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Allen Chang2940 N Ellis St, Chandler, AZ 85224

Allen Chang Phones & Addresses

2940 N Ellis St, Chandler, AZ 85224    480-7320047   

Stanford, CA   

Work

Company: Century 21 Address: Cupertino, CA Phones: 408-9731888 (Phone)

Mentions for Allen Chang

Career records & work history

Real Estate Brokers

Allen Chang Photo 1

ALLEN CHANG, Cupertino CA - Agent

Work:
Century 21
Cupertino, CA
408-9731888 (Phone)

Medicine Doctors

Allen Chang

Specialties:
Internal Medicine
Work:
UMass Memorial Medical GroupAdult Primary Care Center
55 Lk Ave N, Worcester, MA 01655
508-3342731 (phone) 774-4424672 (fax)
Site
Education:
Medical School
University of Massachusetts Medical School
Graduated: 2009
Procedures:
Arthrocentesis
Conditions:
Diabetes Mellitus (DM), Abdominal Hernia, Abnormal Vaginal Bleeding, Acne, Acute Bronchitis, Acute Pharyngitis, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Anxiety Phobic Disorders, Attention Deficit Disorder (ADD), Benign Prostatic Hypertrophy, Bronchial Asthma, Chronic Renal Disease, Constipation, Contact Dermatitis, Dementia, Disorders of Lipoid Metabolism, Erectile Dysfunction (ED), Gastroesophageal Reflux Disease (GERD), Herpes Simplex, Herpes Zoster, Hypertension (HTN), Hypothyroidism, Iron Deficiency Anemia, Ischemic Heart Disease, Migraine Headache, Orbital Infection, Septicemia, Skin and Subcutaneous Infections, Substance Abuse and/or Dependency, Tinea Unguium, Vitamin D Deficiency
Languages:
English, Spanish
Description:
Dr. Chang graduated from the University of Massachusetts Medical School in 2009. He works in Worcester, MA and specializes in Internal Medicine. Dr. Chang is affiliated with UMASS Memorial Medical Center.
Allen Chang Photo 2

Allen Chang

Allen Chang Photo 3

Allen Chang

Specialties:
Urology

Allen Chang resumes & CV records

Resumes

Allen Chang Photo 49

Product Marketing @Lanner Electronics

Location:
San Francisco Bay Area
Industry:
Computer & Network Security
Allen Chang Photo 50

Android Developer

Location:
2940 north Ellis St, Chandler, AZ 85224
Industry:
Computer Software
Work:
Asana
Android Developer
Asana
Software Engineer
Uber Feb 2016 - Jul 2016
Software Engineer
Redfin Jun 2014 - Sep 2014
Software Development Intern
Stanford University Sep 2011 - Jun 2014
M.s Electrical Engineering
Facebook Jun 2013 - Sep 2013
Software Engineering Intern
Apple Jun 2012 - Sep 2012
Rf Systems Engineering Intern
Qualcomm Sep 2007 - May 2011
Rf Verification Engineer
Freescale Semiconductor Aug 2005 - Aug 2007
Rf Power Amplifier Engineer
Education:
Stanford University 2011 - 2014
Master of Science, Masters, Electronics Engineering
Dobson High School
Cornell University
Bachelors, Bachelor of Arts, Computer Engineering
Skills:
Matlab, C++, Java, Circuit Design, Objective C, Embedded Systems, Javascript, Html, Php, Css, Radio Frequency Engineering, Gsm, Bluetooth, Wifi, Lte, Ruby on Rails
Languages:
English
Mandarin
Taiwanese
Spanish
Japanese
Korean
Allen Chang Photo 51

Allen Chang

Allen Chang Photo 52

Allen Chang

Allen Chang Photo 53

Software Design Engineer At Hewlett-Packard

Position:
Software Design Engineer at Hewlett-Packard
Location:
San Francisco Bay Area
Industry:
Computer Software
Work:
Hewlett-Packard since Nov 1999
Software Design Engineer
Fujitsu P.C Corporation 1995 - 1998
Sr. Software engineer
Education:
San Jose State University 1976 - 1980
BS, Mechanical Engineering
Skills:
Agile Methodologies, Cloud Computing, Software Development, Software Engineering, Software Project Management, .NET, C#, C++, Software Design, Scrum, Embedded Systems, Product Management, Testing, Integration, Program Management, HP, Device Drivers, Agile Project Management, Debugging
Allen Chang Photo 54

