Charles A Poutasse, 69Davis, CA

6589381, Jul 8, 2003

Apr 10, 2001

09/829713

Charles A. Poutasse - Beachwood OH
Michael A. Centanni - Parma OH

Gould Electronics, Inc. - Eastlake OH

B32B 3100

156278, 156280, 156326, 427156, 4273885, 10628714, 10628721

In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0. 001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0. 01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.

7201784, Apr 10, 2007

Jun 30, 2003

10/611233

Anne E. Miller - Portland OR, US
Charles Poutasse - Lake Oswego OR, US

Intel Corporation - Santa Clara CA

C09G 1/02
C09G 1/04
B24B 1/00

51308, 106 3, 438692, 438693

Slurries and methods for the chemical mechanical polishing of high density copper interconnects in a low k ILD are presented. In a particular embodiment of the present invention, a slurry for polishing copper is formed by combining a surfactant comprising an alkyl ethoxy organic acid such as glycolic acid ethoxylate lauryl ether (GAELE), an abrasive such as silica, an oxidizing agent such as hydrogen peroxide, and a chelating buffer system such as citric acid and potassium citrate dissolved in the mixture. This slurry provides a very low incidence of bent line defects, a low erosion rate, and a low dishing rate on a substrate comprising high density copper interconnects in a low k ILD. Embodiments of methods of the present invention use the disclosed slurries.

RE39615, May 8, 2007

Oct 17, 2002

10/617653

Charles A. Poutasse - Lake Oswego OR, US

Nikko Materials USA, Inc. - Chandler AZ

B23B 3/00

428209, 428408, 428413, 428417, 428418, 428446, 428457, 428901, 525109, 525113

The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH, NHR, (NHC(═NH))NH, RCOOH, NR, C(O)NHR, RNR, ROH, RSH, RNHand RNHR, wherein Ris a hydrocarbon group, Ris an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R, ORor SOCH—NH; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

5629098, May 13, 1997

Oct 27, 1995

8/549197

Charles A. Poutasse - Beachwood OH
Katherine V. Sack - No. Olmsted OH
Andrea M. Kovacs - Bay Village OH
James R. Winchester - East Cleveland OH

Gould Electronics Inc. - Eastlake OH

B32B 1706
B32B 1520

428626

This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formula R--(G). sub. n (1) wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH. sub. 2, NHR. sup. 1, (NHC(. dbd. NH)). sub. m NH. sub. 2, R. sup. 2 COOH, R. sup. 2 OH, R. sup. 2 SH, R. sup. 2 NH. sub. 2 and R. sup. 2 NHR. sup. 1, wherein R. sup. 1 is a hydrocarbon group, R. sup. 2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH. sub. 2 or R. sup. 2 NH. sub. 2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(. dbd. NH)). sub. m NH. sub. 2, n is a number ranging from 1 up to the number of displaceable hydrogens on R.

6299721, Oct 9, 2001

Dec 14, 1998

9/211283

Charles A. Poutasse - Beachwood OH
Michael A. Centanni - Parma OH

Gould Electronics Incl - Eastlake OH

B32B 3100

156278

In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0. 001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0. 01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.

5614324, Mar 25, 1997

Jul 24, 1995

8/505741

Charles A. Poutasse - Beachwood OH
Richard L. Luthy - Beverly OH

Gould Electronics Inc. - Eastlake OH

B32B 2704

428447

A multi-layer structure utilized in the preparation of printed circuit boards comprises a metal foil layer, a prepreg layer containing a resin possessing carbon-carbon double bonds such as a polyimide, a polyester or a silicon-carbon resin, and an adhesion promoting layer of a non-epoxy group-containing hydrolyzable silane possessing a heterocyclic such as an imidazole or pyrrole; acryloxy, amide or a carbon-carbon double bond-containing group such as styryl.

6268070, Jul 31, 2001

Mar 12, 1999

9/266951

Tad Bergstresser - Shaker Heights OH
Charles A. Poutasse - Beachwood OH

Gould Electronics Inc. - Eastlake OH

B32B 1508

428622

A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.

6221176, Apr 24, 2001

Mar 17, 1999

9/271640

Harish D. Merchant - Hinckley OH
Charles A. Poutasse - Beachwood OH
Chin-Ho Lee - Lyndhurst OH

Gould Electronics, Inc. - Eastlake OH

C23C 2224

148264

In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18. mu. m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35. mu. m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.