BackgroundCheck.run
Search For

Robert J Teichmann, 6919 Brook Valley Rd, Towaco, NJ 07082

Robert Teichmann Phones & Addresses

19 Brook Valley Rd, Towaco, NJ 07082    973-4025880   

Waretown, NJ   

Belleville, NJ   

19 Brook Valley Rd, Towaco, NJ 07082    973-8656172   

Work

Position: Clerical/White Collar

Education

Degree: High school graduate or higher

Emails

Mentions for Robert J Teichmann

Robert Teichmann resumes & CV records

Resumes

Robert Teichmann Photo 23

Principal Consultant

Location:
109a Linn Dr, Verona, NJ 07044
Industry:
Cosmetics
Work:
Rjt Consulting
Principal Consultant
New Avon Mar 2016 - Dec 2017
Manager of Product Safety, Quality and Testing
Avon 2007 - Mar 2016
Manager of Product Safety, Quality and Testing
Avon 2006 - 2007
Us Supply Chain Manager
Avon 2003 - 2006
Global Supply Chain Manager
Avon 1999 - 2003
Jewelry Quality and Testing Manager
Avon 1993 - 1999
R and D Engineer
Servometer 1990 - 1993
Plating Manager
Potters Industries 1983 - 1988
Conductive Products R and D Supervisor
Sel Rex Div Enthone 1978 - 1983
R and D Chemist
Education:
Stevens Institute of Technology 1981 - 1983
Master of Science, Masters
Lehigh University 1972 - 1977
Bachelors, Bachelor of Science, Chemistry
Lycée De Sèvres
Metuchen High School
Skills:
Product Development, R&D, Jewelry, Supply Chain, Consumer Products, Quality System, Supply Management, Quality Management, Global Sourcing, Manufacturing, Production Planning, Sourcing, Process Improvement, Electroplating, Materials, Plating, Particle, Watches, Supply Chain Management, Cross Functional Team Leadership, Quality Center, Xrf, Electroforming, Raw Materials, Retail, Spectroscopy, Packaging, Research and Development, China Sourcing, Supplier Management, Jewelry Manufacturing, Jewelry Engineering, Small Particle Plating, Management, Continuous Improvement
Languages:
English
French
Robert Teichmann Photo 24

Robert Teichmann

Industry:
Investment Banking
Work:
Pdg Professional Development Jan 1993 - Feb 2006
Recruiter
Hr Global Solutions Latam May 1987 - Dec 1992
Analyst
United States May 1987 - Dec 1992
Nyu
Robert Teichmann Photo 25

Robert Teichmann

Publications & IP owners

Us Patents

Galvanically Compatible Conductive Filler Useful For Electromagnetic Shielding And Corrosion Protection

US Patent:
5286416, Feb 15, 1994
Filed:
Sep 22, 1992
Appl. No.:
7/948666
Inventors:
Robert J. Teichmann - Towaco NJ
James F. Walther - Mountain Lakes NJ
Andrew M. Wasowicz - West Patterson NJ
Assignee:
Potters Industries Inc. - Parsippany NJ
International Classification:
B32B 516
US Classification:
252512
Abstract:
Composite particles designed as a filler for gaskets, caulking compounds and plastics in general. The unique properties are obtained by using a soft metal core galvanically similar to the metal the sealant will be in contact with. The oxide surface of the core metal is typically breached by a multitude of small hard semiconductive or conductive particles, thus making low particle-to-particle contact resistance through the body.

Electroformed Hollow Jewelry

US Patent:
5891317, Apr 6, 1999
Filed:
Feb 4, 1997
Appl. No.:
8/796021
Inventors:
Robert J. Teichmann - Towaco NJ
Dennis A. Cupolo - Suffern NY
Robert H. China - Waldwick NJ
Harold Pahlck - Waldwick NJ
Assignee:
Avon Products, Inc. - New York NY
International Classification:
C25D 102
US Classification:
205 73
Abstract:
A method of forming a hollow metallic article, comprising the following steps: (a) applying a layer of base metal to a fusible alloy mandrel; (b) applying a layer of precious metal to the layer of base metal; (c) applying a third layer of a non-metallic protective coating to the layer of precious metal; and (d) melting out the fusible alloy mandrel. Hollow articles formed by this method are also disclosed.

