Abraham S Ravid, 695974 Vista Loop, San Jose, CA 95124
Abraham Ravid Phones & Addresses
5974 Vista Loop, San Jose, CA 95124 408-2185660
Cupertino, CA
5974 Vista Loop, San Jose, CA 95124
Work
Position:
Medical Professional
Education
Degree:
High school graduate or higher
Mentions for Abraham S Ravid
Publications & IP owners
Us Patents
Determining Physical Property Of Substrate
US Patent:
7746485, Jun 29, 2010
Filed:
Oct 16, 2008
Appl. No.:
12/253160
Inventors:
Abraham Ravid - Cupertino CA, US
Boguslaw A. Swedek - Cupertino CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Ingemar Carlsson - Milpitas CA, US
Dominic J. Benvegnu - La Honda CA, US
Harry Q. Lee - Los Altos CA, US
Lakshmanan Karuppiah - San Jose CA, US
Boguslaw A. Swedek - Cupertino CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Ingemar Carlsson - Milpitas CA, US
Dominic J. Benvegnu - La Honda CA, US
Harry Q. Lee - Los Altos CA, US
Lakshmanan Karuppiah - San Jose CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01B 11/28
US Classification:
356630
Abstract:
A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
Methods And Apparatus For Generating A Library Of Spectra
US Patent:
7840375, Nov 23, 2010
Filed:
Mar 31, 2008
Appl. No.:
12/059435
Inventors:
Abraham Ravid - Cupertino CA, US
Boguslaw A. Swedek - Cupertino CA, US
Dominic J. Benvegnu - La Honda CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Sidney P. Huey - Fremont CA, US
Ingemar Carlsson - Milpitas CA, US
Lakshmanan Karuppiah - San Jose CA, US
Harry Q. Lee - Los Altos CA, US
Boguslaw A. Swedek - Cupertino CA, US
Dominic J. Benvegnu - La Honda CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Sidney P. Huey - Fremont CA, US
Ingemar Carlsson - Milpitas CA, US
Lakshmanan Karuppiah - San Jose CA, US
Harry Q. Lee - Los Altos CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01B 5/00
G06F 19/00
G06F 19/00
US Classification:
702172
Abstract:
A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.
High Throughput Measurement System
US Patent:
7952708, May 31, 2011
Filed:
Mar 31, 2008
Appl. No.:
12/059464
Inventors:
Abraham Ravid - Cupertino CA, US
Boguslaw A. Swedek - Cupertino CA, US
Dominic J. Benvegnu - La Honda CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Sidney P. Huey - Fremont CA, US
Ingemar Carlsson - Milpitas CA, US
Lakshmanan Karuppiah - San Jose CA, US
Harry Q. Lee - Los Altos CA, US
Boguslaw A. Swedek - Cupertino CA, US
Dominic J. Benvegnu - La Honda CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Sidney P. Huey - Fremont CA, US
Ingemar Carlsson - Milpitas CA, US
Lakshmanan Karuppiah - San Jose CA, US
Harry Q. Lee - Los Altos CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01J 3/40
US Classification:
356302, 356300, 356303, 356448, 451 5, 451 66, 702170
Abstract:
A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.
Determining Physical Property Of Substrate
US Patent:
8014004, Sep 6, 2011
Filed:
Jun 23, 2010
Appl. No.:
12/822096
Inventors:
Abraham Ravid - Cupertino CA, US
Boguslaw A. Swedek - Cupertino CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Ingemar Carlsson - Milpitas CA, US
Dominic J. Benvegnu - La Honda CA, US
Harry Q. Lee - Los Altos CA, US
Lakshmanan Karuppiah - San Jose CA, US
Boguslaw A. Swedek - Cupertino CA, US
Jeffrey Drue David - San Jose CA, US
Jun Qian - Sunnyvale CA, US
Ingemar Carlsson - Milpitas CA, US
Dominic J. Benvegnu - La Honda CA, US
Harry Q. Lee - Los Altos CA, US
Lakshmanan Karuppiah - San Jose CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01B 11/28
US Classification:
356630, 700117, 702172
Abstract:
A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
Methods And Apparatus For Measuring Substrate Edge Thickness During Polishing
US Patent:
8125654, Feb 28, 2012
Filed:
Apr 16, 2009
Appl. No.:
12/425017
Inventors:
Dominic J. Benvegnu - La Honda CA, US
Boguslaw A. Swedek - Cupertino CA, US
Abraham Ravid - Cupertino CA, US
Paul V. Miller - Cupertino CA, US
Boguslaw A. Swedek - Cupertino CA, US
Abraham Ravid - Cupertino CA, US
Paul V. Miller - Cupertino CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01B 11/28
US Classification:
356630
Abstract:
Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the substrate edge; and a controller adapted to determine a polishing endpoint for the substrate edge based on the arrangement of reflected light. Numerous other aspects are provided.
Method For Imaging Workpiece Surfaces At High Robot Transfer Speeds With Correction Of Motion-Induced Distortion
US Patent:
8452077, May 28, 2013
Filed:
Feb 17, 2010
Appl. No.:
12/707499
Inventors:
Abraham Ravid - Cupertino CA, US
Todd Egan - Fremont CA, US
Karen Lingel - Union City CA, US
Todd Egan - Fremont CA, US
Karen Lingel - Union City CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G06K 9/00
US Classification:
382152, 348 44, 348 87, 348145, 382144, 382149, 382154
Abstract:
A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is corrected by computing respective correct locations of respective ones of the frames along the transit path.
Method For Imaging Workpiece Surfaces At High Robot Transfer Speeds With Reduction Or Prevention Of Motion-Induced Distortion
US Patent:
8620064, Dec 31, 2013
Filed:
Feb 17, 2010
Appl. No.:
12/707548
Inventors:
Abraham Ravid - Cupertino CA, US
Todd Egan - Fremont CA, US
Karen Lingel - Union City CA, US
Todd Egan - Fremont CA, US
Karen Lingel - Union City CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G06K 9/00
US Classification:
382152, 348 44, 348 87, 348145, 382144, 382149, 382154
Abstract:
A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is prevented or reduced adjusting the camera frame rate in real time in proportion to changes in robot velocity profile of the workpiece along the transit path.
Metrology For Gst Film Thickness And Phase
US Patent:
8639377, Jan 28, 2014
Filed:
Nov 7, 2008
Appl. No.:
12/267526
Inventors:
Kun Xu - Fremont CA, US
Feng Q Liu - San Jose CA, US
Yuchun Wang - Santa Clara CA, US
Abraham Ravid - Cupertino CA, US
Wen-Chiang Tu - Mountain View CA, US
Feng Q Liu - San Jose CA, US
Yuchun Wang - Santa Clara CA, US
Abraham Ravid - Cupertino CA, US
Wen-Chiang Tu - Mountain View CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G06F 19/00
F04B 19/16
F04D 27/02
F04D 23/00
F04B 19/16
F04D 27/02
F04D 23/00
US Classification:
700164, 700109, 700121, 700160, 700174, 700175, 415 1, 415 5, 415 6, 415 7, 415 9
Abstract:
Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.
Public records
Vehicle Records
Abraham Ravid
Address:
5974 Vis Loop, San Jose, CA 95124
VIN:
KMHDU4AD5AU881766
Make:
HYUNDAI
Model:
ELANTRA
Year:
2010
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