the depression, and are spaced from the lead frame.

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