Benjamin V Fasano, 71Wall Township, NJ

6354844, Mar 12, 2002

Dec 13, 1999

09/459552

Patrick A. Coico - Fishkill NY
Benjamin V. Fasano - New Windsor NY

International Business Machines Corporation - Armonk NY

H01R 1200

439 66, 439 74, 439260, 439525

A Land Grid Array electronic package having an array of contact pads is connected to a corresponding array of contact pads on a circuit board through a matching array of conductive pins of a flexible interposer. Alignment of the electronic package to the flexible interposer and flexible interposer to the circuit board is obtained by registration of alignment components to the contact pads and conductive pins. A pair of alignment components, such as pin-like alignment structures, on selected pads of both the electronic package and circuit board mate within alignment holes at the sites of corresponding pin locations in said flexible interposer. Alternatively, the pin-like alignment structures on the electronic package can be extended to pass through the said alignment holes of said flexible interposer into alignment holes which replace the pin-like alignment structure on said circuit board.

6391669, May 21, 2002

Jun 21, 2000

09/598426

Benjamin V. Fasano - New Windsor NY
Hai P. Longworth - Poughkeepsie NY
Anthony L. Plachy - Crompond NY
Robert N. Wiggin - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

G01R 3104

438 18, 29593

Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures in multilayer substrates, such as are employed in chip carrier packaging, so as to facilitate electrical testing for via to via alignment and interface layer alignment, and to enable the testing of conductive interface electrical integrity of multilayer electrical devices.

6407927, Jun 18, 2002

Aug 31, 1999

09/387325

Benjamin V. Fasano - New Windsor NY

International Business Machines Corporation - Armonk NY

H05K 702

361760, 361743, 361719, 361762, 439591, 439 66

A method and connecting structure includes a first surface and a connection pad on said first surface, wherein, said first surface includes an opening adjacent to said connection pad, and wherein, upon sufficient stress, said opening forms a flap allowing a portion of said connection pad to separate from said first surface.

6436332, Aug 20, 2002

Nov 2, 2000

09/705139

Benjamin V. Fasano - New Windsor NY
Robert A. Rita - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

C04B 35195

264619, 264614, 264650, 264670, 264681, 501 63, 501 66, 501 69, 501 72, 419 19

The dielectric constant of low loss tangent glass-ceramic compositions, such as cordierite-based glass ceramics, is modified over a range by selective addition of high dielectric constant ceramics, such as titanates, tantalates and carbides and metals, such as copper. The low loss tangent is retained or improved over a range of frequencies, and the low CTE of the glass-ceramic is maintained. BaTiO , SrTiO and Ta O produce the most effective results.

6521355, Feb 18, 2003

Sep 6, 2000

09/656089

Benjamin V. Fasano - New Windsor NY
James N. Humenik - Lagrangeville NY
David C. Long - Wappingers Falls NY
Cynthia J. Calli - Newburgh NY

International Business Machines Corporation - Armonk NY

B21D 3900

428621, 428620, 428624, 427 96

A coating material used in the fabrication of electronic components such as a metallized paste is provided comprising a material to be coated on the electronic component substrate and an identifying component which identifying component can be identified and which identifying component identifies the coating material. Optical dyes visible to the eye can be used as the identifying component with a preferred dye being a UV fluorescent dye which is colorless under visible light and visible under UV light. A process for making an electronic component using the coating materials of the invention and electronic components made using the coating material are also provided.

6552529, Apr 22, 2003

Dec 17, 2001

10/022270

Benjamin V. Fasano - New Windsor NY
Mark G. Courtney - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

G01R 2708

3241581, 324715, 438 12

A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.

6703560, Mar 9, 2004

Apr 19, 2001

09/838454

Patrick Anthony Coico - Fishkill NY
James H. Covell - Poughkeepsie NY
Benjamin V. Fasano - New Windsor NY
Lewis S. Goldman - Bedford NY
Ronald L. Hering - Pleasant Valley NY
Sundar M. Kamath - San Jose CA
Kenneth Charles Marston - Wappingers Falls NY
Frank Louis Pompeo - Redding CT
Karl J. Puttlitz - Wappingers Falls NY
Jeffrey Allen Zitz - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

H01L 2302

174 524, 257704

An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

6835260, Dec 28, 2004

Oct 4, 2002

10/265516

Benjamin V. Fasano - New Windsor NY
David H. Gabriels - Cold Spring NY
Richard F. Indyk - Wappingers Falls NY
Glenn A. Pomerantz - Kerhonkson NY
Richard A. Shelleman - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

B32B 3118

156 8911, 156 8912, 156 8916, 156268, 156289

Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.