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Resumes
Amir Mirza
Location:
United States
Amir Mirza, 622123 Arnold Dr, Rocklin, CA 95765
Amir Mirza Phones & Addresses
2123 Arnold Dr, Rocklin, CA 95765 916-4354246
Greenfield, CA
Sacramento, CA
3265 Foxtail Ter, Fremont, CA 94536 510-7907627
5712 Spry Cmn, Fremont, CA 94538 510-6578115
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Mentions for Amir Mirza
Publications & IP owners
Us Patents
Micromechanical Device With Thinned Cantilever Structure And Related Methods
US Patent:
7223624, May 29, 2007
Filed:
Dec 30, 2005
Appl. No.:
11/322852
Inventors:
Guanghua Wu - Dublin CA, US
Amir Raza Mirza - Goleta CA, US
Amir Raza Mirza - Goleta CA, US
Assignee:
General Electric Company - Fremont CA
International Classification:
H01L 21/02
G01P 15/12
G01P 15/12
US Classification:
438 52, 7351433, 7351436
Abstract:
In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer with a thinned flexure structure. In another embodiment, the device and method of producing the device includes an accelerometer and a pressure sensor integrated on a single chip.
Method And Apparatus For Detecting And Latching The Position Of A Mems Moving Member
US Patent:
2002016, Nov 7, 2002
Filed:
May 3, 2002
Appl. No.:
10/137857
Inventors:
Amir Mirza - Fremont CA, US
International Classification:
G02B026/00
G02B007/02
G02B007/02
US Classification:
359/295000, 359/292000, 359/291000
Abstract:
An apparatus for detecting the position of an optical element includes an actuator coupled to the optical element. A sensor coupled to the optical element senses the movement of the optical element. The sensor includes a moveable electrode coupled to the optical element for outputting a position detection signal.
Method For Separating Silica Waveguides
US Patent:
2002016, Nov 7, 2002
Filed:
May 3, 2002
Appl. No.:
10/138201
Inventors:
Amir Mirza - Fremont CA, US
International Classification:
H01L021/00
US Classification:
438/031000, 438/460000, 438/462000
Abstract:
A method is provided for separating silica waveguides made in multiple units on a wafer at the end of fabrication. Streets are formed between adjacent waveguides by etching the IC material to a substrate. The substrate is then sawed along the streets.
Micromechanical Device With Thinned Cantilever Structure And Related Methods
US Patent:
2005017, Aug 11, 2005
Filed:
Feb 6, 2004
Appl. No.:
10/774011
Inventors:
Guanghua Wu - Dublin CA, US
Amir Mirza - Goleta CA, US
Amir Mirza - Goleta CA, US
Assignee:
GENERAL ELECTRIC COMPANY - Fremont CA
International Classification:
G01P015/09
US Classification:
073514340
Abstract:
In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer with a thinned flexure structure. In another embodiment, the device and method of producing the device includes an accelerometer and a pressure sensor integrated on a single chip.
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