BackgroundCheck.run
Search For

Andy T Tran, 40Minneapolis, MN

Known as:
Andy Z Tran Andy Pran
Related to:
Joseph Phat Tran 66

Andy Tran Phones & Addresses

Minneapolis, MN   

Ames, IA   

1814 Myrtle St, Sioux City, IA 51103   

Plano, TX   

Tyler, TX   

Flint, TX   

Dallas, TX   

1604 Endicott Dr, Plano, TX 75025   

Work

Company: Texas trust credit union Address: 109 W Fm 1382, Cedar Hill, TX 75104 Phones: 972-2635171 Position: Manager Industries: Credit Unions, Federally Chartered

Education

Degree: High school graduate or higher
Get Report
Control this profile

Mentions for Andy T Tran

Career records & work history

Medicine Doctors

Andy H. Tran

Specialties:
Cardiovascular Disease, Clinical Cardiac Electrophysiology
Work:
Cardiovascular Consultants LtdCardiovascular Consultants LTD
18700 N 64 Dr STE 101, Glendale, AZ 85308
602-8678644 (phone) 602-6065128 (fax)
Site
Cardiovascular Consultants LtdCardiovascular Consultants LTD
3805 E Bell Rd STE 3100, Phoenix, AZ 85032
602-8678644 (phone) 602-4943688 (fax)
Site
Cardiovascular Consultants LtdCardiovascular Consultants
8575 E Princess Dr STE 115, Scottsdale, AZ 85255
480-5381355 (phone) 602-7955698 (fax)
Site
Education:
Medical School
St. George's University School of Medicine, St. George's, Greneda
Graduated: 1998
Procedures:
Cardioversion, Echocardiogram, Pacemaker and Defibrillator Procedures, Angioplasty, Cardiac Catheterization, Cardiac Stress Test, Continuous EKG, Electrocardiogram (EKG or ECG)
Conditions:
Atrial Fibrillation and Atrial Flutter, Cardiac Arrhythmia, Cardiomyopathy, Conduction Disorders, Paroxysmal Supreventricular Tachycardia (PSVT), Abdominal Aortic Aneurysm, Acute Bronchitis, Acute Myocardial Infarction (AMI), Acute Pharyngitis, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Alzheimer's Disease, Anemia, Angina Pectoris, Anxiety Phobic Disorders, Aortic Regurgitation, Aortic Valvular Disease, Arterial Thromboembolic Disease, Atherosclerosis, Bronchial Asthma, Chronic Renal Disease, Cirrhosis, Congenital Anomalies of the Heart, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Endocarditis, Fractures, Dislocations, Derangement, and Sprains, Gastroesophageal Reflux Disease (GERD), Heart Failure, Hemorrhagic stroke, HIV Infection, Hypertension (HTN), Hypothyroidism, Ischemic Heart Disease, Malignant Neoplasm of Female Breast, Migraine Headache, Mitral Valvular Disease, Multiple Sclerosis (MS), Obstructive Sleep Apnea, Overweight and Obesity, Pericardidtis, Peripheral Nerve Disorders, Pneumonia, Pulmonary Embolism, Rheumatoid Arthritis, Septicemia, Skin and Subcutaneous Infections, Substance Abuse and/or Dependency, Thoracid Aortic Aneurysm, Transient Cerebral Ischemia, Valvular Heart Disease, Varicose Veins, Venous Embolism and Thrombosis
Languages:
Chinese, English, Spanish
Description:
Dr. Tran graduated from the St. George's University School of Medicine, St. George's, Greneda in 1998. He works in Phoenix, AZ and 2 other locations and specializes in Cardiovascular Disease and Clinical Cardiac Electrophysiology. Dr. Tran is affiliated with Abrazo Scottsdale Campus, Banner Thunderbird Medical Center, HonorHealth Deer Valley Medical Center, HonorHealth John C Lincoln Medical

