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Cheryl A Field, 67645 N Fox Trl, Round Lake, IL 60073

Known as:
Cheryl Weiss
Related to:
Susan L Womack 62 Carrie A Trentadue 40

Cheryl Field Phones & Addresses

Round Lake, IL   

Mount Prospect, IL   

Skokie, IL   

Niles, IL   

Lane, IL   

645 N Fox Trl, Round Lake, IL 60073   

Work

Position: Sales Occupations

Education

Degree: Associate degree or higher

Emails

s***[email protected]
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Cheryl Field resumes & CV records

Resumes

Cheryl Field Photo 43

Vice President Healthcare At Pointright Inc.

Position:
Vice President Healthcare at PointRight Inc.
Location:
United States
Work:
PointRight Inc. since Oct 2000
Vice President Healthcare
Education:
University of Rochester
Cheryl Field Photo 44

Cheryl Field

Cheryl Field Photo 45

Cheryl Field

Skills:
Microsoft Excel
Cheryl Field Photo 46

Cheryl Field

Cheryl Field Photo 47

Cheryl Field

Cheryl Field Photo 48

Cheryl Field

Publications & IP owners

Us Patents

Method Of Separating And Handling A Thin Semiconductor Die On A Wafer

US Patent:
6772509, Aug 10, 2004
Filed:
Jan 28, 2002
Appl. No.:
10/058650
Inventors:
Shiuh-Hui Steven Chen - Lake Zurich IL
Cheryl Field - Kildeer IL
Didier R. Lefebvre - Mundelein IL
Joe Pin Wang - Long Grove IL
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01R 4300
US Classification:
29825, 295646, 29743, 29832, 257678, 257618, 264571
Abstract:
A method of separating a thin die ( ) from a support body ( ) of a semiconductor wafer ( ). The thin die ( ) being initially attached to the support body ( ) by an attachment mechanism ( ). The attachment mechanism may be a plurality of tethers ( ) that extend between the thin die ( ) and the support body ( ). The method may include the steps of: positioning the wafer ( ) on a rigid backing ( ) having a hole ( ), the hole ( ) positioned beneath the thin die ( ); positioning a tip ( ) of a handler ( ) above the thin die ( ), the tip ( ) having a passageway ( ) to a vacuum source; positioning an ejection pin ( ) in a spaced apart relationship beneath the thin die ( ); moving the tip ( ) of the handler ( ) downward toward the thin die ( ) to break the attachment mechanism ( ) and clamp the thin die ( ) between the tip ( ) of the handler ( ) and the ejection pin ( ); and moving the ejection pin ( ) upward in the direction of the tip ( ) of the handler ( ) until the thin die ( ) is extracted from the wafer ( ).

Microdevice Assembly Having A Fine Grain Getter Layer For Maintaining Vacuum

US Patent:
6867543, Mar 15, 2005
Filed:
Mar 31, 2003
Appl. No.:
10/403637
Inventors:
Joe P. Wang - Long Grove IL, US
Cheryl B. Field - Kildeer IL, US
Michael Pfeifer - Northbrook IL, US
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01J019/70
H01J009/38
US Classification:
313553, 313481, 313549, 313561
Abstract:
A microdevice assembly () that includes a device microstructure (), a housing (), and a fine grain getter layer (). The housing () has a base portion () and a lid (). The device microstructure () is attached to the base portion () and the lid () is hermetically sealed to the base portion (). The housing () defines a cavity () surrounding the device microstructure (). The fine grain getter layer () is on an interior side () of the lid () for maintaining a vacuum in the cavity () surrounding the device microstructure (). The lid () may be made of metal or have at least a metallic surface in the region where the fine grain getter layer () is applied. The fine grain getter layer () has a sub-micron grain size. There is also a method for making the microdevice assembly ().

Possible Relatives

David R Field  Dawn D Field  Dean R Field  Deanna M Field  Dale E Field  Deborah L Field  Daniel A Field  Cheryl A Johnson  Cheryl A Johnston  Cheryl Stanek 

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