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Curtis Steven Kempton, 731160 Holt Dr, Bigfork, MT 59911

Known as:
Curtis S Kempton Curtis A Kempton Curtis N Kempton Curt A Kempton Chuck Kempton Christian Kempton Kempton Christian
Related to:
David M Wilson 65

Curtis Kempton Phones & Addresses

Bigfork, MT   

512 7Th St, Mesa, AZ 85203    480-9627185   

Beaverton, OR   

Glenwood Springs, CO   

Social networks

Curtis Steven Kempton

Linkedin

Work

Company: Symphosize Jan 2008 Position: Ceo

Education

Degree: Bachelor of Science School / High School: Arizona State University, W. P. Carey School of Business 2001 to 2005 Specialities: Business Administration

Skills

Analysis • Photoshop • Vendor Management • Customer Service • Pressure Washing • Organization • Teaching • Sales • Small Business • Strategic Planning • Budgets • Contract Negotiation • Construction Clean-up • Marketing • Leadership • Window Film

Awards

IWCA most professional image window cleaning company 2009.

Interests

Cycling, Family Outings, Problem Solving

Industries

Consumer Services
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Mentions for Curtis Steven Kempton

Curtis Kempton resumes & CV records

Resumes

Curtis Kempton Photo 14

President At Symphosize

Position:
CEO at Symphosize, Owner at 5 Star Window Care
Location:
Phoenix, Arizona Area
Industry:
Consumer Services
Work:
Symphosize since Jan 2008
CEO 5 Star Window Care since May 2006
Owner Focus Cyclery Jan 2006 - Jan 2007
Store Manager/ Fit Specialist Mike's Bike Chalet Sep 2000 - Dec 2005
Store Manager/ Fit Specialist LDS Mission, Canada Calgary Sep 1998 - Sep 2000
Missionary
Education:
Arizona State University, W. P. Carey School of Business 2001 - 2005
Bachelor of Science, Business Administration
Skills:
Analysis, Photoshop, Vendor Management, Customer Service, Pressure Washing, Organization, Teaching, Sales, Small Business, Strategic Planning, Budgets, Contract Negotiation, Construction Clean-up, Marketing, Leadership, Window Film
Interests:
Cycling, Family Outings, Problem Solving
Honor & Awards:
IWCA most professional image window cleaning company 2009.

Publications & IP owners

Us Patents

Test Cell For Evaluating Phosphor

US Patent:
7238535, Jul 3, 2007
Filed:
Sep 1, 2004
Appl. No.:
10/931827
Inventors:
Karen Ruth Brower - Chandler AZ, US
Roy Scott Chancellor - Scottsdale AZ, US
William A. Coghlan - Tempe AZ, US
Curtis Henry Kempton - Higley AZ, US
Alan C. Thomas - Gilbert AZ, US
Assignee:
World Properties, Inc. - Lincolnwood IL
International Classification:
G01N 21/64
G01N 21/01
US Classification:
436172, 422 58, 422 8205, 422 8207, 422104, 436165
Abstract:
An test cell is adapted for both making and testing samples. The cell includes a bottom plate and a top plate having concentric apertures defining a central test cavity. A post attached to the bottom plate closes off the bottom of the test cavity. A slide closes off the top of the test cavity. The top of the post is spaced slightly from the underside of the slide to define a test cavity of substantially uniform thickness. The test cavity is filled with phosphor suspended in uncured resin, closed, and the resin is cured. Once cured, the sample is stable, although delicate, and can be re-measured several times with reproducible results. The measurement takes place in the cell, using a thin film of oil for wetting surfaces.

Method Of Manufacture Multichip Module Substrate

US Patent:
5287619, Feb 22, 1994
Filed:
Mar 9, 1992
Appl. No.:
7/847895
Inventors:
W. David Smith - Abington CT
John A. Olenick - Thompson CT
Carlos L. Barton - Brooklyn CT
Jane L. Cercena - Ashford CT
Daniel J. Navarro - Putnam CT
Kathleen R. Olenick - Thompson CT
Angela M. Kneeland - Putnam CT
Thomas S. Kneeland - Putnam CT
Mark F. Sylvester - Pawtucket RI
Curtis H. Kempton - Mesa AZ
Scott E. Derosier - Rogers CT
Lynn E. Burdick - Hampton CT
Richard T. Traskos - Brooklyn CT
Robert B. Huntington - Tempe AZ
James S. Rivers - Ballouville CT
Samuel Gazit - West Hartford CT
Jeffrey B. Ott - Brooklyn CT
William P. Harper - Tempe AZ
Assignee:
Rogers Corporation - Rogers CT
International Classification:
H01K 310
US Classification:
29852
Abstract:
In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management.

Possible Relatives

David B Kempton  Daniel Kempton  Denise E Kempton  Dennis W Kempton  Diana M Kempton  Donald J Kempton  Elizabeth L Kempton  Curtis R Johnson  Curtis P Stamps  Curtis D Johnston 

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