Daniel Frech resumes & CV records
Resumes
Daniel Frech
Location:
Portland, Oregon Area
Industry:
Semiconductors
Daniel Weber Frech, 604243 SW 6Th Ave, Portland, OR 97239
Daniel Frech Phones & Addresses
4243 SW 6Th Ave, Portland, OR 97239 971-2377192
Eastsound, WA
2608 Madison St, Seattle, WA 98112
South Colby, WA
408 13Th St, McMinnville, OR 97128 503-4722819 503-4741529
Bremerton, WA
New Athens, IL
4243 SW 6Th Ave, Portland, OR 97239 503-5508891
Social networks
Daniel Weber Frech
Linkedin
Work
Position:
Professional/Technical
Industries
Semiconductors
Mentions for Daniel Weber Frech
Publications & IP owners
Us Patents
Slotted Substrate And Method Of Making
US Patent:
6814431, Nov 9, 2004
Filed:
Jun 20, 2003
Appl. No.:
10/601149
Inventors:
Shen Buswell - Monmouth OR
Deanna J. Bergstrom - Corvallis OR
Daniel Frech - McMinnville OR
Deanna J. Bergstrom - Corvallis OR
Daniel Frech - McMinnville OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 205
US Classification:
347 65
Abstract:
The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
Slotted Substrate And Method Of Making
US Patent:
7501070, Mar 10, 2009
Filed:
Aug 18, 2003
Appl. No.:
10/642872
Inventors:
Shen Buswell - Monmouth OR, US
Deanna J. Bergstrom - Corvallis OR, US
Daniel Frech - McMinnville OR, US
Deanna J. Bergstrom - Corvallis OR, US
Daniel Frech - McMinnville OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 2/16
US Classification:
216 27, 216 52, 216 56, 216 57, 216 58, 216 83, 264400, 451 41
Abstract:
The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
Slotted Substrate And Method Of Making
US Patent:
6666546, Dec 23, 2003
Filed:
Jul 31, 2002
Appl. No.:
10/210727
Inventors:
Shen Buswell - Monmouth OR
Deanna J. Bergstrom - Corvallis OR
Daniel Frech - McMinnville OR
Deanna J. Bergstrom - Corvallis OR
Daniel Frech - McMinnville OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 205
US Classification:
347 65
Abstract:
The described embodiments relate to a slotted substrate for use in a fluid ejecting ice. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
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