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Dan Ye, 32Mountain View, CA

Related to:
Sai Qing Ye 42 Sai Hua Ye Jack Yip

Dan Ye Phones & Addresses

Mountain View, CA   

Irvine, CA   

Redwood City, CA   

1006 Hunt Club Ct, Export, PA 15632   

Altoona, PA   

Cleveland, OH   

Work

Company: Prudential california Address: 12960 San Pablo Ave., Richmond, CA 94805 Phones: 510-2327253 Position: Mortgage broker Industries: Loan Brokers
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Mentions for Dan Ye

Resumes & CV records

Resumes

Dan Ye Photo 38

Accountant

Location:
Irvine, CA
Industry:
Accounting
Work:
Ncg Air Conditioning Centre Pty Ltd
Accountant Deleware North May 2015 - Aug 2015
Accounting Intern Mingyang 2010 - 2011
Graduate Accountant
Education:
Navitas 2014 - 2015
Associates University of Melbourne 2012 - 2014
Masters, Business Management, Accounting Sun Yat - Sen University 2006 - 2010
Bachelors
Skills:
Financial Reporting, Financial Accounting, Tax, Account Reconciliation, Microsoft Excel, Financial Analysis, Accounts Payable and Receivable, Cost Management, Project Management
Interests:
Social Services
Environment
Arts and Culture
Languages:
English
Mandarin
Cantonese
Dan Ye Photo 39

Lead Architect At Cdk

Location:
Irvine, CA
Industry:
Information Technology And Services
Work:
Cdk Global
Lead Architect at Cdk Toyota North America Jul 2012 - Oct 2012
Solutions Architect Ntt Data Services Oct 2010 - Jul 2012
Assistant Director Panasonic Avionics Corporation Apr 2010 - Oct 2010
Web Architect
Education:
University of Chicago
Master of Business Administration, Masters University of Notre Dame
Doctorates, Doctor of Philosophy, Physics, Philosophy University of Science and Technology of China
Bachelors, Physics
Skills:
Agile Methodologies, Software Project Management, Web Services, Software Development, Requirements Analysis, Sdlc, Xml, Soa, Integration, Enterprise Architecture, Microsoft Sql Server, Sql, Business Intelligence, Scrum, Program Management, Service Oriented Architecture
Dan Ye Photo 40

Dan Ye

Industry:
Internet
Dan Ye Photo 41

Dan Ye

Publications & IP owners

Us Patents

Electrostatic Chuck Assembly With Capacitive Sense Feature, And Related Operating Method

US Patent:
2010000, Jan 14, 2010
Filed:
Jul 7, 2009
Appl. No.:
12/498976
Inventors:
Jaime Onate - Fremont CA, US
Michael Kilgore - Sunnyvale CA, US
Jimmy Lam - Fremont CA, US
Timothy W. Kueper - Santa Clara CA, US
Dan Ye - Sunnyvale CA, US
Assignee:
NOVELLUS SYSTEMS, INC. - San Jose CA
International Classification:
H01L 21/683
US Classification:
361234
Abstract:
A semiconductor workpiece processing system for treating a workpiece, such as a semiconductor wafer, is provided. A related operating control method is also provided. The system includes an electrostatic chuck configured to receive a workpiece, and a clamping voltage power supply coupled to the electrostatic chuck. The electrostatic chuck has a clamping electrode assembly, and the clamping voltage power supply is coupled to the clamping electrode assembly. The clamping voltage power supply includes a direct current (DC) voltage generator configured to generate a DC clamping voltage for the clamping electrode assembly, an alternating current (AC) voltage generator configured to generate an AC excitation signal for the clamping electrode assembly, and a processing architecture coupled to the clamping electrode assembly. The processing architecture is configured to analyze attributes of a workpiece presence signal obtained in response to the AC excitation signal, and, based on the attributes, verify proper/improper positioning of the workpiece relative to the electrostatic chuck.

Electrostatic Chuck Assembly With Capacitive Sense Feature, And Related Operating Method

US Patent:
7558045, Jul 7, 2009
Filed:
Mar 20, 2008
Appl. No.:
12/052395
Inventors:
Jaime Onate - Fremont CA, US
Michael Kilgore - Sunnyvale CA, US
Jimmy Lam - Fremont CA, US
Timothy W. Kueper - Santa Clara CA, US
Dan Ye - Sunnyvale CA, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
H01L 21/683
US Classification:
361234
Abstract:
A semiconductor workpiece processing system for treating a workpiece, such as a semiconductor wafer, is provided. A related operating control method is also provided. The system includes an electrostatic chuck configured to receive a workpiece, and a clamping voltage power supply coupled to the electrostatic chuck. The electrostatic chuck has a clamping electrode assembly, and the clamping voltage power supply is coupled to the clamping electrode assembly. The clamping voltage power supply includes a direct current (DC) voltage generator configured to generate a DC clamping voltage for the clamping electrode assembly, an alternating current (AC) voltage generator configured to generate an AC excitation signal for the clamping electrode assembly, and a processing architecture coupled to the clamping electrode assembly. The processing architecture is configured to analyze attributes of a workpiece presence signal obtained in response to the AC excitation signal, and, based on the attributes, verify proper/improper positioning of the workpiece relative to the electrostatic chuck.

Possible Relatives

Feng X Ye  Jeff H Ye  Jian J Ye  Lu Ye  Pei X Ye  Ping Ye  Qing M Ye  Dan L White  Dan P Stansell  Dan C Whiting 

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