Ralph H Schaeffer, 93815 E State St, Boise, ID 83712

6924653, Aug 2, 2005

Aug 26, 2002

10/228116

Ralph Schaeffer - Boise ID, US
Brett Crump - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R031/02

324754, 324762

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods-of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

6952109, Oct 4, 2005

Sep 2, 2004

10/933788

Ralph Schaeffer - Boise ID, US
Brett Crump - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R031/02

324754, 324765

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

6972580, Dec 6, 2005

Sep 2, 2004

10/934199

Ralph Schaeffer - Boise ID, US
Brett Crump - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R031/00

324754, 324762

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

7145355, Dec 5, 2006

May 19, 2005

11/133850

Ralph Schaeffer - Boise ID, US
Brett Crump - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R 31/02

324754, 324762

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

7170304, Jan 30, 2007

Jul 28, 2005

11/192147

Ralph Schaeffer - Boise ID, US
Brett Crump - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R 31/02

324754, 324762

Microelectronic components are commonly tested with probe cards. Certain aspects of probes, probe cards, and methods of testing microelectronic components are discussed herein. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, an actuator is actuated to move the probe from a first probe arrangement to a second probe arrangement.

2007004, Mar 1, 2007

Sep 1, 2005

11/217747

Ralph Schaeffer - Boise ID, US
Andrew Krivy - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R 31/26

324765000

Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces are disclosed. An apparatus in accordance with one embodiment includes a first support member configured to releasably carry a microfeature workpiece, a second support member positioned proximate to the first support member and configured to carry an electrical testing device, wherein at least one of the first and second support members is movable toward and away from the other. The apparatus can further include a signal source (e.g., radiation source) positioned proximate to the support member, and a signal sensor (e.g., a radiation sensor) positioned at least proximate to the first support member and the signal source. The signal sensor can be configured to received at least a portion of the signal directed by the signal source and passing proximate to the first support member. Accordingly, the signal source and signal sensor can be used to detect obstructions carried by the first support member and/or the microfeature workpiece.

6446021, Sep 3, 2002

Feb 27, 1998

09/032621

Ralph H. Schaeffer - Boise ID

Micron Technology, Inc. - Boise ID

G06F 1900

702118, 702 81, 702 84, 700121

A system and method that provides various forms of graphic representations of test results of manufacturing process runs which can readily be shared with multiple users of the system is disclosed. A method for reporting a test process of a plurality of cells, wherein the test process is performed in a series of runs is disclosed. The method includes four steps. First, data regarding the test process for the plurality of cells is gathered. The data is accumulated over the series of runs. Next, the data is characterized to create a set of selected information. The set of selected information includes a subset of the data regarding the test process for the plurality of cells. The method also includes the steps of generating a user-consumable output of the set of selected information, and providing access to the data, the set of selected information, and the user-consumable output. The step of generating a user consumable output includes generating a map or generating a graph.