Quality Assurance Engineer At Surveymonkey

Position:
Quality Assurance Engineer at SurveyMonkey
Location:
San Francisco Bay Area
Industry:
Internet
Work:
SurveyMonkey - Palo Alto, CA since Jan 2013
Quality Assurance Engineer
SurveyMonkey - Palo Alto, CA Jul 2012 - Jan 2013
Project Manager, SurveyMonkey Audience
The Princeton Review - San Jose, CA Mar 2011 - Dec 2012
SAT Math Instructor
Ignition Talent Group - San Francisco Bay Area Aug 2011 - Jun 2012
Technical Research Analyst
SaveWithSavvy May 2011 - Aug 2011
Quality Assurance Analyst
UC San Diego - La Jolla, CA May 2007 - Jan 2010
Lab Technician
Education:
University of California, San Diego 2005 - 2010
BA, Economics
University of California, San Diego 2005 - 2010
BS, Biochemistry/Biology
Skills:
Stata, MaxHire, Executive Search, Market Research, Market Analysis, Multitasking, Start-ups, Venture Capital, Sourcing, CRM, Salesforce.com, SurveyMonkey, Account Management, Project Management, Survey Design, Quality Assurance, Software Development Life Cycle, Scrum, Agile Methodologies, Wufoo, Microsoft Excel, HTML
Interests:
Technology, Investing, Start-ups, Venture Capital, Food, Tennis, Sustainability
Languages:
English
Chinese
Allen Chang Photo 55

It Manager At Morrison Express

Position:
IT manager at morrison express
Location:
San Francisco Bay Area
Industry:
Computer Software
Work:
morrison express
IT manager
Allen Chang Photo 56

Allen Chang

Location:
San Francisco Bay Area
Industry:
Information Technology and Services
Skills:
NI LabVIEW, PXI, DIAdem, NI, Real-time Data Acquisition, Real Time Monitoring, Sybase, Sybase Adaptive Server, SQL Backtrack, Statspack, Sybase SQL Anywhere, SAP Mobile, cRIO, LabWindows/CVI, Rational Apex, Rational DOORS, MIL-STD-1553, Ada programming, IBM Rational Rhapsody, SysML, Systems Engineering Process, Human Systems Integration, Cognitive Modeling, Human-robot Interaction, Natural Language Understanding, Language Processing, Speech Perception, Test Stand, GPIB, Cloud Computing, Solution Architecture

Publications & IP owners

Us Patents

Current Limited Bilateral Mosfet Switch With Reduced Switch Resistance And Lower Manufacturing Cost

US Patent:
7457092, Nov 25, 2008
Filed:
Dec 7, 2005
Appl. No.:
11/296753
Inventors:
Allen Chang - Fremont CA, US
Zhinan Wei - San Jose CA, US
Assignee:
Alpha & Omega Semiconductor, LLD.
International Classification:
H02H 3/02
US Classification:
361 939, 361 57
Abstract:
A circuit and method for controlling a MOSFET based switch that includes two back-to-back FET to block current flow in the OFF state irrespective of the polarity of the voltage differential across the switch. The MOSFET based switch further has a built-in current limit function by sensing the current flow through one of the two MOSFET switches. Furthermore, the bilateral current-limited switch further includes circuitry required for controlling both P type and N type FET in either common drain or common source configuration.

Current Limiting Load Switch With Dynamically Generated Tracking Reference Voltage

US Patent:
7728655, Jun 1, 2010
Filed:
Oct 10, 2008
Appl. No.:
12/249162
Inventors:
Kevin Ng - Fremont CA, US
Zhinan Wei - San Jose CA, US
Wai-Keung Peter Cheng - Union City CA, US
Allen Chang - Fremont CA, US
Assignee:
Alpha & Omega Semiconductor, Inc. - Sunnyvale CA
International Classification:
G05F 3/02
US Classification:
327543
Abstract:
A current limiting load switch for bridging supply Vss and load with a reference voltage VRdynamically generated by a VR-generator is proposed. It includes: A pair of power FET and sense FET interconnected in split-current configuration. The FET pair develops a load voltage while limiting load current Iload to a preset maximum Imax. The FET pair is sized to draw device currents Ipower and Is with RATIO=Is/Ipower

High Voltage And High Power Boost Converter With Co-Packaged Schottky Diode

US Patent:
7750447, Jul 6, 2010
Filed:
Jun 11, 2007
Appl. No.:
11/761313
Inventors:
Allen Chang - Fremont CA, US
Wai-Keung Peter Cheng - Union City CA, US
Assignee:
Alpha & Omega Semiconductor, Ltd - Hamilton
International Classification:
H01L 23/495
H01L 23/48
G05F 1/00
US Classification:
257676, 257777, 323222
Abstract:
A high voltage and high power boost converter is disclosed. The boost converter includes a boost converter IC and a discrete Schottky diode, both of which are co-packaged on a standard single common die pad.

