Darshak Desai resumes & CV records
Resumes
Product Development Scientist
Work:
Product Development Scientist
Darshak R Desai, 5412 Roxy Ave, Edison, NJ 08820
Darshak Desai Phones & Addresses
12 Roxy Ave, Edison, NJ 08820 732-4996925
136 Roanoke St, Woodbridge, NJ 07095 732-7260064
136A Roanoke St, Woodbridge, NJ 07095 732-7260064
Elmwood Park, NJ
Social networks
Darshak R Desai
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Position:
Product development scientist
Mentions for Darshak R Desai
Product Development Scientist
Publications & IP owners
Us Patents
Hot Melt Adhesive
US Patent:
2005004, Feb 24, 2005
Filed:
Aug 22, 2003
Appl. No.:
10/646417
Inventors:
Melissa Allen - Hillsborough NJ, US
Justin Mehaffy - Hampton NJ, US
Darshak Desai - Woodbridge NJ, US
Dale Haner - Ringwood NJ, US
Tuyet Le - Edison NJ, US
Justin Mehaffy - Hampton NJ, US
Darshak Desai - Woodbridge NJ, US
Dale Haner - Ringwood NJ, US
Tuyet Le - Edison NJ, US
International Classification:
B32B027/30
C08L053/00
C09J133/00
C08L053/00
C09J133/00
US Classification:
428523000, 525089000, 156327000
Abstract:
A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
Low Application Tempearature Amorphous Poly-A-Olefin Adhesive
US Patent:
2013015, Jun 20, 2013
Filed:
Feb 20, 2013
Appl. No.:
13/771439
Inventors:
HENKEL CORPORATION - Rocky Hill CT, US
Charles W. Paul - Madison NJ, US
Darshak Desai - Edison NJ, US
Salvador Alvarado - Belle Mead NJ, US
Charles W. Paul - Madison NJ, US
Darshak Desai - Edison NJ, US
Salvador Alvarado - Belle Mead NJ, US
Assignee:
HENKEL CORPORATION - Rocky Hill CT
International Classification:
C09J 123/20
US Classification:
524274, 5263486, 525 55, 524579, 156334
Abstract:
It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105 C. and viscosity of less than about 1,900 cP at 190 C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
Integral Hot Melt Adhesive Packaging Films And Use Thereof
US Patent:
2013030, Nov 21, 2013
Filed:
Mar 13, 2013
Appl. No.:
13/800445
Inventors:
Yuhong Hu - Belle Mead NJ, US
Darshak Desai - Woodbridge NJ, US
Darshak Desai - Woodbridge NJ, US
Assignee:
Henkel Corporation - Rocky Hill CT
International Classification:
B65B 1/04
C08L 23/12
C08L 23/08
B32B 1/02
C08L 23/12
C08L 23/08
B32B 1/02
US Classification:
428 355, 53440, 428 357, 428 3692, 525240, 524528
Abstract:
Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.
Hot Melt Adhesive Composition And Use Thereof
US Patent:
2018000, Jan 4, 2018
Filed:
Sep 19, 2017
Appl. No.:
15/708543
Inventors:
- Duesseldorf, DE
Darshak R. DESAI - Edison NJ, US
Jinyu CHEN - Fanwood NJ, US
Matthew L. Sharak - Franklin Park NJ, US
Darshak R. DESAI - Edison NJ, US
Jinyu CHEN - Fanwood NJ, US
Matthew L. Sharak - Franklin Park NJ, US
International Classification:
C09J 123/14
B32B 27/08
B32B 37/12
B32B 37/08
C09J 5/00
B32B 5/02
B32B 7/12
B32B 27/12
B32B 27/08
B32B 37/12
B32B 37/08
C09J 5/00
B32B 5/02
B32B 7/12
B32B 27/12
Abstract:
The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable low application temperature hot melt adhesives have high green strength, excellent bond strength and aging performance. Moreover, the sprayable low application temperature hot melt adhesives allows for thin bond lines without bleed-through and burn-through risks for heat-sensitive substrates.
Integral Hot Melt Adhesive Packaging Films And Use Thereof
US Patent:
2016013, May 19, 2016
Filed:
Jan 22, 2016
Appl. No.:
15/004187
Inventors:
- Duesseldorf, DE
Yuhong Hu - Belle Mead NJ, US
Darshak Desai - Edison NJ, US
Yuhong Hu - Belle Mead NJ, US
Darshak Desai - Edison NJ, US
International Classification:
B65D 65/38
C08J 5/18
C08L 23/12
C08L 23/08
B65B 1/04
B65B 63/08
C08J 5/18
C08L 23/12
C08L 23/08
B65B 1/04
B65B 63/08
Abstract:
Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.
Low Application Temperature Amorphous Poly-A-Olefin Adhesive
US Patent:
2016003, Feb 4, 2016
Filed:
Oct 13, 2015
Appl. No.:
14/881385
Inventors:
- Duesseldorf, DE
Charles W. Paul - Morristown NJ, US
Darshak Desai - Edison NJ, US
Salvador Alvarado - Belle Mead NJ, US
Charles W. Paul - Morristown NJ, US
Darshak Desai - Edison NJ, US
Salvador Alvarado - Belle Mead NJ, US
International Classification:
C09J 123/20
C09J 123/08
C09J 123/08
Abstract:
It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105 C. and viscosity of less than about 1,900 cP at 190 C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
Low Application Temperature Amorphous Poly-A-Olefin Adhesive
US Patent:
2015016, Jun 18, 2015
Filed:
Mar 2, 2015
Appl. No.:
14/635499
Inventors:
- Duesseldorf, DE
Charles W. Paul - Morristown NJ, US
Darshak Desai - Edison NJ, US
Salvador Alvarado - Belle Mead NJ, US
Charles W. Paul - Morristown NJ, US
Darshak Desai - Edison NJ, US
Salvador Alvarado - Belle Mead NJ, US
International Classification:
C09J 123/20
B32B 37/18
B32B 37/12
B32B 37/18
B32B 37/12
Abstract:
It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105 C. and viscosity of less than about 1,900 cP at 190 C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
Adhesives And Use Thereof
US Patent:
2014014, May 29, 2014
Filed:
Jan 31, 2014
Appl. No.:
14/169353
Inventors:
- Rocky Hill CT, US
Yuhong HU - Belle Mead NJ, US
Darshak DESAI - Edison NJ, US
Yuhong HU - Belle Mead NJ, US
Darshak DESAI - Edison NJ, US
Assignee:
HENKEL US IP LLC - Rocky Hill CT
International Classification:
C09J 123/20
C09J 5/00
C09J 5/00
US Classification:
428355EN, 524528, 524 81, 4272071
Abstract:
The invention provides adhesives and methods of using the adhesives to bond substrates together, and to articles of manufacture comprising the adhesives. It has been discovered that an adhesive with a polymer content greater than 70 weight percent can be formulated with a blend of (i) a metallocene catalyzed polypropylene polymer that has a density range of about 0.70 to about 0.91 g/cmand a melt viscosity less than 50,000 cP at 190 C. and (ii) a Ziegler-Natta catalyzed amorphous polybutene and/or polypropylene copolymer. Such adhesives have high creep resistance making them particularly well suited for disposable personal care garments.
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