Rafael Hidalgo Hidalgo, 6345 Willow St #405, Springfield, MA 01103
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45 Willow St #405, Springfield, MA 01103 413-7343462
Northampton, MA
Somerville, MA
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Us Patents
Automated Wafer Lapping System
US Patent:
5679055, Oct 21, 1997
Filed:
May 31, 1996
Appl. No.:
8/653666
Inventors:
George W. Greene - Burlington MA
Peter D. Albrecht - Spartanburg SC
Kenneth D. Strittmatter - Mauldin SC
Rafael Hidalgo - Greenville SC
Peter D. Albrecht - Spartanburg SC
Kenneth D. Strittmatter - Mauldin SC
Rafael Hidalgo - Greenville SC
Assignee:
MEMC Electronic Materials, Inc. - St. Peters MO
International Classification:
B24B 3702
US Classification:
451 10
Abstract:
An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.
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