David Courage resumes & CV records
Resumes
David Courage
Location:
Durham, NC
David G Courage, 67Wake Forest, NC
David Courage Phones & Addresses
Wake Forest, NC
1310 Durlain Dr, Raleigh, NC 27614 919-6761858 919-6765827
1310 Durlain Dr #104, Raleigh, NC 27614 919-6761858
109 Parakeet Ln, Raleigh, NC 27614 919-8707058 919-6761858
609 Weathergreen Dr, Raleigh, NC 27615 919-8707058
6653 Lake Hill Dr #L, Raleigh, NC 27609 919-8707058
Haverhill, MA
Chapel Hill, NC
Mentions for David G Courage
Publications & IP owners
Us Patents
Method And Device For Protecting Micro Electromechanical Systems Structures During Dicing Of A Wafer
US Patent:
6946326, Sep 20, 2005
Filed:
Dec 5, 2001
Appl. No.:
10/006964
Inventors:
Timothy R. Spooner - Dunstable MA, US
Kieran P. Harney - Cambridge MA, US
David S. Courage - Methuen MA, US
John R. Martin - Foxborough MA, US
Kieran P. Harney - Cambridge MA, US
David S. Courage - Methuen MA, US
John R. Martin - Foxborough MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L021/44
US Classification:
438113, 438118, 438458, 257620
Abstract:
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
Method And Device For Protecting Micro Electromechanical Systems Structures During Dicing Of A Wafer
US Patent:
6946366, Sep 20, 2005
Filed:
Dec 5, 2001
Appl. No.:
10/006966
Inventors:
Timothy R. Spooner - Dunstable MA, US
David S. Courage - Methuen MA, US
Brad Workman - Needham MA, US
David S. Courage - Methuen MA, US
Brad Workman - Needham MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L021/46
H01L021/50
H01L021/50
US Classification:
438460, 438110, 438462, 438464
Abstract:
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
Method And Device For Protecting Micro Electromechanical Systems Structures During Dicing Of A Wafer
US Patent:
7022546, Apr 4, 2006
Filed:
Dec 5, 2001
Appl. No.:
10/007585
Inventors:
Timothy R. Spooner - Dunstable MA, US
David S. Courage - Methuen MA, US
Brad Workman - Needham MA, US
David S. Courage - Methuen MA, US
Brad Workman - Needham MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 21/44
US Classification:
438106, 438110, 438113
Abstract:
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
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