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Wenjun Liu, 49290 La Herran Dr, Santa Clara, CA 95051

Wenjun Liu Phones & Addresses

290 La Herran Dr, Santa Clara, CA 95051   

652 W Honeysuckle Dr, Chandler, AZ 85248   

400 Neville St, Pittsburgh, PA 15213    412-6827099    412-6875246   

College Station, TX   

Portland, OR   

Los Altos, CA   

400 N Neville St, Pittsburgh, PA 15213   

Work

Position: Executive, Administrative, and Managerial Occupations

Education

Degree: Graduate or professional degree

Mentions for Wenjun Liu

Resumes & CV records

Resumes

Wenjun Liu Photo 27

Senior Director, Finance

Location:
581 Patten Ave, Long Branch, NJ 07740
Industry:
Pharmaceuticals
Work:
KLA-Tencor - Milpitas, CA since Dec 2010
Division Finance Controller
KLA-Tencor Feb 2008 - Dec 2010
Revenue Manager
PwC Sep 2006 - Jan 2008
Senior Associate
PwC Sep 2004 - Sep 2006
Associate
Motorola - Beijing City, China 1998 - 2000
Software Engineer
Education:
San Jose State University 2003 - 2004
Master's degree, Accounting
Beijing Institute of Technology 1995 - 1998
Master's degree, Computer Science
Beijing Institute of Technology 1991 - 1995
Bachelor's degree, Computer Science
Skills:
Financial Reporting, Financial Modeling, Financial Analysis, Financial Accounting, Budgets, Accounting, Microsoft Excel, Powerpoint, Strategic Planning, Microsoft Office, Financial Budgeting, Customer Service, Research, Microsoft Word, English, Windows, Outlook, Photoshop, Teaching, Public Speaking, Editing
Languages:
English
Mandarin
Certifications:
Cpa
Wenjun Liu Photo 28

Wenjun Liu

Wenjun Liu Photo 29

Wenjun Liu

Location:
United States
Wenjun Liu Photo 30

Wenjun Liu

Location:
United States

Publications & IP owners

Us Patents

Planar Capacitor Terminals

US Patent:
2016015, Jun 2, 2016
Filed:
Dec 1, 2014
Appl. No.:
14/557256
Inventors:
- Palo Alto CA, US
Dino SASARIDIS - San Francisco CA, US
Colin CAMPBELL - San Francisco CA, US
Wenjun LIU - Santa Clara CA, US
International Classification:
H01G 4/40
H05K 7/02
H03H 7/00
H01G 4/224
H01G 4/248
Abstract:
An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.

Busbar Locating Component

US Patent:
2016015, Jun 2, 2016
Filed:
Dec 1, 2014
Appl. No.:
14/557398
Inventors:
- Palo Alto CA, US
Dino SASARIDIS - San Francisco CA, US
Colin CAMPBELL - San Francisco CA, US
Wenjun LIU - Santa Clara CA, US
International Classification:
H02M 7/00
H02B 1/20
H05K 3/30
Abstract:
A busbar locating component includes: one or more first attachments configured for attaching a busbar layer to the busbar locating component; one or more bays each configured to contain and position an assembly of transistors essentially perpendicular to the busbar layer for connection; and a plurality of slots, each slot configured to contain and position a busbar relative to the busbar layer for connection.

Welding And Soldering Of Transistor Leads

US Patent:
2016015, Jun 2, 2016
Filed:
Dec 1, 2014
Appl. No.:
14/557381
Inventors:
- Palo Alto CA, US
Dino SASARIDIS - San Francisco CA, US
Colin CAMPBELL - San Francisco CA, US
Wenjun LIU - Santa Clara CA, US
International Classification:
H05K 7/06
H05K 3/34
Abstract:
In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.

Heatsink With Internal Cavity For Liquid Cooling

US Patent:
2015034, Nov 26, 2015
Filed:
May 23, 2014
Appl. No.:
14/286670
Inventors:
- Palo Alto CA, US
Wenjun Liu - Santa Clara CA, US
Colin Campbell - San Francisco CA, US
Assignee:
Tesla Motors, Inc. - Palo Alto CA
International Classification:
H05K 7/20
B23P 15/26
Abstract:
A heatsink with an internal cavity for liquid cooling includes: a first part having a first group of fins extending into the internal cavity; a second part attached to the first part so that the internal cavity is formed, the second part having a second group of fins that extend into the internal cavity and that are configured to fit among the first group of fins; an inlet into the internal cavity on at least one of the first and second parts; and an outlet from the internal cavity on at least one of the first and second parts.

Isbn (Books And Publications)

Historical Geography And The Life Of The Mind In The Upper Illinois Valley

Author:
Wenjun Liu
ISBN #:
0890651442

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