Electroplating Tin And Tin Alloys And Baths Therefor

US Patent:
4347107, Aug 31, 1982
Filed:
Apr 2, 1981
Appl. No.:
6/250373
Inventors:
Robert J. Teichmann - Belleville NJ
Linda J. Mayer - Denville NJ
Assignee:
Hooker Chemicals & Plastics Corp. - Warren MI
International Classification:
C25D 360
US Classification:
204 44
Abstract:
Improved electroplating bath for depositing bright, metallic tin wherein divalent tin, in the form of stannous sulfate or fluoroborate, is present in conjunction with sulfuric or fluoroboric acid, brighteners including an aromatic amine and an aliphatic aldehyde, a polyalkylene ether surfactant, and an aromatic sulfonic acid to ensure bath stability as well as the requisite brightness. The divalent tin-containing electroplating bath may also be provided with copper or rhodium salts to achieve codeposition of tin with at least one of these alloying metals. The method of utilizing such divalent tin electroplating baths to plate substrates with bright metallic tin is also described and claimed.

Process And Composition For The Electrodeposition Of Tin And Tin Alloys

US Patent:
4381228, Apr 26, 1983
Filed:
Jun 16, 1981
Appl. No.:
6/274084
Inventors:
Robert J. Teichmann - Belleville NJ
Linda J. Mayer - Denville NJ
Assignee:
Occidental Chemical Corporation - Warren MI
International Classification:
C25D 332
C25D 360
US Classification:
204 44
Abstract:
An electroplating bath for the high speed deposition of bright metallic tin utilizing tin fluoroborate and sulfuric acid as the electrolyte; wherein, in addition to certain other additives, the bath contains a perfluoroalkyl sulfonate wetting agent to promote anode corrosion. Brighteners used in the system include aromatic amines and aliphatic aldehydes. For certain purposes it may be advantageous to include boric acid as part of the electrolyte; and, in other instances, to use an aromatic sulfonic acid to enhance bath stability and brightness. The method for utilizing a bath containing tin fluoroborate in a sulfuric acid matrix containing these perfluoroalkyl sulfonate wetting agents is also described.

Nickel Particle Plating System

US Patent:
4857233, Aug 15, 1989
Filed:
May 26, 1988
Appl. No.:
7/199196
Inventors:
Robert J. Teichmann - Belleville NJ
James F. Walther - Mountain Lakes NJ
Mulhall Robert C. - Verona NJ
Assignee:
Potters Industries, Inc. - Carlstadt NJ
International Classification:
H01B 116
H01B 122
US Classification:
252513
Abstract:
A nickel particle plating system in which a multiplicity of minute nickel spheres are provided with a heavy copper coating and then a comparatively thin silver coating. The copper coating is at least about 20 percent by weight of the shpere, and the silver coating has a maximum thickness of about 15 percent of the sphere diameter. The coated spheres are deposited in a nonconductive matrix to form an electroconductive body in which the spheres may be placed along conductive paths.

Galvanically Compatible Conductive Filler And Methods Of Making Same

US Patent:
5750249, May 12, 1998
Filed:
Feb 5, 1993
Appl. No.:
7/955906
Inventors:
James F. Walther - Mountain Lakes NJ
Robert J. Teichmann - Towaco NJ
Andrew M. Wasowicz - West Paterson NJ
Assignee:
Potters Industries, Inc. - Parsippany NJ
International Classification:
B32B 516
US Classification:
428328
Abstract:
Composite particles suitable as conductive filler for electrically conductive compositions which can be used as gaskets, caulking and plastics, for example. The compositions are, useful as EMI shielding and electrostatic charge dissipation materials. Methods of making and using the foregoing are also covered.

Galvanically Compatible Conductive Filler

US Patent:
5175056, Dec 29, 1992
Filed:
Jun 8, 1990
Appl. No.:
7/535365
Inventors:
Robert J. Teichmann - Towaco NJ
Assignee:
Potters Industries, Inc. - Parsippany NJ
International Classification:
B32B 1502
US Classification:
428403
Abstract:
Composite particles designed as a filler for gaskets, caulking compounds and plastics in general. The unique properties are obtained by using a soft metal core galvanically similar to the metal the sealant will be in contact with. The oxide surface of the core metal is typically breached by a multitude of small hard semiconductive or conductive particles, thus making low particle-to-particle contact resistance through the body.

Nickel Particle Plating System

US Patent:
4711814, Dec 8, 1987
Filed:
Jun 19, 1986
Appl. No.:
6/875964
Inventors:
Robert J. Teichmann - Belleville NJ
International Classification:
B05D 512
B05D 700
B32B 516
H01B 102
US Classification:
428403
Abstract:
A nickel particle plating system in which a multiplicity of minute nickel particles are provided with gold and silver coatings and are deposited in a nonconductive matrix to form an electro-conductive body in which the particles may be placed along conductive paths. The coatings are applied to the particles in a unique manner which enables the realization of a gold coating having a maximum thickness of about 5 percent of the maximum particle dimension and a silver coating having a maximum thickness of about 10 percent of the maximum particle dimension.

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.