William B Hansen DeceasedWoodland Hills, CA

6932933, Aug 23, 2005

Mar 30, 2001

09/821918

Henry Helvajian - Pasadena CA, US
Peter D. Fuqua - Redondo Beach CA, US
William W. Hansen - Lakewood CA, US

The Aerospace Corporation - El Segundo CA

B44C001/22
C03C015/00

264482, 216 55, 216 87

A laser direct write method creates true three dimensional structures within photocerams using an focused pulsed ultraviolet laser with a wavelength in a weakly absorbing region of the photoceram material. A critical dose of focused laser UV light selectively exposes embedded volumes of the material for subsequent selective etching. The photoceram material exposure is nonlinear with the laser fluence and the critical dose depends on the square of the per shot fluence and the number of pulses. The laser light is focused to a focal depth for selective volumetric exposure of the material within a focal volume within the remaining collateral volumes that is critically dosed for selecting etching and batch fabrication of highly defined embedded structures.

8369070, Feb 5, 2013

Jan 13, 2010

12/686978

Henry Helvajian - Pasadena CA, US
William W. Hansen - Lakewood CA, US
Lee F. Steffeney - Lake Elsinore CA, US

The Aerospace Corporation - El Segundo CA

H05K 5/00

36167901, 438106, 29825, 430311, 430320

A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electrical, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

8410660, Apr 2, 2013

Jan 13, 2010

12/686989

Henry Helvajian - Pasadena CA, US
William W. Hansen - Lakewood CA, US
Lee F. Steffeney - Lake Elsinore CA, US

The Aerospace Corporation - El Segundo CA

H01L 41/08

310311

A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

2013016, Jul 4, 2013

Feb 27, 2013

13/779263

THE AEROSPACE CORPORATION - El Segundo CA, US
William W. Hansen - Lakewood CA, US
Lee F. Steffeney - Lake Elsinore CA, US

THE AEROSPACE CORPORATION - El Segundo CA

B29C 67/00

264400

A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

4541676, Sep 17, 1985

Mar 19, 1984

6/591149

William D. Hansen - Bell Gardens CA
Raymond F. Mix - Pomona CA

ITT Corporation - New York NY

H01R 13627
H01R 2372

339 17CF

A test adapter for a chip carrier having leads along the four side edges thereof. The adapter comprises an inner housing having latches on its corners which engage the undersides of the corners of the carrier body to retain the adapter thereon. The adapter also includes an outer housing on which the test contacts are mounted. The outer housing is pushed downwardly to cause the contacts to engage the carrier chip leads with a positive wiping action.

4564251, Jan 14, 1986

Dec 13, 1984

6/681155

William D. Hansen - Bell Gardens CA
Raymond F. Mix - Pomona CA

ITT Corporation - New York NY

H01R 909

339 17CF

An adapter is described for making connection between the contact pads of a LCC (Leadless Chip Carrier) and the terminals of an ordinary low-cost socket that normally receives the LCC and connects it to a printed circuit board, while also providing connections for test equipment to monitor the interface between the LCC and the printed circuit, or just the LCC, or just the printed circuit. The adapter includes a base element which fits into the socket and which has multiple pads that contact the terminals of the socket, and a test interfacer which attaches to the base element and extends upwardly therefrom. The interfacer has a receiver for receiving a LCC and has leads that extend between the pads of the LCC and the pads of the base element. The leads also have portions that are accessible from the outside so that test equipment can be connected to them to monitor the interface between the LCC and the socket which connects to the printed circuit board.

4735580, Apr 5, 1988

Dec 22, 1986

6/944774

William D. Hansen - Santa Fe Springs CA
Raymond F. Mix - Pomona CA
Robert J. Poirier - Upland CA

ITT Corporation - New York NY

H01R 2372

439264

A test adapter is provided for connection to a PLCC (Plastic Leaded Clip Carrier), hereinafter referred to as a carrier, which assures accurate alignment with the carrier, which can be locked to the carrier during a test, which has a width only slightly greater than that of the carrier to enable testing of closely mounted carriers, and which can be simply constructed. The adapter includes an inner housing that bears against the top of the carrier and four contact frames pivotally mounted on the housing and carrying contacts that engage leads of the carrier. Each contact frame has separators between the contacts, the separators passing between the leads of the carrier to directly engage the sides of the carrier housing. The lower surface portions of the separators are slightly angled from the vertical so when they press against angled surfaces on the carrier housing sides, the adapter is locked to the carrier. The contact frames are held to the housing to pivot thereon by a snap ring that extends around the four frames and is supported by the frames.