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David K Haygood, ~73Benicia, CA

David Haygood Phones & Addresses

Benicia, CA   

Vallejo, CA   

10800 Ashbourne Ct, Cupertino, CA 95014   

San Bernardino, CA   

1892 Via Di Salerno, Pleasanton, CA 94566    925-4842574   

Alamo, CA   

Sunnyvale, CA   

Menlo Park, CA   

Mentions for David K Haygood

Resumes

Resumes

David Haygood Photo 1

David Haygood

Location:
United States
David Haygood Photo 2

David Haygood

Location:
United States

Business Records

Name / TitleCompany / ClassificationPhones & Addresses
David Haygood
Partner, Principal
Id Product Development 100 Frst Ave, Palo Alto, CA 94301

Publications

Us Patents

Method Of Picking Up And Placing Gel Material

US Patent:
4750962, Jun 14, 1988
Filed:
Jan 7, 1987
Appl. No.:
7/001121
Inventors:
David Haygood - Sunnyvale CA
Chet Sandberg - Palo Alto CA
Paul G. Schoenstein - Redwood City CA
Assignee:
Raychem Corporation - Menlo Park CA
International Classification:
B32B 3110
B32B 3118
US Classification:
156249
Abstract:
A method of picking up and placing a portion of gel material. The method includes obtaining a quantity of gel material having at least one tacky surface contacting a sheet of release paper, contacting a portion of the gel material with a mechanical means for peeling a portion of the gel material from the release paper, and finally peeling the portion of gel material from the release material.

Solder Delivery Systems

US Patent:
4712721, Dec 15, 1987
Filed:
Mar 17, 1986
Appl. No.:
6/840624
Inventors:
Raymond Noel - Menlo Park CA
William M. Robinson - Palo Alto CA
Gabe Cherian - Fremont CA
Thomas H. Clifford - Half Moon Bay CA
William D. Carlomagno - Redwood City CA
William M. Deasy - Redwood City CA
Willie K. Grassauer - Mapleton OR
David K. Haygood - Sunnyvale CA
H. Paul Sherlock - San Francisco CA
Harry E. White - Newark CA
Assignee:
Raychem Corp. - Menlo Park CA
International Classification:
H01L 2158
B23K 112
US Classification:
228 563
Abstract:
Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

Heat Recoverable Soldering Device

US Patent:
5221815, Jun 22, 1993
Filed:
Jul 26, 1991
Appl. No.:
7/736658
Inventors:
Peter A. Bostock - Atherton CA
David K. Haygood - Cupertino CA
Kenneth R. Nicholson - Cupertino CA
J. Michael Nordling - Santa Clara CA
Pravin L. Soni - Union City CA
Assignee:
Raychem Corporation - Menlo Park CA
International Classification:
H01R 402
H01R 4302
US Classification:
174 84R
Abstract:
A heat-recoverable soldering device for soldering electrical conductors comprising a heat-recoverable sleeve and a quantity of solder is provided with a deformable retaining member which retains the conductors in the desired alignment when deformed.

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