Multi-Die Dc-Dc Buck Power Converter With Efficient Packaging

US Patent:
7825508, Nov 2, 2010
Filed:
Jul 31, 2007
Appl. No.:
11/830996
Inventors:
François Hébert - San Mateo CA, US
Allen Chang - Fremont CA, US
Assignee:
Alpha Omega Semiconductor, Inc. - Sunnyvale CA
International Classification:
H01L 23/34
US Classification:
257724, 257777, 257E23003
Abstract:
A DC-DC buck converter in multi-die package is proposed having an output inductor, a low-side Schottky diode and a high-side vertical MOSFET controlled by a power regulating controller (PRC). The multi-die package includes a first die pad with the Schottky diode placed there on side by side with the vertical MOSFET. The PRC die is attached atop the first die pad via an insulating die bond. Alternatively, the first die pad is grounded. The vertical MOSFET is a top drain N-channel FET, the substrate of Schottky diode die is its anode. The Schottky diode and the vertical MOSFET are stacked atop the first die pad. The PRC is attached atop the first die pad via a conductive die bond. The Schottky diode die can be supplied in a flip-chip configuration with cathode being its substrate. Alternatively, the Schottky diode is supplied with anode being its substrate without the flip-chip configuration.

Use Of Discrete Conductive Layer In Semiconductor Device To Re-Route Bonding Wires For Semiconductor Device Package

US Patent:
7884454, Feb 8, 2011
Filed:
Sep 11, 2008
Appl. No.:
12/209106
Inventors:
Jun Lu - San Jose CA, US
Anup Bhalla - Santa Clara CA, US
Xiaobin Wang - San Jose CA, US
Allen Chang - Fremont CA, US
Man Sheng Hu - San Francisco CA, US
Xiaotian Zhang - San Jose CA, US
Assignee:
Alpha & Omega Semiconductor, Ltd - Hamilton
International Classification:
H01L 23/495
US Classification:
257676, 257666, 257686, 257780, 257781, 257E23031, 257E23039, 257E23059, 257E23079, 438123
Abstract:
A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.

Flexible Low Current Oscillator For Multiphase Operations

US Patent:
7893778, Feb 22, 2011
Filed:
Jun 19, 2009
Appl. No.:
12/488413
Inventors:
Behzad Mohtashemi - Los Gatos CA, US
Allen Chang - Fremont CA, US
Assignee:
Alpha & Omega Semiconductor Incorporated - Sunnyvale CA
International Classification:
H03B 5/24
H03K 3/03
US Classification:
331 57, 331177 R
Abstract:
An oscillator includes a reference stage and multiple phase stages. The reference stage has a reference transistor having a gate coupled to a voltage reference and a drain coupled to a reference current source. Each phase stage includes a transistor, two current sources, a capacitor, switch, inverter, and latch. The transistor has a drain coupled to a first current source, a gate coupled to a node and a source coupled to the reference transistor's source. The capacitor and switch couple between the node and ground. The second current source couples to the node. The transistor's drain couples to the inverter's input. The inverter's output couples to the latch's set input. The latch's output couples to the switch. The inverter output also couples to the reset input of a subsequent phase stage's latch. The inverter output for a last stage couples to the reset input of a first stage latch.

Stacked-Die Package For Battery Power Management

US Patent:
7898092, Mar 1, 2011
Filed:
Nov 21, 2007
Appl. No.:
11/944313
Inventors:
Jun Lu - San Jose CA, US
Allen Chang - Fremont CA, US
Xiaotian Zhang - San Jose CA, US
Assignee:
Alpha & Omega Semiconductor, - Hamilton
International Classification:
H02H 9/00
US Classification:
257777, 257734, 257666, 257686, 257E23058, 257E25013
Abstract:
A stacked-die package for battery protection is disclosed. The battery protection package includes a power control integrated circuit (IC) stacked on top of integrated dual common-drain metal oxide semiconductor field effect transistors (MOSFETs) or two discrete MOSFETs. The power control IC is either stacked on top of one MOSFET or on top of and overlapping both two MOSFETs.

Boost Converter With Integrated High Power Discrete Fet And Low Voltage Controller

US Patent:
8008897, Aug 30, 2011
Filed:
Jun 11, 2007
Appl. No.:
11/761301
Inventors:
Allen Chang - Fremont CA, US
Wai-Keung Peter Cheng - Union City CA, US
Assignee:
Alpha & Omega Semiconductor, Ltd - Hamilton
International Classification:
G05F 1/10
H01L 25/04
US Classification:
323222, 257777
Abstract:
A boost converter for high power and high output voltage applications includes a low voltage controller integrated circuit and a high voltage, vertical, discrete field effect transistor, both of which are packed in a single package.

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