Inventors:
Shih-Chia Chang - Bloomfield Hills MI, US
Bruce A. Myers - Kokomo IN, US
Darrel E. Peugh - Kokomo IN, US
Carl W. Berlin - West Lafayette IN, US
M. Ray Fairchild - Kokomo IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 7/20
US Classification:
361701, 361699, 361702, 361719, 165 804, 165 805, 16510433, 174 151, 174252
Abstract:
The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.