Andy D. Tran

Specialties:
Pulmonary Disease, Internal Medicine
Work:
St Jude Heritage Medical GroupSaint Jude Heritage Medical Group
2141 N Hbr Blvd STE 25000, Fullerton, CA 92835
714-6268603 (phone) 714-6268696 (fax)
Site
Andy Tran MD
6434 E Hightree Ln, Orange, CA 92867
714-8584780 (phone) 714-9213096 (fax)
Education:
Medical School
St. George's University School of Medicine, St. George's, Greneda
Graduated: 2000
Conditions:
Acute Myocardial Infarction (AMI), Anemia, Bronchial Asthma, Chronic Bronchitis, Chronic Renal Disease, Heart Failure, Hemorrhagic stroke, Ischemic Heart Disease, Ischemic Stroke, Pneumonia, Pulmonary Embolism, Septicemia, Acute Bronchitis, Acute Renal Failure, Alzheimer's Disease, Atrial Fibrillation and Atrial Flutter, Bacterial Pneumonia, Benign Prostatic Hypertrophy, Calculus of the Urinary System, Cardiac Arrhythmia, Cardiomyopathy, Diabetes Mellitus (DM), Diverticulitis, Emphysema, Epilepsy, Esophagitis, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Hypertension (HTN), Intestinal Obstruction, Malignant Neoplasm of Female Breast, Mitral Valvular Disease, Obstructive Sleep Apnea, Skin and Subcutaneous Infections, Venous Embolism and Thrombosis
Languages:
English
Description:
Dr. Tran graduated from the St. George's University School of Medicine, St. George's, Greneda in 2000. He works in Orange, CA and 1 other location and specializes in Pulmonary Disease and Internal Medicine. Dr. Tran is affiliated with Community Hospital Of Huntington Park and Saint Jude Medical Center.

Andy Tran

Specialties:
Family Medicine
Work:
Mohawk Valley Health System Medical GroupSister Rose Vincent Family Medicine Center
120 Hobart St, Utica, NY 13501
315-7981149 (phone) 315-7343565 (fax)
Site
Education:
Medical School
Ross Univ, Sch of Med, Roseau, Dominica
Graduated: 2010
Languages:
English, Korean, Spanish
Description:
Dr. Tran graduated from the Ross Univ, Sch of Med, Roseau, Dominica in 2010. He works in Utica, NY and specializes in Family Medicine. Dr. Tran is affiliated with St Elizabeth Medical Center.

Andy Tran

Specialties:
Internal Medicine
Work:
Fairview Internal MedicineUniversity Fairview General Internal Medicine
101 S Fairview Rd, Columbia, MO 65203
573-8824464 (phone) 573-8848142 (fax)
Site
Languages:
English
Description:
Dr. Tran works in Columbia, MO and specializes in Internal Medicine. Dr. Tran is affiliated with University Hospital.

Andy Tran

Specialties:
Family Medicine
Work:
Hawkeye Medical
4239 Hwy 1192 STE 100, Marksville, LA 71351
318-2530866 (phone) 318-2530864 (fax)
Languages:
English
Description:
Dr. Tran works in Marksville, LA and specializes in Family Medicine. Dr. Tran is affiliated with Avoyelles Hospital.
Andy Tran Photo 1

Andy Van Tran

Specialties:
Family Medicine
General Practice
Education:
Louisiana State University at Shreveport (1996)

License Records

Andy Dong Tran

Address:
3120 Glory Ln, Plano, TX 75025
Phone:
214-6043022
Licenses:
License #: 1332432 - Active
Category: Cosmetology Manicurist
Expiration Date: Jan 6, 2018

Andy T Tran

Phone:
330-2567193
Licenses:
License #: 1626903 - Expired
Category: Cosmetology Manicurist
Expiration Date: Mar 17, 2016

Andy Tran

Licenses:
License #: 78206 - Expired
Category: Nursing Support
Issued Date: Feb 12, 2014
Effective Date: Apr 12, 2016
Expiration Date: Feb 12, 2016
Type: Medication Aide

Andy Hoang Tran

Licenses:
License #: MT043798T - Expired
Category: Medicine
Type: Graduate Medical Trainee

Publications & IP owners

Us Patents

Flat No-Lead Packages With Electroplated Edges

US Patent:
2019029, Sep 26, 2019
Filed:
May 30, 2019
Appl. No.:
16/427172
Inventors:
- Dallas `T, US
Alok Kumar Lohia - Dallas TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H01L 23/495
H01L 23/00
H01L 21/48
H01L 23/367
H01L 23/29
Abstract:
A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals.A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals. The exposed thermal pad and the back side of the terminals each include a contact region which lacks the plating layer.

Semiconductor Package With Interconnected Leads

US Patent:
2018027, Sep 27, 2018
Filed:
Mar 23, 2018
Appl. No.:
15/934516
Inventors:
- Dallas TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H01L 23/495
H01L 21/48
H01L 23/31
Abstract:
A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality of contact pads. Each of a first plurality of leads includes a top portion and a bottom portion. The top portion of each of the first plurality of leads is electrically connected to a contact pad of the plurality of contact pads. Each of a second plurality of leads includes a top portion and a bottom portion and an interconnection portion between the top portion and the bottom portion. The top portion of each of the second plurality of leads includes separate finger portions that are electrically connected to at least two of the plurality of contact pads.

