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Benjamin Bruce Norris, 90Jacksonville, FL

Known as:
Bruce B Norris Benjamin B Norris Mary B Norris Mary A Norris Ben B Norris Benjamin Morris
Related to:
John Cosman

Benjamin Norris Phones & Addresses

Jacksonville, FL   

Greensboro, NC   

Hayward, CA   

Work

Company: Energy experts international Address: 555 Twin Dolphin Dr # 185, Redwood City, CA 94065 Phones: 650-5934261 Position: Accounting director Industries: Management Consulting Services

Education

School / High School: University of London School of Law

Ranks

Licence: New York - Currently registered Date: 2010
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Mentions for Benjamin Bruce Norris

Career records & work history

Lawyers & Attorneys

Benjamin Norris Photo 1

Benjamin David Norris - Lawyer

Address:
Clarke Gittens Farmer, Attorneys-At-Law
436-6287xxx (Office)
Licenses:
New York - Currently registered 2010
Education:
University of London School of Law
Benjamin Norris Photo 2

Benjamin Norris - Lawyer

ISLN:
1000996420
Admitted:
2021
Benjamin Norris Photo 3

Benjamin Norris - Lawyer

Office:
American Petroleum Institute
Specialties:
Energy, Antitrust & Trade Law, Environmental and Natural Resources, Litigation
ISLN:
919700022
Admitted:
2008
University:
Columbia University, B.A., 1996
Law School:
New York University School of Law, J.D., 1999

Benjamin Norris resumes & CV records

Resumes

Benjamin Norris Photo 47

Benjamin Norris

Location:
United States
Benjamin Norris Photo 48

Benjamin Norris

Location:
United States

Publications & IP owners

Us Patents

Via Bond Attachment

US Patent:
2023005, Feb 16, 2023
Filed:
Aug 13, 2021
Appl. No.:
17/401810
Inventors:
- Salt Lake City UT, US
Benjamin Norris - Santa Clara CA, US
Paul Diehl - Santa Clara CA, US
Chris Cuda - Santa Clara CA, US
International Classification:
H05K 3/46
H01R 12/52
H05K 3/00
H05K 3/40
G01R 3/00
Abstract:
A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

Possible Relatives

Cynthia Y Norris  David Norris  Dawn M Norris  Deanna L Norris  Daisy S Norris  Debbie S Norris  Dallas C Norris  Benjamin N Johnson  Benjamin H Stamps  Benjamin L Stanaland 

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