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Brian D Severson, 65295 Grove St, Iola, WI 54945

Brian Severson Phones & Addresses

295 Grove St, Iola, WI 54945    715-4455977   

310 State St, Iola, WI 54945    715-4455977   

920 Apollo Ave, Tempe, AZ 85283    480-8390369   

Waupaca, WI   

Rochester, MN   

Maricopa, AZ   

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Resumes

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Publications & IP owners

Us Patents

Cmp Apparatus And Method

US Patent:
7229339, Jun 12, 2007
Filed:
Jul 2, 2004
Appl. No.:
10/884371
Inventors:
John F. Stumpf - Phoenix AZ, US
Franklin D. Root - Phoenix AZ, US
Brian Severson - Chandler AZ, US
David Marquardt - Phoenix AZ, US
John Derwood Herb - Phoenix AZ, US
James Jed Crawford - Chandler AZ, US
Rand Conner - Chandler AZ, US
Jasent Montano - Chandler AZ, US
Kevin Bertsch - Gilbert AZ, US
Robert Marshall Stowell - Wilsonville OR, US
Edmund Minshall - Sherwood OR, US
Timothy Cleary - Portland OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
B24B 5/00
US Classification:
451 8, 451 41, 451285
Abstract:
Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

Carrier Head For Workpiece Planarization/Polishing

US Patent:
7335092, Feb 26, 2008
Filed:
Oct 27, 2006
Appl. No.:
11/553580
Inventors:
Brian Severson - Chandler AZ, US
John Stumpf - Phoenix AZ, US
Stephen C. Schultz - Gilbert AZ, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
B24B 7/22
US Classification:
451288, 451388, 451398
Abstract:
A carrier head for supporting a workpiece is provided. The carrier head comprises a mount plate having an aperture therethrough, and a clamp ring having a foot portion and a first leg portion extending therefrom. The first leg portion extends through the aperture, and the foot portion abuts the mount plate proximate the aperture. A flexible bladder has first and second ribs that are received between the mount plate and the foot portion. An annular fastener is removably coupled to the leg portion, and engages the mount plate to cause the first and second ribs to be sealingly secured between the mount plate and the foot portion.

Carrier Head For Workpiece Planarization/Polishing

US Patent:
7402098, Jul 22, 2008
Filed:
Oct 27, 2006
Appl. No.:
11/553572
Inventors:
Brian Severson - Chandler AZ, US
John Stumpf - Phoenix AZ, US
Stephen C. Schultz - Gilbert AZ, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
B24B 7/22
US Classification:
451288, 451398, 451388
Abstract:
An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system comprises first and second annular ribs, each of which comprises a first end portion sealingly coupled to the carrier head housing, a second end portion coupled to the diaphragm, and a strain relief member substantially intermediate the first end portion and the second end portion. A plenum is substantially defined by the first and second annular ribs and the carrier head housing. The passage is fluidly coupled to the plenum to permit the pressurization of the plenum, and the strain relief member promotes the extension of the first and second annular ribs away from the carrier head housing when the plenum is pressurized.

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