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Stanford L Miller Deceased445 E Jennie Ave UNIT 68, Hermiston, OR 97838

Stanford Miller Phones & Addresses

445 E Jennie Ave UNIT 68, Hermiston, OR 97838    541-5676476   

Wood Village, OR   

Oregon City, OR   

Corvallis, OR   

Ephrata, WA   

Turner, OR   

Moses Lake, WA   

Salem, OR   

Plano, TX   

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Publications & IP owners

Us Patents

Method Of Forming A Protective Conductive Structure On An Integrated Circuit Package Interconnection

US Patent:
6426176, Jul 30, 2002
Filed:
Jan 6, 1999
Appl. No.:
09/226992
Inventors:
Donald D. Danielson - Forrest Grove OR
Stanford Miller - Portland OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G03F 700
US Classification:
430315, 430311, 430313, 430318, 430324, 438613
Abstract:
The invention provides a method of forming a conductive structure on an integrated circuit substrate. A metal bump, of a first material, is structured on the substrate so that the metal bump electrically contacts a metal part on the substrate. A protective layer is formed on the metal bump. The first material has a first conductivity. The protective layer is of a second material which has a second conductivity which is more than the first conductivity.

Isbn (Books And Publications)

Putting The Heart Back Into Teaching: A Manual For Junior Primary Teachers

Author:
Stanford Miller
ISBN #:
0958388555

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