Inventors:
Po-Shou Liao - Keelung, TW
Benny Huang - Jhonghe, TW
Charles Lai - Taipei, TW
Jimmy Liao - Erlin Township, TW
Bing Li - Fremont CA, US
Peter Eldredge - Scotts Valley CA, US
Leslie F. Smith - Puyallup WA, US
Felix Lai - Jhongjheng District, TW
Sino Ho - Hsinchu, TW
Ellis E-Li Chang - Saratoga CA, US
Sandeep Bhagwat - Milpitas CA, US
Anthony Cheung - Milpitas CA, US
Michael J. Bellon - Gilroy CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G06F 17/50
G06F 12/00
G06F 19/00
Abstract:
An extensible data analysis system for analyzing integrated circuit fabrication data produced during integrated circuit fabrication, including an application tier that selectively runs analysis nodes. The application tier has an architecture for optionally including and excluding a desired selection of the analysis nodes. The application tier architecture allows the selection of the analysis nodes to be dynamically added by a user. A data access tier selectively runs data reader nodes. The data access tier has an architecture for optionally including and excluding a desired selection of the data reader nodes. The data reader nodes interpret a desired variety of data source files containing the integrated circuit fabrication data having different formats for access by the application tier. The data access tier architecture allows the selection of the data reader nodes to be dynamically added by the user.