Flat No-Lead Packages With Electroplated Edges

US Patent:
2017016, Jun 8, 2017
Filed:
Feb 21, 2017
Appl. No.:
15/438533
Inventors:
- DALLAS TX, US
Alok Kumar Lohia - Dallas TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H01L 23/495
Abstract:
A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals. A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals. The exposed thermal pad and the hack side of the terminals each include a contact region which lacks the plating layer.

Flat No-Lead Packages With Electroplated Edges

US Patent:
2017006, Mar 2, 2017
Filed:
May 24, 2016
Appl. No.:
15/162807
Inventors:
- Dallas TX, US
ALOK KUMAR LOHIA - DALLAS TX, US
ANDY QUANG TRAN - GRAND PRAIRIE TX, US
International Classification:
H01L 23/495
H01L 23/367
H01L 23/29
H01L 23/00
Abstract:
A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals. A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals. The exposed thermal pad and the back side of the terminals each include a contact region which lacks the plating layer.

Exposed Pad Integrated Circuit Package

US Patent:
2016028, Sep 29, 2016
Filed:
Mar 27, 2015
Appl. No.:
14/671727
Inventors:
- Dallas TX, US
Alok Kumar Lohia - Dallas TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H05K 1/18
G06T 7/00
H04N 7/18
H05K 3/30
Abstract:
An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.

Packaged Semiconductor Device Having Stacked Attached Chips Overhanging The Assembly Pad

US Patent:
2016023, Aug 11, 2016
Filed:
Apr 15, 2016
Appl. No.:
15/099864
Inventors:
- Dallas TX, US
Reynaldo Corpuz Javier - Plano TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H01L 23/495
H01L 21/48
H01L 21/56
H01L 23/31
Abstract:
A semiconductor device comprising a stack of semiconductor chips. The semiconductor chips have an electrically active side and an opposite electrically inactive side. The active sides bordered by an edge having first lengths and the inactive sides bordered by a parallel edge having a second lengths smaller than the first lengths. A substrate has an assembly pad bordered by a linear edge having a third length equal to or smaller than the first lengths. The inactive chip side attached to the pad so that the edge of the first lengths are parallel to the edge of the third length. The active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first lengths.

Packaged Semiconductor Device Having Attached Chips Overhanging The Assembly Pad

US Patent:
2016018, Jun 23, 2016
Filed:
Dec 23, 2014
Appl. No.:
14/580836
Inventors:
- Dallas TX, US
Reynaldo Corpuz Javier - Plano TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H01L 23/495
H01L 25/00
H01L 23/00
H01L 21/78
H01L 21/56
Abstract:
A semiconductor device () comprising a semiconductor chip () has an electrically active side () and an opposite electrically inactive side (); the active side bordered by an edge having a first length (), and the inactive side bordered by a parallel edge having a second length () smaller than the first length; a substrate has an assembly pad () bordered by a linear edge having a third length () equal to or smaller than the first length; the inactive chip side attached to the pad so that the edge of the first length is parallel to the edge of the third length; the active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first length.

Packaged Semiconductor Devices Having Solderable Lead Surfaces Exposed By Grooves In Package Compound

US Patent:
2016007, Mar 10, 2016
Filed:
Sep 15, 2015
Appl. No.:
14/854651
Inventors:
- Dallas TX, US
Reynaldo Corpuz Javier - Plano TX, US
Andy Quang Tran - Grand Prairie TX, US
International Classification:
H01L 23/495
H01L 23/29
H01L 21/78
H01L 23/31
H01L 21/48
H01L 21/56
Abstract:
A semiconductor device has a leadframe with a pad and a row of elongated leads with a solderable surfaces in a common plane; a package encapsulating the leadframe with an assembled semiconductor device, leaving the common-plane lead surfaces un-encapsulated and coplanar with the package material between adjacent leads, the row of aligned leads positioned along a package edge; and grooves in the package material cut in the common-plane surface, the grooves extend along a portion of each lead length, have a width and a depth about twice the width, and expose solderable lead surfaces.

Possible Relatives

Cynthia Tran  David C Tran  Davis D Tran  Dawn N Tran  De M Tran  Deanna H Tran  Dai N Tran  Andy Johnson  Andy J Stanek  Andy White 

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.