Alan S Edelstein, 888002 Lynnfield Dr, Alexandria, VA 22306

6376074, Apr 23, 2002

Mar 3, 2000

09/518926

Richard K. Everett - Alexandria VA
Alan S. Edelstein - Alexandria VA
John H. Perepezko - Madison WI

The United States of America as represented by the Secretary of the Navy - Washington DC

B32B 2520

428391, 4282934, 428364, 428375, 428378, 428396

A debonding layer is formed on fibers such as silicon carbide fibers by forming a thin film of a metal such as nickel or iron on the silicon carbide fibers and then annealing at a temperature of about 350-550Â C. to form a debond layer of a metal silicide and carbon. These fibers having the debond coating can be added to composite forming materials and the mixture treated to form a consolidated composite. A one heating-step method to form a consolidated composite involves inserting the silicon carbide fibers with just the initial metal film coating into the composite forming materials and then heating the mixture to form the debond coating in situ on the fibers and to form the consolidated composite. Preferred heating techniques include high temperature annealing, hot-pressing, or hot isostatic pressing (HIP).

6501268, Dec 31, 2002

Aug 18, 2000

09/641370

Alan S. Edelstein - Alexandria VA
David M. Hull - Adelphi MD

The United States of America as represented by the Secretary of the Army - Washington DC

G01R 3302

324244, 324225, 324251, 324252, 324259

A magnetic sensing device that senses low frequency magnetic fields by using movable flux concentrators that modulate the observed low frequency signal. The concentrator oscillates at a modulation frequency much greater than the observed magnetic field being sensed by the device. The modulation shifts this observed signal to higher frequencies and thus minimizes 1/f-type noise. This is preferably accomplished by the oscillatory motion of a microelectromechanical (MEMS)âtype magnetic flux concentrator operated with a magnetic sensor, preferably made on a common substrate. Such a combined device can be used in a magnetometer. Such a device is small, low-cost and has low-power-consumption requirements. The magnetic sensor can be a Hall effect or other type of magnetic sensor. At least one modulating flux concentrator is used with the magnetic sensor.

6675123, Jan 6, 2004

Nov 26, 2002

10/303923

Alan S. Edelstein - Alexandria VA

The United States of America as represented by the Secretary of the Army - Washington DC

G06F 1500

702150

Methods and systems for tracking a magnetic object are disclosed. A plurality of line segments can be complied based on data received from a plurality of magnetic sensors. The line segment that minimizes an error thereof can then be determined. The path of a magnetic object can then be established based on the compiled line segments and calculated error thereof, thereby permitting the magnetic object to be tracked according to the data received from the magnetic sensors, which can be based on the closest of approach of one or more of the magnetic sensors to the magnetic object. The present invention can thus permit a magnetic object to be tracked utilizing the total magnetic field measured at a position of closest approach by the magnetic object to one or more magnetic sensors from among a group of magnetic sensors.

6762954, Jul 13, 2004

May 9, 2003

10/434337

Alan S. Edelstein - Alexandria VA, 22306

G11C 1114

365173, 365171

Systems and methods for probing the magnetic permeability of a material are disclosed. A sensor unit can be configured to comprise magnet layers thereof, including a soft ferromagnetic layer, a first hard ferromagnetic layer and a second hard ferromagnetic layer. An intermediate layer (e. g. , conductor or insulator) can be disposed between the first hard ferromagnetic layer and the soft ferromagnetic layer within the sensor unit. Additionally, a spacer layer can be disposed between the soft ferromagnetic layer and the second hard ferromagnetic layer, wherein the sensor unit measures the magnetic properties of a material located a distance from the sensor unit through the magnetic interaction of the magnetic layers of the sensor unit. Conduction between the first hard ferromagnetic layer and the soft ferromagnetic layer generally occurs via tunneling.

