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Brian L Hoekstra, 6510040 Happy Valley Rd, Scottsdale, AZ 85255

Known as:
Brian Louis Hoekstra Brian Te Hoekstra Brianl L Hoekstra Brain L Hoekstra Louis B Hoekstra Brian L Heokstra Brian L Shrf Brian A Brian Wilkus

Brian Hoekstra Phones & Addresses

10040 Happy Valley Rd, Scottsdale, AZ 85255    480-3616659   

Carmel, CA   

Phoenix, AZ   

Orlando, FL   

Buffalo, NY   

Xenia, OH   

Winter Park, FL   

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Brian Hoekstra resumes & CV records

Resumes

Brian Hoekstra Photo 29

President And General Manager

Location:
10040 east Happy Valley Rd, Scottsdale, AZ 85255
Industry:
Machinery
Work:
Skuid
Director 3D-Micromac America
President and General Manager Solavera Development Group Sep 2009 - Jun 2014
President and Owner Amtech Systems Sep 2005 - Dec 2010
Director Applied Photonics Sep 1, 1999 - Sep 1, 2009
Chief Executive Officer and President Accudyne Corporation Jan 1998 - Sep 1999
Vp, Technology Nasa Jun 1986 - Sep 1992
Deputy Director United States Air Force Jun 1983 - Jun 1986
Research Physicist
Education:
Illinois Institute of Technology 1979 - 1981
Bachelor of Applied Science, Bachelors, Bachelor of Science, Physics, Aerospace Engineering United States Air Force Academy 1977 - 1979
Clarkson University
Rochester Institute of Technology
University of Dayton
Master of Science, Masters Air Force Institute of Technology
Skills:
Laser, Semiconductors, Electronics, Optics, R&D, Manufacturing, Product Development, Business Development, Materials Science, Solar Energy, Nanotechnology, Product Management, Start Ups, Photovoltaics, Laser Physics, Laser Cutting, Management, Electro Optics, Metrology, Semiconductor Process, Photonics, Physics, Semiconductor Industry, Strategic Partnerships, Technology Solutions, Optoelectronics, Nonlinear Optics, Glass, Corporate Governance, Commercialization, Research and Development, Engineering
Interests:
Writing
Theology
Foreign Cultures and Languages
Education
Environment
History
Reading
Poverty Alleviation
Hiking
Science and Technology
Disaster and Humanitarian Relief
Human Rights
Golf
Travel
Arts and Culture
Science and the Arts
Languages:
French
English
Japanese
Korean
Brian Hoekstra Photo 30

Brian Hoekstra

Brian Hoekstra Photo 31

Brian Hoekstra

Brian Hoekstra Photo 32

Brian Hoekstra

Publications & IP owners

Us Patents

Method And Apparatus For Separating Non-Metallic Materials

US Patent:
6489588, Dec 3, 2002
Filed:
Nov 22, 2000
Appl. No.:
09/718453
Inventors:
Brian Hoekstra - Orlando FL
Roger Flannigan - Phoenix AZ
Daniel Wegerif - Merritt Island FL
Assignee:
Applied Photonics, Inc. - Orlando FL
International Classification:
B23K 2614
US Classification:
21912167, 21912168, 21912173, 21912174
Abstract:
A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.

Method And Apparatus For Separating Non-Metallic Materials

US Patent:
6660963, Dec 9, 2003
Filed:
Jul 16, 2002
Appl. No.:
10/196658
Inventors:
Brian Hoekstra - Orlando FL
Roger Flannigan - Phoenix AZ
Daniel Wegerif - Merritt Island FL
Assignee:
Applied Photonics, Inc. - Orlando FL
International Classification:
B23K 2600
US Classification:
21912172, 21912167, 21912185
Abstract:
A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.

Device, System And Method For Cutting, Cleaving Or Separating A Substrate Material

US Patent:
2007028, Dec 13, 2007
Filed:
Jun 20, 2005
Appl. No.:
11/630165
Inventors:
Brian Hoekstra - Scottsdale AZ, US
International Classification:
B29C 37/00
US Classification:
264400000, 425142000, 425174400
Abstract:
An apparatus and method for separating a nonmetallic substrate is disclosed as including a first beam; a first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot; a second beam; and a second quenching device positioned between the first quenching device and the second beam. At least one of an angle at which the first scribe beam impinges on the substrate and an energy intensity of the first scribe beam impinging on the substrate are adjusted to obtain right angle separation. A crack sensor and controller can also be provided for measuring a position of the cut line, comparing the position with a reference position and adjusting the power intensity of the second beam based on the comparison of the position of the cut line with the reference position.

Possible Relatives

Cynthia L Hoekstra  Deborah M Hoekstra  Debra Hoekstra  Daniel J Hoekstra  Denise M Hoekstra  Edward N Hoekstra  Brian W Last  Brian L Johnson  Brian M Stan 

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