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Kelly N Fong, 4111862 Iowa Ave APT 1, Los Angeles, CA 90025

Related to:
Jeffrey L Fong 33 Ernest O Fong 80 Lauren M Fong 30

Kelly Fong Phones & Addresses

11862 Iowa Ave APT 1, Los Angeles, CA 90025   

Ithaca, NY   

2422 Delmer St, Oakland, CA 94602    510-5302491   

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Kelly Fong resumes & CV records

Resumes

Kelly Fong Photo 36

Director, Digital Operations Integration At Warner Bros. Technical Operations

Position:
Director, Digital Operations Integration at Warner Bros. Technical Operations
Location:
United States
Industry:
Entertainment
Work:
Warner Bros. Technical Operations since 2011
Director, Digital Operations Integration Warner Bros. Digital Distribution 2007 - 2011
Manager, Digital Operations Warner Bros. Digital Distribution 2005 - 2007
Digital Asset Administrator, Marketing Sony Pictures Entertainment 2005 - 2005
TV Research Verizon 2004 - 2005
Affiliate Engineer MGM Studios 2004 - 2004
Enterprise Digital Asset Management, Coordinator
Education:
California State Polytechnic University-Pomona 2000 - 2004
Bachelor of Science in Business Administration, emphasis in Computer Information Systems, Computer Systems Networking and Telecommunications
Kelly Fong Photo 37

Graduate Student At University Of California, Los Angeles

Location:
Los Angeles, California
Industry:
Research
Education:
University of California, Los Angeles 2007 - 2013
PhD, Archaeology University of California, Los Angeles 2005 - 2007
MA, Archaeology University of California, Berkeley 2001 - 2005
BA, Anthropology, Asian American Studies

Publications & IP owners

Us Patents

Aluminum-Plated Components Of Semiconductor Material Processing Apparatuses And Methods Of Manufacturing The Components

US Patent:
8128750, Mar 6, 2012
Filed:
Mar 29, 2007
Appl. No.:
11/730049
Inventors:
Ian J. Kenworthy - Mountain View CA, US
Kelly W. Fong - San Mateo CA, US
Leonard J. Sharpless - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
C23C 16/00
C23C 14/00
US Classification:
118715, 118 50
Abstract:
Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.

Aluminum-Plated Components Of Semiconductor Material And Methods Of Manufacturing The Components

US Patent:
8282987, Oct 9, 2012
Filed:
Jan 31, 2012
Appl. No.:
13/362169
Inventors:
Ian J. Kenworthy - Mountain View CA, US
Kelly W. Fong - San Mateo CA, US
Leonard J. Sharpless - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B05D 5/12
C25D 3/00
US Classification:
427 80, 205261
Abstract:
Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.

Edge Rings For Electrostatic Chucks

US Patent:
8469368, Jun 25, 2013
Filed:
Aug 12, 2009
Appl. No.:
12/540186
Inventors:
Ian Jared Kenworthy - Mountain View CA, US
Kelly Fong - San Mateo CA, US
Michael C. Kellogg - Pleasanton CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B23B 31/28
US Classification:
279128, 361234, 414941
Abstract:
A disclosed device for use with an electrostatic chuck configured to hold a substrate in a plasma environment comprises an edge ring configured to be placed either in contact with portions of only a ceramic top piece, a base plate, or coupled to the base plate through a plurality of pins and pin slots. The edge ring is further configured to be concentric with the ceramic top piece. In one embodiment, the edge ring includes an inner edge having an edge step arranged to provide mechanical coupling between the edge ring and the outer periphery of the ceramic top piece. The edge ring further includes an outer edge and a flat portion located between the inner edge and the outer edge. The flat portion is arranged to be both horizontal when the edge ring is placed around the outer periphery of the ceramic top piece and parallel to the substrate.

Possible Relatives

Cynthia Fong  David Fong  Daisy Fong  Deborah L Fong  Debra A Fong  Daniel Fong  Aaron B Fong  Kelly S Johnson  Kelly A Stamps  Kelly A Johnston 

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