Andrew Justin Shapiro, 44Woodland Hills, CA

7787818, Aug 31, 2010

Mar 27, 2007

11/691929

Andrew J. Shapiro - Los Angeles CA, US
Seth M. Skolnik - Los Angeles CA, US

ioCast LLC - Tiburon CA

H04H 20/71
H04H 40/00
H04M 3/42
H04K 11/00

455 301, 455 306, 4554141, 455344

A method and system for providing customized content for a plurality of users is provided. In one embodiment, the method may comprise receiving user information from a plurality of users including location information of each user. For each of the plurality of users, the method may include constructing first compilation data that includes information of a first plurality of content elements and wherein the first compilation data constructed for each use may be different. For each of the plurality of users, the method may further include presenting the content elements of the first compilation data to each of the plurality of respective users. The first compilation data may be constructed from a first template, and the method may further comprise receiving feedback from a set of the users, modifying the respective first template of the set of users based on the feedback, and constructing second compilation data that includes information of a second plurality of content elements for the set of users. Finally, the content elements may be scheduled to be transmitted to the user device, such as a mobile telephone, according to rules configured to reduce peak communications network utilization.

8498628, Jul 30, 2013

Mar 27, 2007

11/691952

Andrew J. Shapiro - Los Angeles CA, US
Seth M. Skolnik - Los Angeles CA, US

Iocast LLC - Tiburon CA

H04L 29/06
H04M 1/725
H04W 4/00
H04N 7/16

4554143, 4554122, 4554261, 725135, 725136

A method and system for delivering content to a plurality of devices is provided. In one embodiment, the method may be for delivering content elements of one or more presentations to a device configured to communicate via a wireless data network, wherein the content elements include static content elements, dynamic content elements, and on-demand content elements. The method may comprise delivering to the device, data, such as compilation data, of the content elements included in the one or more presentations; delivering the static content elements to the device via the wireless data network during one or more time periods of increased available wireless data network capacity; delivering the dynamic content elements to the device via the wireless data network substantially according to a schedule; and delivering the on-demand content elements to the device via the wireless data network substantially immediately after a user request for an on-demand content element. In addition, the method may comprise determining that the device is accessible via a communication link, such as a wireless local area network, that does not include the wireless data network and delivering one or more content elements to the device via the communication link. Further, the method may comprise determining that the device is communicatively coupled to an internet access device and delivering one or more content elements to the device via the internet access device.

2013013, Jun 6, 2013

Nov 16, 2012

13/679674

California Institute of Technology - Pasadena CA, US
Gregory L. Davis - Pasadena CA, US
Gregory S. Agnes - Valencia CA, US
Andrew A. Shapiro - Glendale CA, US

California Institute of Technology - Pasadena CA

G02B 5/08
B23P 11/00
B21D 26/053
B05D 5/06
B23K 26/22
B23P 15/00
C25D 7/08
B21K 23/00
B21D 26/14

156330, 29592, 72364, 29428, 72 54, 72 56, 21912164, 295274, 205116, 164 47, 427162, 228101, 419 1, 164113, 164 98, 164492, 164498, 164480, 2281121, 427455

A mirror or mirror assembly fabricated by molding, pressing, assembling, or depositing one or more bulk metal glass (BMG), bulk metal glass composite (BMGMC), or amorphous metal (AM) parts and where the optical surface and backing of the mirror can be fabricated without machining or polishing by utilizing the unique molding capabilities of this class of materials.

5312674, May 17, 1994

Jul 31, 1992

7/923409

Carol Haertling - Santa Ana CA
Andrew A. Shapiro - Orange CA
Charles A. Goodman - Garden Grove CA
Ramona G. Pond - Downey CA
Robert D. Washburn - Malibu CA
Robert F. McClanahan - Valencia CA
Carlos H. Gonzalez - La Mirada CA
David M. Lusher - Gardena CA

Hughes Aircraft Company - Los Angeles CA

B32B 900

428210

A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20) is applied to the surfaces of LTCC tape sheets (12,14,16) to form desired elements such as cores for inductors (22) and transformers and magnetic shields. Ferromagnetic vertical interconnects (vias) (54) can be formed by punching holes (56) through tape sheets (46) and filling them with ferromagnetic ink. The tape sheets (12,14,16) and ferromagnetic elements (18,20) are laminated together and cofired to form an integral structure (10). Ferromagnetic and non-magnetic components (114) can be fabricated separately and inserted into cavities (104a, 106a,108a) in tape sheets (104,106,108) prior to cofiring. A multi-layer transformer (250) includes primary (254b, 256b,258b,254d,256d,258d) and secondary (254c,256c,258c) coils, each being formed of vertically aligned, arcuate conductors which are printed on separate tape sheets (254,256,258) and vertically interconnected at their ends to form continuous electrical paths therethrough.

5532667, Jul 2, 1996

Oct 11, 1995

8/541170

Carol Haertling - Santa Ana CA
Andrew A. Shapiro - Orange CA
Charles A. Goodman - Garden Grove CA
Ramona G. Pond - Downey CA
Robert D. Washburn - Malibu CA
Robert F. McClanahan - Valencia CA
Carlos H. Gonzalez - La Mirada CA
David M. Lusher - Gardena CA

Hughes Aircraft Company - Los Angeles CA

H01F 1704
H01F 2730

336177

A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20) is applied to the surfaces of LTCC tape sheets (12,14,16) to form desired elements such as cores for inductors (22) and transformers and magnetic shields. Ferromagnetic vertical interconnects (vias) (54) can be formed by punching holes (56) through tape sheets (46) and filling them with ferromagnetic ink. The tape sheets (12,14,16) and ferromagnetic elements (18,20) are laminated together and cofired to form an integral structure (10). Ferromagnetic and non-magnetic components (114) can be fabricated separately and inserted into cavities (104a,-106a,108a) in tape sheets (104,106,108) prior to cofiring. A multi-layer transformer (250) includes primary (254b,-256b,258b,254d,256d,258d) and secondary (254c,256c,258c) coils, each being formed of vertically aligned, arcuate conductors which are printed on separate tape sheets (254,256,258) and vertically interconnected at their ends to form continuous electrical paths therethrough.

5661647, Aug 26, 1997

Jun 7, 1995

8/473411

Robert D. Washburn - Malibu CA
Robert F. McClanahan - Valencia CA
Andrew A. Shapiro - Orange CA
Ramona G. Pond - Downey CA
Gerald P. Chernicky - Fountain Valley CA
William J. Council - Newbury Park CA
Earl H. Martin - Moorpark CA

Hughes Electronics - Los Angeles CA

H02M 100
B32B 900

363147

Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.

5055966, Oct 8, 1991

Dec 17, 1990

7/628784

Hal D. Smith - Rancho Palos Verdes CA
Robert F. McClanahan - Valencia CA
Andrew A. Shapiro - Orange CA
George Pelzman - Segundo CA

Hughes Aircraft Company - Los Angeles CA

H01L 3902
H05K 500
H01G 410

361321

A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.

5164699, Nov 17, 1992

Dec 17, 1990

7/628813

Hal D. Smith - Rancho Palos Verdes CA
Robert F. McClanahan - Valencia CA
Andrew A. Shapiro - Orange CA
Raymond Brown - Fountain Valley CA

Hughes Aircraft Company - Los Angeles CA

H01C 1012

338310

Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.