Stephen M Dershem, 692634 Arnott St, San Diego, CA 92110

6423780, Jul 23, 2002

Feb 7, 2001

09/779396

Stephen M. Dershem - San Diego CA
Kevin J. Forrestal - Poway CA

Loctite - Rocky Hill CT

C08F22240

525216, 525218, 525282, 526262, 526283, 526284, 526281, 526308, 562435

In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high T values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.

6429281, Aug 6, 2002

Jul 1, 1999

09/347091

Stephen M. Dershem - San Diego CA
Frank G. Mizori - La Mesa CA

Loctite - Rocky Hill CT

C08L 6300

528412, 528 26, 528 40, 528297, 528410, 528418, 528421, 525474, 525523, 525533, 549543, 549544, 549545, 549546, 549547

In accordance with the present invention there are provided cycloaliphatic epoxy compounds and thermosetting resin compositions prepared therefrom. Inventive compounds are based on polycyclic hydrocarbon backbones, as illustrated by the following exemplary structure: wherein: each R is independently lower alkyl or halogen, nââ is 1 up to about 8, and each x is independently 0, 1, or 2. Inventive compounds provide resins with desirable characteristics such as, for example, hydrophobicity, high Tg values, ionic purity, hydrolytic stability, and the like.

6521731, Feb 18, 2003

Feb 7, 2001

09/779694

Stephen M. Dershem - San Diego CA
Kevin J. Forrestal - Poway CA

Henkel Loctite Corporation - Rocky Hill CT

C08F12240

526262, 526258, 526271, 526279, 526281, 526284, 526306

In accordance with the present invention, there are provided free-radical polymerizable compositions comprising polycyclic olefins, wherein the polycyclic olefins contain little, if any, cyclopentenyl unsaturation. As a result, these olefins are sufficiently reactive with the propagating free-radicals during cure to provide a highly crosslinked thermoset resin. Moreover, invention compositions comprise high molecular weight polycyclic olefins having low volatility. Accordingly, the observed undesirable weight loss upon cure of prior art thermosetting compositions is considerably reduced. Further provided by the present invention are compositions comprising functionalized polycyclic olefin monomers. These functionalized olefin monomers provide additional benefits such as increased adhesion to a variety of surfaces and greater control over glass transition temperatures.

6620946, Sep 16, 2003

Apr 30, 2002

10/137064

Stephen M. Dershem - San Diego CA
Kang Yang - San Diego CA

Loctite Corporation - Rocky Hill CT

C07D20740

548545, 560138

In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

6743852, Jun 1, 2004

Nov 13, 2001

10/008591

Stephen M. Dershem - San Diego CA
Puwei Liu - San Diego CA
Farhad G. Mizori - La Mesa CA

Henkel Corporation - Rocky Hill CT

C07D26506

524548, 526256, 526262, 544 73, 544 90, 544 95

In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.

6790597, Sep 14, 2004

Aug 1, 2002

10/211168

Stephen M. Dershem - San Diego CA
Dennis B. Patterson - Palmdale CA

Henkel Corporation - Rocky Hill CT

C08F22240

430300, 430311, 430320, 430321, 430331, 4284735, 428355 CN, 428355 N, 428901, 522173, 522176, 25218311, 526266, 526262, 524548, 427 96, 4272071, 4272082

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

6825245, Nov 30, 2004

Aug 1, 2002

10/211164

Stephen M. Dershem - San Diego CA
Dennis B. Patterson - Palmdale CA

Henkel Corporation - CT

C08J 328

522142, 522144, 522164, 522152, 522182, 522176, 522173, 522178, 522181, 522 74, 522 77, 522 83, 522 81, 522 60, 526262, 525282, 525205, 525322, 524439, 524506, 524516, 524580

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

6831132, Dec 14, 2004

Mar 28, 2002

10/113909

Puwei Liu - San Diego CA
Stephen M. Dershem - San Diego CA
Kang Yang - San Diego CA
Carolyn C. Albino - San Diego CA

Henkel Corporation - Rocky Hill CT

C08F25500

525193, 525 83, 525 89, 525 91, 525282, 525280, 525218, 525245, 525263, 526259, 5263031, 5263072, 526305, 526310, 526312

In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.