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Andrew J Brindle, 42Warners, NY

Related to:
Ann Brindle Coakley Thomas D Schmiedicke 81 Wendy S Schmiedicke 48

Andrew Brindle Phones & Addresses

Warners, NY   

Camillus, NY   

Cicero, NY   

Syracuse, NY   

8127 Navona Ln, Clay, NY 13041   

Lewisburg, TN   

Annapolis, MD   

Potsdam, NY   

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Andrew Brindle resumes & CV records

Resumes

Andrew Brindle Photo 37

Research Engineering Consultant

Location:
16 Kings Ct, Camillus, NY 13031
Industry:
Mechanical Or Industrial Engineering
Work:
Salt City Technical Corp. Nov 2013 - Jul 2016
Mechanical Engineering Consultant Quadrant Biosciences Inc Nov 2013 - Jul 2016
Vice President of Technology Motion Intelligence Nov 2013 - Jul 2016
Research Engineering Consultant Src Aug 2005 - Aug 2013
Mechanical Engineer Northrop Grumman Corporation May 2004 - Aug 2004
Mechanical Engineering Intern
Education:
Clarkson University 2003 - 2005
Bachelors, Bachelor of Science, Mechanical Engineering Anne Arundel Community College 2001 - 2003
Skills:
Engineering, Mechanical Engineering, Engineering Management, Systems Engineering, Design For Manufacturing, Matlab, Solid Modeling, Gd&T, Cad, Ansys, Aerospace, Microsoft Office, Solidworks, Finite Element Analysis, Sensors, Earned Value Management, Design For Assembly, System Design, Structural Analysis, Systems Design, Electrical Engineering, Pro Engineer, Radar, Ptc Creo, Computer Aided Design, Geometric Dimensioning
Andrew Brindle Photo 38

Andrew Brindle

Publications & IP owners

Us Patents

Circuit Board Frame With Integral Heat Sink For Enhanced Thermal Transfer

US Patent:
2012017, Jul 5, 2012
Filed:
Dec 29, 2010
Appl. No.:
12/980726
Inventors:
Michael Lee Fowler - Minoa NY, US
Andrew Jonathan Brindle - Clay NY, US
Assignee:
SRC, INC. - North Syracuse NY
International Classification:
H05K 7/20
US Classification:
361720
Abstract:
A circuit board frame and a circuit board assembly that includes the circuit board frame includes a first region designed for receiving a circuit board, and a second region contiguous with the first region and including a heat sink. The circuit board frame and circuit board assembly are designed and fabricated so that the first region is located inside a circuit board chassis and the heat sink is located outside the circuit board chassis when the circuit board frame or the circuit board assembly is assembled into the circuit board chassis by insertion into at least one slot within a sidewall of the circuit board chassis. The at least one slot within the sidewall of the circuit board chassis may have straight sidewalls, or alternatively tapered sidewalls that may ease insertion and assembly of the circuit board frame or circuit board assembly into the circuit board chassis. Protrusion of the heat sink, which is contiguous with the first region, through the circuit board chassis sidewall improves thermal transfer efficiency from a circuit board to the heat sink in-part via reduction of thermal transfer inhibiting interfaces.

System And Method For Evaluating Concussion Injuries

US Patent:
2015003, Feb 5, 2015
Filed:
Jul 10, 2014
Appl. No.:
14/327906
Inventors:
- Ithaca NY, US
Andrew Brindle - Clay NY, US
International Classification:
A61B 5/00
G06F 19/00
A61B 5/16
US Classification:
600301
Abstract:
A portable and cost-effective method and system for evaluating a subject's concussion symptoms, testing their cognitive and motor abilities, and evaluating those abilities when performed concurrently.

Possible Relatives

David L Brindle  Daniel C Brindle  Donald A Brindle  Gary Brindle  Gayle R Brindle  Helen I Brindle  Jaclyn M Brindle  Andrew T Last  Andrew R Johnson  Andrew P Stanco 

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