David E Beaulieu, 66142 Main St #12, North Reading, MA 01864

6547510, Apr 15, 2003

May 4, 1998

09/072097

David R. Beaulieu - Groton MA

Brooks Automation Inc. - Chelmsford MA

B25J 1802

4147445, 901 15, 901 21, 7449004

A substrate transport apparatus having a drive section and a movable arm assembly connected to the drive section. The drive section has a coaxial drive shaft assembly with independently rotatable drive shafts. The movable arm assembly has two scara arms. Each scara arm has an inner arm connected to a separate respective one of the drive shafts. An outer arm of each scara arm is connected to a rotationally stationary pulley on the drive section by respective transmission belts.

6719517, Apr 13, 2004

Dec 4, 2001

10/006263

David R. Beaulieu - Groton MA
Douglas R. Adams - Pepperill MA
Mitchell Drew - Portsmouth NH
Peter Van Der Meulen - Newburyport MA

Brooks Automation

B65G 4907

414217, 414939

A substrate processing apparatus comprising a frame, at least one processing module, and a substrate transport apparatus. The frame defines a first chamber with outer substrate transport openings for transporting substrates between the first chamber and an exterior of the frame. The processing module is connected to the exterior of the frame. The processing module communicates with the first chamber of the frame through at least one of the outer openings. The substrate transport apparatus is connected to the frame for transporting substrates between the first chamber and the processing module exterior to the frame. The frame has a second integral chamber formed therein. The second integral chamber communicates with the first chamber through an internal substrate transport opening of the frame. The second integral chamber of the frame has a selectable configuration from a number of predetermined configurations. The configuration of the second integral chamber to the frame is selected in accordance with a predetermined characteristic of the substrate processing apparatus.

7128631, Oct 31, 2006

Nov 14, 2003

10/714190

Christopher H. McCoy - Natick MA, US
John T. Chen - Somerville MA, US
David R. Beaulieu - Groton MA, US

Surface Logix, Inc. - Brighton MA

H01J 9/00
B41M 1/10

445 24, 430198

A system and method are described for self-aligning electrodes for color filters of passive matrix displays.

7408142, Aug 5, 2008

Sep 14, 2006

11/532008

David R. Beaulieu - Groton MA, US
Harry F. Lockwood - Waban MA, US
Anton S. Tremsin - Lafayette CA, US

Arradiance, Inc. - Sudbury MA

H01J 40/14

250214VT, 250207, 313103 CM

A microchannel amplifier includes an insulating substrate that defines at least one microchannel pore through the substrate from an input surface to an output surface. A conductive layer is formed on an outer surface of the at least one microchannel pore that has a non-uniform resistance as a function of distance through the at least one microchannel pore. The non-uniform resistance is selected to simulate saturation by reducing gain as a function of input current and bias voltage compared with uniform resistance. A first and second electrode is deposited on a respective one of the input and the output surfaces of the insulating substrate. The microchannel amplifier amplifying emissions propagating through the at least one microchannel pore when the first and second electrodes are biased.

7425713, Sep 16, 2008

Jan 13, 2006

11/331545

David Beaulieu - Groton MA, US

Arradiance, Inc. - Sudbury MA

G03F 9/00
G21K 5/10

2504922, 25044211, 2504911, 25049222, 2504923, 378 34

A multi-beam synchronous raster scanning lithography system includes a processor that generates electrical signals representing a desired exposure pattern at an output. A multi-beam source of exposing radiation generates a plurality of exposure beam. A beam modulator receives the electrical signals generated by the processor and modulates the plurality of exposing beams according to the desired exposure pattern. A beam deflector deflects the plurality of exposure beams by a predetermined distance along a first axis, thereby exposing a plurality of pixels along the first axis with the desired exposure pattern. A translation stage moves the substrate a predetermined distance along a second axis to position the substrate for a subsequent exposure of pixels along the first axis that results in a desired overlapping exposure dose profile.

7677859, Mar 16, 2010

Jul 21, 2003

10/623970

Ulysses Gilchrist - Reading MA, US
David R. Beaulieu - Groton MA, US
Peter Van Der Meulen - Newburyport MA, US

Brooks Automation, Inc. - Chelmsford MA

H01L 21/677

414217, 4142171, 414218, 414221, 414411, 414935, 414940

A substrate processing apparatus having a station for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station, apparatus for removing a door of a substrate magazine and thus opening the substrate magazine, and for operating the aperture closure to open the aperture, and an elevator for precisely positioning the open substrate magazine along a vertical axis within a usable range of motion. The station may also include a sensor for mapping locations of the substrates, and a mini-environment for interfacing the station to a substrate processing system.

7759138, Jul 20, 2010

Sep 20, 2008

12/234641

David Beaulieu - Groton MA, US
Neal T. Sullivan - Lunenburg MA, US

Arradiance, Inc. - Sudbury MA

H01L 21/00
H01L 21/311
H01L 21/31
B31D 3/00
G02B 6/10
C25D 5/48

438 20, 438696, 438770, 257E21216, 257E21285, 216 56, 385132, 205223, 977888

A method of fabricating a microchannel plate includes forming a plurality of pores in a silicon substrate. The plurality of pores is oxidized, thereby consuming silicon at surfaces of the plurality of pores and forming a silicon dioxide layer over the plurality of pores. At least a portion of the silicon dioxide layer is stripped, which reduces a surface roughness of the plurality of pores. A semiconducting layer can be deposited onto the surface of the silicon dioxide layer. The semiconducting layer is then oxidized, thereby consuming at least some of the polysilicon or amorphous silicon layer and forming an insulating layer. Resistive and secondary electron emissive layers are then deposited on the insulating layer by atomic layer deposition.

7855493, Dec 21, 2010

Feb 27, 2008

12/038254

Neal T. Sullivan - Lunenburg MA, US
David Beaulieu - Groton MA, US
Anton Tremsin - Lafayette CA, US
Philippe De Rouffignac - Cambridge MA, US
Michael D. Potter - Churchville NY, US

Arradiance, Inc. - Sudbury MA

H01J 43/06

313103CM, 313103 R, 313528, 250214 VT, 250207

A microchannel plate includes a substrate defining a plurality of pores extending from a top surface of the substrate to a bottom surface of the substrate. The plurality of pores includes a resistive material on an outer surface that forms a first emissive layer. A second emissive layer is formed over the first emissive layer. The second emissive layer is chosen to achieve at least one of an increase in secondary electron emission efficiency and a decrease in gain degradation as a function of time. A top electrode is positioned on the top surface of the substrate and a bottom electrode is positioned on the bottom surface of the substrate.