BackgroundCheck.run
Search For

Chad A Mckay, 551903 Bayside Dr, St Paul, TX 75098

Chad Mckay Phones & Addresses

1903 Bayside Dr, Wylie, TX 75098    972-4297197   

St Paul, TX   

7200 Preston Rd, Plano, TX 75024    214-4741239   

4012 Bluffmeadow Trl, Plano, TX 75023    972-5966182   

4063 Lonesome Trl, Plano, TX 75023    972-6330151   

5013 Country Place Dr, Plano, TX 75023    972-5965931    972-6330151    972-9645391   

3702 Frankford Rd, Dallas, TX 75287    972-8206040   

Richardson, TX   

Colton, TX   

4063 Lonesome Trl, Plano, TX 75023   

Emails

Mentions for Chad A Mckay

Chad Mckay resumes & CV records

Resumes

Chad Mckay Photo 31

Chad Mckay

Location:
United States
Industry:
Entertainment
Chad Mckay Photo 32

Dlp A/T Integration Manager At Texas Instruments

Position:
DLP A/T Engineering Manager at Texas Instruments
Location:
Dallas/Fort Worth Area
Industry:
Semiconductors
Work:
Texas Instruments since 2005
DLP A/T Engineering Manager
Texas Instruments 2004 - 2005
DLP WLP Integration Mgr
Texas Instruments 1995 - 2004
DM5 EE Section Manager
Texas Instruments 1995 - 1996
DM6 Plasma EE Section Manager
Texas Instruments 1992 - 1994
Equipment Engineer
Education:
The University of Texas at Austin 2000 - 2001
Masters, Business Administration
Colorado School of Mines 1987 - 1991
B.S., Engineering
Putnam City North

Publications & IP owners

Us Patents

Protective Bondline Control Structure

US Patent:
2020021, Jul 9, 2020
Filed:
Mar 16, 2020
Appl. No.:
16/820477
Inventors:
- Dallas TX, US
Chad Alan McKay - St. Paul TX, US
International Classification:
B81B 7/00
B81C 1/00
Abstract:
In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

Protective Bondline Control Structure

US Patent:
2019020, Jul 4, 2019
Filed:
Dec 29, 2017
Appl. No.:
15/859184
Inventors:
- Dallas TX, US
Chad Alan McKay - St. Paul TX, US
International Classification:
B81B 7/00
B81C 1/00
Abstract:
In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.