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David P Dekraker, 601805 Victoria Ln, Burnsville, MN 55337

Known as:
David Patrick Dekraker David J Dekraker Dorothy Maud Dekraker David P Dedrake Dave Dekraker Dekraker Davi David R
Related to:
John D Dekraker 56

David Dekraker Phones & Addresses

1805 Victoria Ln, Burnsville, MN 55337    952-9534785   

12800 Tomanet Trl, Austin, TX 78727    952-9534785   

12802 Tomanet Trl, Austin, TX 78727   

12166 Metric Blvd #1008, Austin, TX 78758    512-8354278   

1800 Ski Slope Dr, Austin, TX 78733    512-2639278    512-2633198   

334 14Th Ave S, South Saint Paul, MN 55075   

San Marcos, TX   

164 Chaparral Cir, Saint Paul, MN 55124    651-3322697   

Greensboro, NC   

Dakota, MN   

1805 Victoria Ln, Burnsville, MN 55337    651-3322697   

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Engineer At Fsi International

Position:
Engineer at FSI International
Location:
Greater Minneapolis-St. Paul Area
Industry:
Semiconductors
Work:
FSI International
Engineer Cypress Semiconductor 2000 - 2006
Engineering Group Lead
Skills:
Semiconductors, Failure Analysis, Metrology, Semiconductor Industry
David Dekraker Photo 6

David Dekraker

Publications & IP owners

Us Patents

Rinsing Methodologies For Barrier Plate And Venturi Containment Systems In Tools Used To Process Microelectronic Workpieces With One Or More Treatment Fluids, And Related Apparatuses

US Patent:
7913706, Mar 29, 2011
Filed:
Jul 29, 2008
Appl. No.:
12/220887
Inventors:
David DeKraker - Burnsville MN, US
Jimmy D. Collins - Allen TX, US
Tracy A. Gast - Waconia MN, US
Alan D. Rose - Wylie TX, US
Richard E. Williamson - Chanhassen MN, US
Assignee:
FSI International, Inc. - Chaska MN
International Classification:
B08B 3/04
US Classification:
134198, 1341041
Abstract:
Tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. The invention provides an approach for rapid, efficient rinsing of wetted surface(s), and is particularly advantageous when used to rinse the lower surface of moveable barrier structures such as a barrier plate that overlies a workpiece being treated in such a manner to define a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, the liquid is flowingly dispensed, preferably under laminar flow conditions, onto a surface that is in fluid communication with the surface to be rinsed. A smooth, uniform wetting and sheeting action results to accomplish rinsing with a significantly reduced risk of generating particle contamination.

Process For Treatment Of Semiconductor Wafer Using Water Vapor Containing Environment

US Patent:
8142571, Mar 27, 2012
Filed:
May 6, 2009
Appl. No.:
12/436465
Inventors:
Kurt K. Christenson - Minnetonka MN, US
David DeKraker - Burnsville MN, US
Assignee:
FSI International, Inc. - Chaska MN
International Classification:
B08B 3/04
B08B 3/10
US Classification:
134 19, 134 30, 134 31
Abstract:
A process is provided for treating a semiconductor wafer at a target wafer temperature. This process includes the following steps:a) determining the target wafer temperature of the semiconductor wafer during a given wafer treatment process step;.

Barrier Structure And Nozzle Device For Use In Tools Used To Process Microelectronic Workpieces With One Or More Treatment Fluids

US Patent:
8387635, Mar 5, 2013
Filed:
Jun 20, 2007
Appl. No.:
11/820709
Inventors:
Jimmy D. Collins - Allen TX, US
David DeKraker - Burnsville MN, US
Tracy A. Gast - Waconia MN, US
Alan D. Rose - Wylie TX, US
Assignee:
Tel FSI, Inc. - Chaska MN
International Classification:
B08B 3/02
US Classification:
134153, 134157, 134902
Abstract:
The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Process For Treatment Of Substrates With Water Vapor Or Steam

US Patent:
2008028, Nov 20, 2008
Filed:
May 15, 2008
Appl. No.:
12/152641
Inventors:
David DeKraker - Burnsville MN, US
Jeffery W. Butterbaugh - Eden Prairie MN, US
Richard E. Williamson - Chanhassen MN, US
International Classification:
B08B 3/10
C23G 1/02
US Classification:
134 3, 134 30, 134 28
Abstract:
A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors. In another aspect, a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors are dispensed onto a portion of the substrate surface that is less than the entire surface of the substrate in an amount effective to treat the portion of the substrate surface, and the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate may be enveloped with a water vapor and/or a optionally nitrogen gas environment during the treatment steps.

Process For Treatment Of Substrates With Water Vapor Or Steam

US Patent:
2010032, Dec 30, 2010
Filed:
Sep 1, 2010
Appl. No.:
12/873635
Inventors:
David DeKraker - Burnsville MN, US
Jeffery W. Butterbaugh - Eden Prairie MN, US
Richard E. Williamson - Chanhassen MN, US
International Classification:
B08B 3/00
US Classification:
134 30
Abstract:
A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors. In another aspect, a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors are dispensed onto a portion of the substrate surface that is less than the entire surface of the substrate in an amount effective to treat the portion of the substrate surface, and the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate may be enveloped with a water vapor and/or an optionally nitrogen gas environment during the treatment steps.

Methodologies For Rinsing Tool Surfaces In Tools Used To Process Microelectronic Workpieces

US Patent:
2011030, Dec 15, 2011
Filed:
Jun 10, 2011
Appl. No.:
13/157695
Inventors:
Mark A. Stiyer - Minneapolis MN, US
David DeKraker - Burnsville MN, US
International Classification:
B08B 3/04
US Classification:
134 34, 134182
Abstract:
Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.

Acid Treatment Strategies Useful To Fabricate Microelectronic Devices And Precursors Thereof

US Patent:
2013000, Jan 3, 2013
Filed:
Jun 11, 2012
Appl. No.:
13/493073
Inventors:
David P. DeKraker - Burnsville MN, US
International Classification:
B08B 3/00
US Classification:
134 28
Abstract:
A method of treating one or more wafers is provided. The method comprises the steps of:

Method Of Removing Liquid From A Barrier Structure

US Patent:
2013003, Feb 7, 2013
Filed:
Oct 9, 2012
Appl. No.:
13/647910
Inventors:
FSI International, Inc. - Chaska MN, US
David P. DeKraker - Burnsville MN, US
Tracy A. Gast - Waconia MN, US
Alan D. Rose - Wylie TX, US
Assignee:
FSI INTERNATIONAL, INC. - Chaska MN
International Classification:
B08B 1/00
US Classification:
134 10
Abstract:
The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Possible Relatives

Adam M Dekraker  William L Dekraker  David Last  David W Johnson  David Stamps  David L Stanard  David M Stanbery  David A Stanchfield  David J Stanciel  David Stancil 

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