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Daniel M Kivel DeceasedAlgonac, MI

Known as:
Daniel Martin Kivel Daniel F Kivel Jettie Bocanegra
Related to:
Carrie D Cramer 55 Sue A Cramer

Daniel Kivel Phones & Addresses

Algonac, MI   

Dowagiac, MI   

Auburn Hills, MI   

2326 Garfield, Ferndale, MI 48220    248-5432701   

Warren, MI   

Pontiac, MI   

Justice, WV   

Peachtree City, GA   

Oakland, MI   

Grand Rapids, MI   

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Us Patents

Aqueous Chip Resistant Coating Composition

US Patent:
4537926, Aug 27, 1985
Filed:
Apr 6, 1984
Appl. No.:
6/597671
Inventors:
Daniel M. Kivel - Troy MI
Gerhard M. Weber - Detroit MI
Assignee:
Grow Group, Inc. - New York NY
International Classification:
C08K 505
C08L 3700
US Classification:
524388
Abstract:
Described is an aqueous chip resistant coating composition exhibiting a viscosity of at least 5,000 centipoise, preferably containing binders with a high molecular weight, preferably at least 20,000. Although these coatings may be applied to a variety of substrates, for coating electrocoated substrates the following eight binders are particularly preferred: ethylene vinyl acetate copolymer, carboxylated ethylene vinyl acetate, epoxy functional acrylic resin, carboxylated styrene-butadiene resin, carboxylated acrylic, hydroxy functional acrylic, self-crosslinking acrylic; and carboxylated PVC acrylic. Generally, it is preferred to apply the chip resistant coating via an airless spray and the heat curing the coating.

Method Of Applying Aqueous Chip Resistant Coating Compositions

US Patent:
4456507, Jun 26, 1984
Filed:
Sep 14, 1982
Appl. No.:
6/417857
Inventors:
Daniel M. Kivel - Troy MI
Gerhard M. Weber - Detroit MI
Assignee:
Grow Group, Inc. - New York NY
International Classification:
C25D 1304
US Classification:
204181T
Abstract:
Described is an aqueous chip resistant coating composition exhibiting a viscosity of at least 5,000 centipoise, preferably containing binders with a high molecular weight, preferably at least 20,000. Although these coatings may be applied to a variety of substrates, for coating electrocoated substrates the following eight binders are particularly preferred: ethylene vinyl acetate copolymer, carboxylated ethylene vinyl acetate, epoxy functional acrylic resin, carboxylated styrene-butadiene resin, carboxylated acrylic, hydroxy functional acrylic, self-crosslinking acrylic; and carboxylated PVC acrylic. Generally, it is preferred to apply the chip resistant coating via an airless spray and then heat curing the coating.

Possible Relatives

Gary M Kivel  Harry R Kivel  Heidi R Kivel  John H Kivel  Joseph Kivel  Steven M Kivel  Susan C Kivel  Daniel G Last  Daniel J Johnson  Daniel W Stamps 

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