Darrel E Peugh, 652711 Carriage Hill Ln, Cuyahoga Falls, OH 44223

6535396, Mar 18, 2003

Apr 28, 2000

09/560981

Thomas Alan Degenkolb - Noblesville IN
Darrel Eugene Peugh - Kokomo IN
Bruce Alan Myers - Kokomo IN

Delphi Technologies, Inc. - Troy MI

H01R 900

361775, 361748, 361675, 361760, 174258, 174260, 174255

A combination circuit board ( ) and segmented bus structure ( ) defines a composite circuit board/bus assembly ( ) upon which an electrical circuit may be assembled. The various segments ( ) of bus structure ( ) may be variously configured to achieve one or more assembly, performance, testing, and/or reliability goals. For example, one bus segment configuration provides integral connector tabs ( and ) for mechanical and/or electrical connection to interconnecting wires or electrical terminals of one or more external devices. Another bus segment configuration ( ) provides for mechanical and high current electrical interconnections between one or more bus segments ( ) and one or more electrical components ( ) and/or conductive film patterns( ) formed on top surface ( ) of the circuit board ( ). Still another bus segment configuration provides integral tabs ( and ) for electrical connection to and mechanical attachment of electrical components ( ) from one or more of such tabs ( and ) extending through the circuit board ( ) to other such tabs ( and ) or other circuit structures. Yet another bus structure ( ) provides for highly efficient heat sinking capability and/or electrical connection for electrical components ( ) mounted either directly to one or more bus segments ( ) and for electrical components ( ) mounted to a substrate ( ) that is itself mounted directly to one or more bus segments ( ).

6560110, May 6, 2003

Feb 22, 2002

10/079760

Bruce A. Myers - Kokomo IN
Thomas A. Degenkolb - Noblesville IN
Henry M. Sanftleben - Carmel IN
Darrel E. Peugh - Kokomo IN

Delphi Technologies, Inc. - Troy MI

H05K 720

361705, 361704, 361707, 257687, 257796, 174 522

A corrosive resistant electronics assembly is provided including at least one heat generating electronics component mounted on a substrate and positioned within potting material. A thermally conductive block element is thermally mounted to the at least one heat generating electronics component and positioned within the potting material , thereby providing a corrosive resistant electronics assembly with improved thermal dissipation.

6833628, Dec 21, 2004

Dec 17, 2002

10/321900

Scott D. Brandenburg - Kokomo IN
Darrel E. Peugh - Kokomo IN
Matthew R. Walsh - Sharpsville IN

Delphi Technologies, Inc. - Troy MI

H01L 2348

257778, 257723

A package and packaging method that incorporates multiple surface-mounted devices mounted to the package, which in turn can be mounted onto a circuit board. The package generally includes a pair of laminate substrates that together form a chip carrier and input/output (I/O) interface structure for the devices. The devices are mounted to opposite surface of a first of the substrates. The second substrate is attached to the first substrate, and has an interior opening therethrough. The first and second substrates are attached to each other such that devices mounted on one surface of the first substrate are disposed within the interior opening of the second laminate substrate. A mold compound can be applied to underfill and encapsulate the devices mounted to the surfaces of the first substrate.

7106588, Sep 12, 2006

Oct 27, 2003

10/694191

Gary E. Oberlin - Windfall IN, US
Bruce A. Myers - Kokomo IN, US
Thomas A. Degenkolb - Noblesville IN, US
Darrel E. Peugh - Kokomo IN, US

Delphi Technologies, Inc. - Troy MI

H05K 7/20
H01L 23/427
H05K 7/06

361700, 361699, 361717, 361719, 257714, 257715

The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.

7215547, May 8, 2007

Aug 16, 2004

10/919168

Shih-Chia Chang - Bloomfield Hills MI, US
Bruce A. Myers - Kokomo IN, US
Darrel E. Peugh - Kokomo IN, US
Carl W. Berlin - West Lafayette IN, US
M. Ray Fairchild - Kokomo IN, US

Delphi Technologies, Inc. - Troy MI

H05K 7/20

361701, 361699, 361702, 361719, 165 804, 165 805, 16510433, 174 151, 174252

The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.

7365981, Apr 29, 2008

Jun 28, 2005

11/168882

Bruce A. Myers - Kokomo IN, US
Darrel E. Peugh - Kokomo IN, US
Henry M. Sanftleben - Carmel IN, US

Delphi Technologies, Inc. - Troy MI

H05K 7/20
H01L 23/12
F28F 7/00

361699, 361719, 257704, 257710, 165 804

A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

7538425, May 26, 2009

Jul 28, 2004

10/900538

Bruce A. Myers - Kokomo IN, US
Darrel E. Peugh - Kokomo IN, US
Lester Wilkinson - Kokomo IN, US
Erich W. Gerbsch - Cicero IN, US

Delphi Technologies, Inc. - Troy MI

H01L 23/34

257714, 257730, 257E23095

A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

7551439, Jun 23, 2009

Mar 28, 2006

11/396322

Darrel E. Peugh - Kokomo IN, US
Bruce A. Myers - Kokomo IN, US
Gary E. Oberlin - Windfall IN, US

Delphi Technologies, Inc. - Troy MI

H05K 7/20

361699, 165 804, 174 151, 257714, 622592

An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.