6947319, Sep 20, 2005

Jun 30, 2004

10/880276

Alan S. Edelstein - Alexandria VA, US

The United States of America as represented by the Secretary of the Army - Washington DC

G11C007/00

365173, 365171

An apparatus, system, and method for probing magnetic permeability of a material located a distance from the apparatus comprises a first hard ferromagnetic layer, a second hard ferromagnetic layer, a first soft ferromagnetic layer, a second soft ferromagnetic layer, an intermediate layer disposed between the first hard ferromagnetic layer and the first soft ferromagnetic layer, an insulating layer between the first soft ferromagnetic layer and second soft ferromagnetic layer, and a spacer layer disposed between the second soft ferromagnetic layer and the second hard ferromagnetic layer, wherein the second soft ferromagnetic layer increases an on/off ratio of a magnetic field in the first soft ferromagnetic layer, wherein the on/off ratio is approximately 1. 6, and wherein the second soft ferromagnetic layer pulls a magnetic field of the apparatus into the first soft ferromagnetic layer.

7046002, May 16, 2006

Nov 26, 2004

10/997031

Alan S. Edelstein - Alexandria VA, US

The United States of America as represented by the Secretary of the Army - Washington DC

G01R 33/02
G01R 33/025
G01R 33/06

324244, 324225, 324251, 324252, 324259

A microelectromechanical system (MEMS) device comprising a base structure; a magnetic sensor attached to the base structure and operable for sensing a magnetic field and allowing for a continuous variation of an amplification of the magnetic field at a position at the magnetic sensor; and for receiving a DC voltage and an AC modulation voltage in the MEMS device; a pair of flux concentrators attached to the magnetic sensor; and a pair of electrostatic comb drives, each coupled to a respective flux concentrator such that when the pair of electrostatic comb drives are excited by a modulating electrical signal, each flux concentrator oscillates linearly at a prescribed frequency; and a pair of bias members (mechanical spring connectors) connecting the flux concentrators to one another.

7185541, Mar 6, 2007

Feb 2, 2006

11/345541

Alan S. Edelstein - Alexandria VA, US

The United States of America as represented by the Secretary of the Army - Washington DC

G01P 15/08

7351416, 7351431

A MEMS device and method of manufacturing comprises a magnetic sensor attached to a frame; at least one magnet adjacent to the magnetic sensor; a proof mass attached to the magnet; a cantilever beam attached to the proof mass; and a rod attached to the cantilever beam and the frame, wherein the magnet is adapted to rotate about a longitudinal axis of the rod. The proof mass comprises a portion of a SOI wafer. An acceleration of the frame causes the magnet to move relative to the frame and the magnetic sensor. An acceleration of the frame causes the connecting member to bend. The motion of the magnet causes a change in a magnetic field at a position of the magnetic sensor, wherein the change in the magnetic field is detected by the magnetic sensor, and wherein a sensitivity of detection of the acceleration of the device is approximately 0. 0001 g.

7195945, Mar 27, 2007

Sep 15, 2005

11/226403

Alan S. Edelstein - Alexandria VA, US
Jeffrey S. Pulskamp - Rockville MD, US
Michael Pedersen - Ashton MD, US

United States of America as represented by the Secretary of the Army - Washington DC

H01L 21/00

438 48, 438 73, 324244

A method of fabricating a MEMS device includes forming a magnetic sensor over a SOI wafer which may include an epoxy layer; forming a pair of MEMS flux concentrators sandwiching the magnetic sensor; connecting an electrostatic comb drive to each of the flux concentrators; connecting a spring to the flux concentrators and the comb drive; performing a plurality of DRIE processes on the SOI wafer; and releasing the flux concentrators, the comb drive, and the spring from the SOI wafer. Another embodiment includes forming adhesive bumps and a magnetic sensor on a first wafer; forming a second wafer; forming a pair of MEMS flux concentrators, a pair of electrostatic comb drives, and at least one spring on the second wafer; bonding the second wafer to the adhesive bumps; and compressing the adhesive bumps using non-thermal means such as pressure only.