Arvind Arvind Sinha, 66216 Ridge Creek Dr, Cary, NC 27560

7068510, Jun 27, 2006

Dec 4, 2003

10/728299

Martin Joseph Crippen - Apex NC, US
Pat Gallarelli - Pittsboro NC, US
Benjamin Michael Kreuz - Austin TX, US
Arvind Kumar Sinha - Rochester MN, US

International Business Machines Corporation - Armonk NY

H05K 7/20

361702, 361704, 257716, 165 803

A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.

7303443, Dec 4, 2007

Oct 12, 2006

11/548789

Brian Samuel Beaman - Apex NC, US
Joseph Kuczynski - Rochester MN, US
Theron Lee Lewis - Rochester MN, US
Amanda Elisa Ennis Mikhail - Rochester MN, US
Arvind Kumar Sinha - Rochester MN, US

International Business Machines Corporation - Armonk NY

H01R 24/00

439637

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

7472477, Jan 6, 2009

Oct 12, 2006

11/548797

Brian Samuel Beaman - Apex NC, US
Joseph Kuczynski - Rochester MN, US
Theron Lee Lewis - Rochester MN, US
Amanda Elisa Ennis Mikhail - Rochester MN, US
Arvind Kumar Sinha - Rochester MN, US

International Business Machines Corporation - Armonk NY

H05K 3/34

29840, 29843, 29876, 29739, 29760, 39637

The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly attach to surface connections on a printed circuit board. An elongated housing is formed comprising at least two members that are coupled together and disposed to form an aperture in between the at least two members. At least one dimension of the at least two members is selected to compensate for a difference between coefficients of thermal expansion between the socket and the printed circuit board. The at least two members and the surface mounted contacts are aligned with the printed circuit board using a clip. In response to completing a solder reflow process, the clip is removed and a module is inserted into the aperture.

7530853, May 12, 2009

Oct 1, 2007

11/865103

Brian Samuel Beaman - Apex NC, US
Joseph Kuczynski - Rochester MN, US
Theron Lee Lewis - Rochester MN, US
Amanda Elisa Ennis Mikhail - Rochester MN, US
Arvind Kumar Sinha - Rochester MN, US

International Business Machines Corporation - Armonk NY

H01R 24/00

439637, 29884

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

7632127, Dec 15, 2009

Apr 10, 2008

12/100480

Brian Samuel Beaman - Apex NC, US
Joseph Kuczynski - Rochester MN, US
Theron Lee Lewis - Rochester MN, US
Amanda Elisa Ennis Mikhail - Rochester MN, US
Arvind Kumar Sinha - Rochester MN, US

International Business Machines Corporation - Armonk NY

H01R 13/62

439327, 439637, 439701, 439717

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.