Boon Carrie C Wong, 755525 Lorna St, Torrance, CA 90503

6742248, Jun 1, 2004

May 14, 2001

09/855233

Boon Wong - Torrance CA
Robert E. Silhavy - Redondo Beach CA
Jennifer Shinno - S. Pasadena CA

The Boeing Company - Seattle WA

H05K 334

29840, 29832, 29830, 29874, 174250, 174261, 22818021, 22818022, 428632, 257737, 257738

A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.

5308578, May 3, 1994

Feb 10, 1993

8/015875

Boon Wong - Canoga Park CA

Hughes Aircraft Company - Los Angeles CA

C22C 1300

420558

The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with about 0. 1 to 0. 8 weight % of a dopant selected from cadmium, indium antimony and mixtures thereof. The doped eutectic solder exhibits increased resistance to thermally or mechanically induced cyclic stress and strain. As a result, the fatigue resistance of the solder joint is increased. Combination of dopants, such as indium and cadmium, in combined amounts of less than 0. 5 weight % are especially effective in increasing the fatigue resistance of the lead-tin eutectic solder.

5871684, Feb 16, 1999

Jul 17, 1997

8/896103

Tzu Guu Teng - Torrance CA
Boon Wong - Torrance CA

Hughes Electronics Corporation - Los Angeles CA

C04B 35624
B05D 512

264614

A method of making a lightweight, microwave electronic structure includes the steps of forming a rigid, glass structure having a desired density by a sol-gel process and thereafter uniformly coating the formed glass structure with an adherent and uniform conductor. The sol-gel process may be carried out by polymerizing a mixture comprising silicon alkoxide, water and an alcohol. The coating process may be carried out by coating the glass structure with a solution comprising an organic compound of a metal dissolved in an organic solvent and thereafter volatizing the organic solvent.

5360662, Nov 1, 1994

Mar 12, 1992

7/850474

Boon Wong - Canoga Park CA

Hughes Aircraft Company - Los Angeles CA

C04B 3556
B22D 1900
B32B 326

428288

Sintered ceramic preforms for metal matrix composites fabricated by a method comprising: (a) preparing a homogeneous mixture containing appropriate amounts of silicon-containing fibers/particulates, such as silicon carbide, at least one solvent, at least one polymer, and an oxide-containing material, such as boric acid or phosphoric acid, capable of forming a low melting silicate with a silicon oxide, such as a borosilicate; (b) shaping a green ceramic preform from the mixture, such as by injection molding; (c) removing the solvent(s) and the polymer(s); (d) oxidizing the surfaces of the silicon-containing fibers to form a layer of the silicon oxide thereon; (e) heating the preform to a temperature sufficient to react the oxide-containing material with the silicon oxide to form the low melting silicate material; (f) liquid phase sintering the fibers in the presence of liquid silicate material to strengthen the preform; and (g) cooling the sintered preform to ambient. The sintered ceramic preform prepared by this method is sufficiently strong to withstand pre-infiltration handling and squeeze casting to inject molten metal under pressure into the pores of the preform.

4751149, Jun 14, 1988

Mar 12, 1987

7/024871

Pantham S. Vijayakumar - Granada Hills CA
Kimberly A. Blaker - Granada Hills CA
Robert D. Wieting - Simi Valley CA
Boon Wong - Reseda CA
Arvind T. Halani - Canoga Park CA

Atlantic Richfield Company - Los Angeles CA

B32B 900
B32B 1900
C23C 1640

428702

Zinc oxide is applied to a substrate at a low temperature by using a mixture of an organozinc compound and water carried in an inert gas. The resulting zinc oxide film has a relatively low resistivity which can be varied by addition of a group III element.

4531015, Jul 23, 1985

Apr 12, 1984

6/599413

Boon Wong - Reseda CA
Don L. Morel - Agoura Hills CA
Victor L. Grosvenor - Woodland Hills CA

Atlantic Richfield Company - Los Angeles CA

H01L 3106

136258

A PIN amorphous silicon solar cell including a nitrogen compensated intrinsic inter-layer adjacent to the P type layer forming the light receiving face of the cell.

4450135, May 22, 1984

Jan 4, 1982

6/336648

Thomas E. Peters - Chelmsford MA
John C. Gustafson - Harvard MA
Boon Wong - Reseda CA

GTE Laboratories Incorporated - Waltham MA

B22F 100
B22F 300

419 12

A method of preparing electrical contacts and electrical contact materials comprises the steps of blending a conductive metallic component, such as silver, with nickel and zirconium diboride which is substantially completely free of oxides, pressing the powder mixture to form a pre-sintered compact, and thereafter liquid phase sintering the compact to a densified body. The zirconium diboride is mixed with about 2 weight percent of a reducing agent, preferably mixed carbon and boron powders, and heated to remove oxides from the surface of the zirconium diboride powder particles prior to the steps of pressing and sintering.