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Darren A Janzig, 6435662 Patriot Ave, Center City, MN 55012

Darren Janzig Phones & Addresses

35662 Patriot Ave, Center City, MN 55012    651-3244189   

Lindstrom, MN   

5799 Pike Lake Rd, Duluth, MN 55811   

Hermantown, MN   

Centerville, MN   

Anoka, MN   

Mentions for Darren A Janzig

Publications & IP owners

Us Patents

Reducing Relative Intermodule Motion In A Modular Implantable Medical Device

US Patent:
7392089, Jun 24, 2008
Filed:
Dec 9, 2003
Appl. No.:
10/731881
Inventors:
Carl D. Wahlstrand - Lino Lakes MN, US
Darren A. Janzig - Centerville MN, US
Robert M. Skime - Coon Rapids MN, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
A61N 1/36
US Classification:
607 36
Abstract:
A modular implantable medical device includes a plurality of modules that are at least partially encapsulated by an overmold. The modules may be connected by coupling modules, which may be flexible to provide for one or more degrees of relative intermodular motion. The overmold may also be flexible. In order to reduce relative intermodule motion to acceptable direction and/or ranges, the overmold may include one or more motion reduction elements.

Concavity Of An Implantable Medical Device

US Patent:
7529586, May 5, 2009
Filed:
Dec 9, 2003
Appl. No.:
10/731867
Inventors:
Carl D. Wahlstrand - Lino Lakes MN, US
Darren A. Janzig - Centerville MN, US
Ruchika Singhal - Minneapolis MN, US
Robert M. Skime - Coon Rapids MN, US
Erik R. Scott - Maple Grove MN, US
James E. Randall - Coon Rapids MN, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
A61N 1/36
US Classification:
607 36
Abstract:
At least one surface of an implantable medical device is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4. 5 and 9. 5 centimeters, and is preferably approximately equal to 7 centimeters. In some embodiments, the implantable medical device comprises a plurality of interconnected modules, and an overmold that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing, and at least one surface of at least one of the housings may be concave along at least one axis.

Internal Hermetic Lead Connector For Implantable Device

US Patent:
7711427, May 4, 2010
Filed:
Apr 10, 2007
Appl. No.:
11/733240
Inventors:
Darren A. Janzig - Center City MN, US
Gerald G. Lindner - Lino Lakes MN, US
Chris J. Paidosh - St. Anthony MN, US
Assignee:
Medtronis, Inc. - Minneapolis MN
International Classification:
A61N 1/375
US Classification:
607 37, 607 36, 607 38, 439909, 4397331
Abstract:
An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.

Hermetic Lead Connector Assembly

US Patent:
7711428, May 4, 2010
Filed:
Apr 10, 2007
Appl. No.:
11/733247
Inventors:
Darren A. Janzig - Center City MN, US
Gerald G. Lindner - Lino Lakes MN, US
Chris J. Paidosh - St. Anthony MN, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
A61N 1/375
US Classification:
607 37, 607 36, 607 38, 439909, 4397331, 439668
Abstract:
A hermetic lead connector assembly includes a hermetic lead connector having an open end, a lead connector outer surface and a lead connector inner surface defining a lead aperture and a rigid sleeve is disposed about the hermetic lead connector outer surface. The hermetic lead connector has one or more electrically conducting contact rings spaced apart by electrically insulating rings. The hermetic lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface. The rigid sleeve has an aperture that exposes a portion of the one or more electrically conducting contact rings.

Internal Hermetic Lead Connector For Implantable Device

US Patent:
7720538, May 18, 2010
Filed:
Apr 10, 2007
Appl. No.:
11/733245
Inventors:
Darren A. Janzig - Center City MN, US
Gerald G. Lindner - Lino Lakes MN, US
Chris J. Paidosh - St. Anthony MN, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
A61N 1/375
US Classification:
607 37, 607 36, 607 38, 439909, 4397331
Abstract:
An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.

Coupling Module Of A Modular Implantable Medical Device

US Patent:
7848817, Dec 7, 2010
Filed:
Dec 9, 2003
Appl. No.:
10/731699
Inventors:
Darren A. Janzig - Centerville MN, US
Carl D. Wahlstrand - Lino Lakes MN, US
Robert M. Skime - Coon Rapids MN, US
Mark S. Lent - Brooklyn Park MN, US
Keith A. Miesel - St. Paul MN, US
James E. Cabak - Plymouth MN, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
A61N 1/00
US Classification:
607 45
Abstract:
In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.

Methods Of Manufacturing A Hermetic Lead Connector

US Patent:
8131370, Mar 6, 2012
Filed:
Apr 10, 2007
Appl. No.:
11/733243
Inventors:
Darren A. Janzig - Center City MN, US
Gerald G. Lindner - Lino Lakes MN, US
Chris J. Paidosh - St. Anthony MN, US
Assignee:
Medtronic, Inc - Minneapolis MN
International Classification:
A61N 1/375
US Classification:
607 37
Abstract:
A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

Capacitive Pressure Sensor Assembly

US Patent:
8397578, Mar 19, 2013
Filed:
Jun 3, 2010
Appl. No.:
12/793459
Inventors:
Keith A. Miesel - St. Paul MN, US
James M. Haase - Maplewood MN, US
Chris J. Paidosh - St. Anthony MN, US
Darren A. Janzig - Center City MN, US
Timothy J. Denison - Minneapolis MN, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
G01L 9/12
A61M 5/14
US Classification:
73718, 73724, 6048911
Abstract:
The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.

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