BackgroundCheck.run
Search For

Stephan H Wolf, 6414584 Charden Rd, Cherokee, CA 95959

Known as:
Stephan J Wolf Steve H Wolf
Related to:
Martha H Wolf 86

Stephan Wolf Phones & Addresses

14584 Charden Rd, Nevada City, CA 95959    530-2656168   

1649 17Th St, Los Osos, CA 93402    805-5284624   

1374 7Th St, Los Osos, CA 93402    805-5284624   

San Luis Obispo, CA   

Colfax, CA   

Morro Bay, CA   

Get Report
Control this profile

Mentions for Stephan H Wolf

Stephan Wolf resumes & CV records

Resumes

Stephan Wolf Photo 32

Owner

Location:
Nevada City, CA
Industry:
Semiconductors
Work:
Space Control
Software Development Engineer Wafer Metrics
Owner
Education:
California Polytechnic State University - San Luis Obispo 1997 - 2001
Stephan Wolf Photo 33

Stephan Von Wolf

Stephan Wolf Photo 34

Stephan Wolf

Stephan Wolf Photo 35

Stephan Wolf

Publications & IP owners

Wikipedia

Stephan Wolf Photo 36

Stephen Wolf

Stephen M. Wolf (born 1941) assumed his current position as chairman of R. R. Donnelley & Sons Company in March 2004. He has been the managing partner of

Us Patents

Polishing Pad With Built-In Optical Sensor

US Patent:
6485354, Nov 26, 2002
Filed:
Jun 9, 2000
Appl. No.:
09/590470
Inventors:
Stephan H. Wolf - Los Osos CA
Assignee:
Strasbaugh - San Luis Obispo CA
International Classification:
B24B 4900
US Classification:
451 6, 451 41
Abstract:
An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the reflected light is detected by the detector. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Optical View Port For Chemical Mechanical Planarization Endpoint Detection

US Patent:
6488568, Dec 3, 2002
Filed:
Nov 14, 2000
Appl. No.:
09/712825
Inventors:
Randolph E. Treur - San Luis Obispo CA
John M. Boyd - San Luis Obispo CA
Stephan H. Wolf - San Luis Obispo CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 722
US Classification:
451 6, 451533
Abstract:
An optical endpoint system for a CMP system with a viewport located off-center on the platen, said view port being adjustable in height so that the window of the viewport can be made flush with the top of the polishing pad.

Endpoint Detection System For Wafer Polishing

US Patent:
6695681, Feb 24, 2004
Filed:
Nov 25, 2002
Appl. No.:
10/303621
Inventors:
Stephan H. Wolf - Los Osos CA
Assignee:
Strasbaugh - San Luis Obispo CA
International Classification:
B24B 4912
US Classification:
451 6, 451526, 451 8
Abstract:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Fiber Optical Sensor Embedded Into The Polishing Pad For In-Situ, Real-Time, Monitoring Of Thin Films During The Chemical Mechanical Planarization Process

US Patent:
6780085, Aug 24, 2004
Filed:
Nov 23, 2001
Appl. No.:
09/991122
Inventors:
Stephan H. Wolf - Los Osos CA, 93402
International Classification:
B24B 4912
US Classification:
451 6, 451288
Abstract:
An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization. The apparatus consists of two assemblies. Firstly, a fiber optical wave-guide assembly installed within the polishing pad during the pads construction. This assembly forms an integrated optical waveguide originating from the center of rotation of the polishing pad and terminating at a location within the wafer track. Secondly, a vacuum hub, tube, and angular encoder assembly, which provides light coupling to the center of rotation of the polishing pad and also provides resolution of the angular position and speed of the polishing pad, polishing table, and optical waveguide.

Endpoint Detection System For Wafer Polishing

US Patent:
7052366, May 30, 2006
Filed:
Feb 23, 2004
Appl. No.:
10/785393
Inventors:
Stephan H. Wolf - Los Osos CA, US
Assignee:
Strasbaugh - San Luis Obispo CA
International Classification:
B24B 49/12
B24B 7/22
US Classification:
451 6, 451 41
Abstract:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Optical Coupler Hub For Chemical-Mechanical-Planarization Polishing Pads With An Integrated Optical Waveguide

US Patent:
7074110, Jul 11, 2006
Filed:
Oct 18, 2003
Appl. No.:
10/688482
Inventors:
Stephan H Wolf - Los Osos CA, US
International Classification:
B24B 49/12
US Classification:
451 6, 451288
Abstract:
An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization (CMP). The apparatus consists of two assemblies. The first is a fiber optical wave-guide assembly installed within the polishing pad during the pad's construction. This assembly forms an integrated optical waveguide originating from the center of rotation of the polishing pad and terminating at a location within the wafer track. The second is a vacuum-attached hub containing optical and electronic devices, which couples light into the waveguide integrated into the polishing pad, provides light coupling to the center of rotation of the polishing pad, provides means for converting the received light into a signal that is transmitted to the CMP tool control system, and also has provision to prevent polishing slurry from coming in contact with the optical and electronic components. Alternately the vacuum-attached hub may contain optical devices only, which couples light into the waveguide integrated into the polishing pad and transmits the received light to the CMP tool control system.

Endpoint Detection System For Wafer Polishing

US Patent:
7195541, Mar 27, 2007
Filed:
May 30, 2006
Appl. No.:
11/443788
Inventors:
Stephan H. Wolf - Los Osos CA, US
Assignee:
Strasbaugh - San Luis Obispo CA
International Classification:
B24B 49/12
B24B 7/22
US Classification:
451 6, 451 41
Abstract:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Endpoint Detection System For Wafer Polishing

US Patent:
7918712, Apr 5, 2011
Filed:
Feb 12, 2010
Appl. No.:
12/705091
Inventors:
Stephan H. Wolf - Los Osos CA, US
Assignee:
Strasbaugh - San Luis Obispo CA
International Classification:
B24B 49/12
US Classification:
451 6, 451 5, 451 41
Abstract:
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

Isbn (Books And Publications)

Pfarrer, Christen Und Katholiken: Das Ministerium Fur Staatsicherheit Der Ehemaligen Ddr Und Die Kirchen

Author:
Stephan Wolf
ISBN #:
3788714166

Possible Relatives

Cynthia P Wolf  David J Wolf  Dawn L Wolf  Dean G Wolf  Dale A Wolf  Dallas D Wolf  Debora Wolf  Stephan Johnson  Stephan White  Stephan Jordan 

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.