Michael C Cibulsky, 48Ashburn, VA

4579772, Apr 1, 1986

Dec 19, 1983

6/562664

Anilkumar C. Bhatt - Endicott NY
Michael J. Cibulsky - Binghamton NY
Donald E. Doran - New Milford PA
Lawrence J. Hugaboom - Nichols NY
James W. Knight - Endicott NY

International Business Machines Corporation - Armonk NY

B32B 1702
B32B 1704

428229

Woven glass cloth and method of its manufacture suitable for use as a resin-impregnated substrate for printed circuits in which the major dimension or transverse axis of the elliptical warp yarns exceeds a predetermined fraction of that dimension of the fill yarns of the woven cloth. Multi-filament warp yarns are typically subjected to tensile stress during weaving and firing such that the yarn compaction prevents the thorough impregnation by a resin. The result is that voids are maintained along the innermost filaments of the yarn. These voids, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.

5378306, Jan 3, 1995

Feb 7, 1994

8/192736

Michael J. Cibulsky - Binghamton NY
Konstantinos I. Papathomas - Endicott NY
William J. Summa - Endwell NY
David W. Wang - Vestal NY
Patrick R. Zippetelli - Endwell NY

International Business Machines Corporation - Armonk NY

B44C 122
C23F 100

156630

A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.

5288542, Feb 22, 1994

Jul 14, 1992

7/913101

Michael J. Cibulsky - Binghamton NY
Konstantinos I. Papathomas - Endicott NY
William J. Summa - Endwell NY
David W. Wang - Vestal NY
Patrick R. Zippetelli - Endwell NY

International Business Machines Corporation - Armonk NY

B32B 0300

428209

A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.

5143756, Sep 1, 1992

Aug 27, 1990

7/572554

Michael J. Cibulsky - Binghamton NY
Kostas Papathomas - Endicott NY
George P. Schmitt - Vestal NY

International Business Machines Corporation - Armonk NY

B05D 302

427386

A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally advancing the prereacted product to the desired state of crosslinking to thereby form the prepreg.