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Andrew A Alibocus, 636454 Fairchild Ave, Cocoa, FL 32927

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6454 Fairchild Ave, Cocoa, FL 32927    321-4330804   

9706 Halkirk St, Spring, TX 77379    281-3797301   

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Us Patents

Solder Paste And Glue Dot-Based Methods Of Securing Components To A Printed Circuit Board

US Patent:
5627108, May 6, 1997
Filed:
Jun 21, 1995
Appl. No.:
8/492972
Inventors:
Andrew A. Alibocus - Tomball TX
John F. Haarde - The Woodlands TX
Troy W. Beacleay - Houston TX
John Hua - Cypress TX
Mark A. Smith - Houston TX
Assignee:
Compaq Computer Corporation - Houston TX
International Classification:
H01L 7160
US Classification:
228175
Abstract:
Glue dots are deposited on a substrate side of a partially completed printed circuit board, between pairs of component mounting pads disposed on the substrate and having quantities of solder paste thereon, using a resilient stencil plate having a spaced series of glue discharge openings extending transversely therethrough, and a spaced series of side recesses. The recess side of stencil plate is positioned in a spaced, parallel and opposing relationship with the mounting pad side of the substrate with the plate recesses being aligned with the substrate mounting pads, and the glue discharge openings being aligned with glue leveling pads disposed on the substrate side between adjacent mounting pad pairs. Glue is deposited on the outer stencil plate side and a squeegee blade is moved along the outer stencil plate side to deflect it toward the substrate and force glue through the discharge openings to deposit glue dots thereon when the stencil plate is permitted to return to its undeflected position. As the plate is deflected, its depressions receive and provide clearance for the mounting pads so as not to disturb the solder paste quantities thereon.

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