Bradley J Boland, 52Anderson, SC

6396130, May 28, 2002

Sep 14, 2001

09/953422

Sean T. Crowley - Phoenix AZ
Bradley D. Boland - Gilbert AZ

Amkor Technology, Inc. - Chandler AZ

H01L 23495

257666, 257675, 257706, 257707

A thin, thermally efficient, lead frame-type of semiconductor package incorporating multiple dies includes a plurality of electrically conductive leads held together in a spaced, planar relationship about a central opening defined by the leads, and a plurality of thick, plate-like heat sinks supported within the opening such they are generally coplanar with each other, parallel to the plane of the leads, and electrically isolated from the leads and each other. Each of the heat sinks has a lower surface that can be exposed through the outer surface of a molded resin envelope encapsulating the package for the efficient dissipation of heat therefrom, and an upper surface having a recess formed into it. A semiconductor die is mounted in each of the recesses with its back surface in electrical connection with the floor of the recess. Each recess defines a wire bonding ring around the periphery of the upper surface of the respective heat sink immediately adjacent to the edges of the corresponding die for the bonding thereto of wires from the die and/or the leads.

6521982, Feb 18, 2003

Jun 2, 2000

09/587136

Sean T. Crowley - Phoenix AZ
Blake A. Gillett - Gilbert AZ
Bradley D. Boland - Mesa AZ

Amkor Technology, Inc. - Chandler AZ

H01L 23495

257676, 257666, 257692, 257735, 257696, 257698, 257712, 257717, 257673, 257401, 257329, 257139, 257341, 257675

The invention provides a method and apparatus for electrically connecting the die of a high power semiconductor device to a substrate with a conductive strap such that the connection is resistant to the shear stresses resulting with changes in temperature. In one embodiment, the method includes providing a substrate having first and second portions that are electrically isolated from each other. A semiconductor die having top and bottom surfaces and one or more active electronic devices formed therein is also provided. The device has a first terminal connected to a first conductive layer on the bottom surface of the die, and a second terminal connected to a second conductive layer on the top surface of the die. The first conductive layer is electrically coupled to a top surface of the first portion of the substrate. The second conductive layer is electrically coupled to the second portion of the substrate with a metal strap.

6630726, Oct 7, 2003

Nov 7, 2001

10/008048

Sean T. Crowley - Phoenix AZ
William M. Anderson - Gilbert AZ
Bradley D. Boland - Gilbert AZ
Eelco Bergman - Sunnyvale CA

Amkor Technology, Inc. - Chandler AZ

H01L 2348

257666, 257692, 257668, 361813

A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.

6707138, Mar 16, 2004

Sep 26, 2002

10/256905

Sean T. Crowley - Phoenix AZ
Blake A. Gillett - Gilbert AZ
Bradley D. Boland - Mesa AZ
Philip S. Mauri - Cabuyao, PH
Ferdinand E. Belmonte - Laguna, PH
Remigio V. Burro, Jr. - San Pedro, PH
Victor M. Aquino, Jr. - Marikina, PH

Amkor Technology, Inc. - Chandler AZ

H01L 2348

257676, 257666, 257692, 257735, 257696, 257698, 257712, 257717, 257673, 257401, 257329, 257139, 257341, 257675

A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on and electrically coupled to a top surface of the semiconductor die. An opposite, second end portion of the metal strap is on and electrically coupled to a second portion of the leadframe within a recess of the second portion of the leadframe.

6756658, Jun 29, 2004

Apr 6, 2001

09/827791

Blake A. Gillett - Gilbert AZ
Sean T. Crowley - Phoenix AZ
Bradley D. Boland - Gilbert AZ
Keith M. Edwards - Phoenix AZ

Amkor Technology, Inc. - Chandler AZ

H01L 23495

257666, 257669, 257670, 257674, 257676

A two-lead, surface-mounting, high-power micro-leadframe semiconductor package has the same outline, mounting, and electrical functionality as industry standard leadframe packages but provides a lower internal resistance, a higher package power rating, and costs less to produce. The novel package incorporates one of a rectangular array of âmicro-leadframesâ (âMLFsâ), each having parallel and respectively coplanar upper and lower surfaces etched in a plate having a uniform thickness. Each micro-leadframe includes an I-shaped die pad having a head, a foot, and opposite sides. First and second leads are disposed at the foot of the die pad, each having a side aligned with one of the sides of the pad. The second lead has an right-angled wire-bonding pad next to the die pad. A portion of a lower surface of each of the die pad and the leads is exposed through a lower surface of an envelope of plastic molded on the package to define package input/output terminals.

6873041, Mar 29, 2005

Jul 11, 2003

10/618192

Sean T. Crowley - Phoenix AZ, US
William M. Anderson - Gilbert AZ, US
Bradley D. Boland - Gilbert AZ, US
Eelco Bergman - Sunnyvale CA, US

Amkor Technology, Inc. - Chandler AZ

H01L023/48
H01L023/52

257692, 257693, 257687, 257690

A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.

6198163, Mar 6, 2001

Oct 18, 1999

9/420065

Sean Timothy Crowley - Phoenix AZ
Bradley David Boland - Mesa AZ

Amkor Technology, Inc. - Chadler AZ

H01L 2310
H01L 2334
H01L 2940
H01L 2348
H05K 720

257706

A thin, small-outline semiconductor package, and a thermally enhanced leadframe for use in it, comprise a plurality of electrically conductive leads held together in a spaced, planar relationship about a central opening defined by the leads, and a thick, plate-like heat sink made of an electrically and thermally conductive metal attached to the leads such that it is centered within the opening and parallel to the plane of the leads. The heat sink has a lower surface exposed through the outer surface of a molded resin envelope encapsulating the package for the efficient dissipation of heat therefrom, and an upper surface having a recess formed into it. The recess has a planar floor with a semiconductor die attached to it, and defines a grounding ring around the periphery of the upper surface of the heat sink immediately adjacent to the edges of the die for the down-bonding of grounding wires from the die and the leads. The package provides enhanced heat dissipating capabilities, an improved resistance to long-term penetration by moisture, and a down-bonding region that substantially shortens the length of grounding wires down-bonded thereto and substantially reduces the residual shear stress acting on the down-bonds.