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Biju Sam Philip, 57Ann Arbor, MI

Known as:
Biju S Philip Philip Sam Biju Sam Philip Biju Biju Jaya Philip Philip S Biju Biji Philip Biju S Philp Philip Biji Biju Phillip
Related to:
Diyana A Philip 26

Biju Philip Phones & Addresses

Ann Arbor, MI   

Troy, MI   

Macomb, MI   

Euless, TX   

Bedford, TX   

Hurst, TX   

Sterling Heights, MI   

Oakland, MI   

Work

Company: Diversitak inc - Detroit, MI May 2000 Position: Technical manager - formulated adhesive division

Education

School / High School: BARKATULLAH UNIVERSITY- Bhopal, Madhya Pradesh 1990 Specialities: Master of Science in Organic Chemistry
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Biju Philip resumes & CV records

Resumes

Biju Philip Photo 28

Senior Chemist

Location:
80 Biltmore Dr, Troy, MI 48084
Industry:
Internet
Work:
Sika Usa
Senior Chemist Cmi Jan 2016 - Jun 2018
Consultant - Polymer and Composite Technologies Leadership For Product Development Adhesive Chemists In the Dallas/Fort Worth Area Jan 2016 - Jun 2018
Founder | Product Development Adhesive Chemist Diversitak 2000 - 2014
Product Development Technical Manager Huron Metallurgical 1999 - 2000
Quality Assurance Manager Coat-It 1994 - 1999
Chemist
Education:
Brookhaven Community College 2016 - 2017
Associates Brookhaven Community College 2000 - 2004
Associates
Skills:
Project Management, Manufacturing, Product Development, Customer Service, Microsoft Office, Process Improvement, Lean Manufacturing, Automotive, Strategic Planning, Microsoft Excel, Adhesive Chemistry
Biju Philip Photo 29

Biju Philip

Biju Philip Photo 30

Biju Philip

Location:
United States
Biju Philip Photo 31

Biju Philip

Biju Philip Photo 32

Biju Philip

Biju Philip Photo 33

Biju Philip

Biju Philip Photo 34

Biju Philip

Biju Philip Photo 35

Biju Philip - Bedford, TX

Work:
DIVERSITAK INC - Detroit, MI May 2000 to Mar 2014
Technical Manager - Formulated Adhesive Division HURON METALLURGICAL INC - Belleville, MI Oct 1999 to Apr 2000
Q.A. Manager / QS 9000 Coordinator COAT-IT, INC - Detroit, MI May 1994 to Sep 1999
Chemist
Education:
BARKATULLAH UNIVERSITY - Bhopal, Madhya Pradesh 1990
Master of Science in Organic Chemistry UNIVERSITY OF DETROIT MERCY - Detroit, MI
Master of Science in Chemistry

Publications & IP owners

Us Patents

Non-Polyvinyl Chloride, Interpenetrating Network Epoxy/Urethane Acrylates

US Patent:
2003011, Jun 26, 2003
Filed:
Apr 19, 2002
Appl. No.:
10/126197
Inventors:
Rajan Eadara - Ann Arbor MI, US
Roy Jacob - Troy MI, US
Yushin Ahn - Farmington Hills MI, US
Biju Philip - Sterling Heights MI, US
Jori Joseff - Mount Pleasant SC, US
Assignee:
Diversified Chemical Technologies, Inc. - Detroit MI
International Classification:
C08F008/00
US Classification:
525/107000
Abstract:
The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Constrained Layer, Composite, Acoustic Damping Material

US Patent:
2006004, Feb 23, 2006
Filed:
Aug 18, 2005
Appl. No.:
11/207160
Inventors:
Rajan Eadara - Ann Arbor MI, US
Roy Jacob - Troy MI, US
Anthony Konovaliv - Plymouth MI, US
Arnold Joseff - Bloomfield Hills MI, US
Biju Philip - Sterling Heights MI, US
International Classification:
B32B 7/02
US Classification:
428212000
Abstract:
A constrained layer, composite structure for damping acoustic vibrations includes an extensional layer comprised of a first polymeric material, and a constraining layer of a second polymeric material. The modulus of elasticity of the constraining layer is greater than that of the extensional layer. In use, the structure is disposed on the surface of an article in which acoustic vibrations are to be damped so that the extension layer overlies the surface. Also disclosed are methods for preparing the structure, including automated methods.

Constrained Layer, Composite, Acoustic Damping Material

US Patent:
2009027, Nov 12, 2009
Filed:
Jun 10, 2009
Appl. No.:
12/481666
Inventors:
Rajan Eadara - Ann Arbor MI, US
Roy Jacob - Troy MI, US
Anthony Konovaliv - Plymouth MI, US
Arnold Joseff - Bloomfield Hills MI, US
Biju Philip - Sterling Heights MI, US
International Classification:
E04B 1/82
US Classification:
181290
Abstract:
A constrained layer, composite structure for damping acoustic vibrations includes an extensional layer comprised of a first polymeric material, and a constraining layer of a second polymeric material. The modulus of elasticity of the constraining layer is greater than that of the extensional layer. In use, the structure is disposed on the surface of an article in which acoustic vibrations are to be damped so that the extension layer overlies the surface. Also disclosed are methods for preparing the structure, including automated methods.

Sprayable, Carbon Fiber-Epoxy Material And Process

US Patent:
2015032, Nov 12, 2015
Filed:
Apr 30, 2015
Appl. No.:
14/700771
Inventors:
- Detroit MI, US
Biju Philip - Euless TX, US
Roy Jacob - Troy MI, US
Joribeth Joseff - Bloomfield Hills MI, US
Arnold Joseff - Bloomfield Hills MI, US
International Classification:
C08J 5/04
B05D 7/14
B05D 1/02
Abstract:
An article is reinforced by applying to it a thermally curable composition of a resin mixture of 10% to 60% by weight of a diglycidyl ether of bisphenol-A, 5% to 25% by weight of an epoxy novolac, and 5% to 25% by weight of a reinforcement material comprising carbon fibers. Following application, the composition is cured. In some instances, at least a portion of the diglycidyl ether of bisphenol-A and/or the epoxy phenyl novolac resin may be adducted with an elastomer.

Possible Relatives

Cynthia A Philip  Debra Philip  Denise A Philip  Darren A Philip  Dora A Philip  Earl R Philip  George W Philip  Biju K Stephen  Biju Mathews  Biju Nair 

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