David R Laidig, 64Mesa, AZ

6356235, Mar 12, 2002

Sep 20, 1999

09/399264

David R. Laidig - Phoenix AZ
John W. Locke - Mesa AZ

Motorola, Inc. - Schaumburg IL

H01Q 302

343700MS, 343846, 343848, 343849, 343893

A ground-based antenna assembly ( ) is provided that includes an assembly base ( ) defining a substantially horizontal plane ( ) and configured for attachment to a residential, commercial or governmental structure. The ground-based antenna ( ) also includes a plurality of planar receiving panels ( ) having a circular and/or elliptical shape. The plurality of planar receiving panels ( ) are radially-spaced about the assembly base ( ) and tilted with respect to the substantially horizontal plane ( ) for a receiving field-of-view. The ground-based antenna assembly ( ) further includes a plurality of planar transmitting panels ( ) having a circular and/or elliptical shape. The plurality of planar transmitting panels ( ) are radially-spaced about the assembly base ( ) and tilted with respect to the substantially horizontal plane ( ) for a transmitting field-of-view. In addition, the plurality of transmitting panels ( ) are radially offset and nested with respect to the plurality of receiving panels ( ).

7280010, Oct 9, 2007

Mar 31, 2005

10/907425

Kenneth V. Buer - Gilbert AZ, US
David Laidig - Mesa AZ, US

U.S. Monolithics, L.L.C. - Gilbert AZ

H01P 7/10
H01P 1/00

3332191, 333260

A RF interconnect comprising a dielectric resonator is disclosed. The dielectric resonator may be included in an interconnect housing. The dielectric resonator includes metalized side surfaces useful for securing the dielectric resonator in an aperture formed in the interconnect housing. The dimensions or material selected for the dielectric resonator may be predetermined to enable the dielectric resonator to operate as a filter or waveguide, as desired.

8433257, Apr 30, 2013

Jul 2, 2012

13/539721

David Laidig - Mesa AZ, US
Kenneth V. Buer - Gilbert AZ, US
Friedhelm Wachter - Phoenix AZ, US

ViaSat, Inc. - Carlsbad CA

H04B 1/38

455 903, 333135

A method and system for an integrated transceiver is presented. The integrated transceiver includes a transceiver housing, where a waveguide is formed inside the transceiver housing using a transceiver housing and a sub-floor component. Neither transceiver housing nor the sub-floor component alone is configured to operate as a waveguide. The integrated transceiver can include a transceiver housing that forms a portion of an integrated waveguide assembly, where the transceiver housing alone does not form the waveguide, and another portion of the integrated waveguide assembly couples with the transceiver housing to form the waveguide of the integrated waveguide assembly. Further, the integrated waveguide portion of the sub-floor component can be a flat surface, where the integrated waveguide portion of the transceiver housing comprises substantially all the features of said integrated waveguide.

8592960, Nov 26, 2013

Aug 30, 2011

13/221693

David R. Laidig - Mesa AZ, US
Kenneth V. Buer - Gilbert AZ, US
Michael R. Lyons - Gilbert AZ, US
Noel Lopez - Chandler AZ, US

ViaSat, Inc. - Carlsbad CA

H01L 23/04

257666, 257728, 438112

A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

8599085, Dec 3, 2013

Apr 13, 2010

12/758942

Kenneth V. Buer - Gilbert AZ, US
Josh Tor - Gilbert AZ, US
David Laidig - Mesa AZ, US

ViaSat, Inc. - Carlsbad CA

H01Q 19/00

343756, 343772, 333 21 A

In accordance with various aspects of the present invention, a method and system for electro-mechanical polarization switching in an antenna system is presented. The antenna system may comprise an integrated waveguide in a transceiver housing, where the waveguide has at least four channels. In an exemplary embodiment, a sliding switch is incorporated into the waveguide. The sliding switch is configured to switch the polarization of the antenna system by physically realigning the waveguide channels. The sliding switch may be electro-magnetically controlled. Furthermore, the polarization switching may be performed to assist in load balancing for a particular frequency and/or polarization combination.

2012001, Jan 19, 2012

Sep 14, 2011

13/232280

Josh Tor - Gilbert AZ, US
Kenneth V. Buer - Gilbert AZ, US
David Laidig - Mesa AZ, US

VIASAT, INC. - Carlsbad CA

H01F 7/08

335256

A solenoid switching method includes energizing a first coil winding to cause a plunger to move in a first direction, and energizing a second coil winding to cause the plunger to move in the opposite direction. Furthermore, the plunger has a first standoff connected to a first end, and a second standoff connected to a second end. The first standoff extends through the first coil winding and the second standoff extends through the second coil winding. The bi-directional solenoid device is configured to physically move a slidable switch between a first position and a second position. Additionally, the plunger stays in position without either of the first coil winding or the second coil winding being energized if the plunger is latched.

5779195, Jul 14, 1998

May 3, 1996

8/642713

Sibnath Basuthakur - Phoenix AZ
David R. Laidig - Phoenix AZ
David H. Cubbage - Chandler AZ

Motorola, Inc. - Schaumburg IL

B64G 164

244161

A satellite assembly (60, 68, 70) is formed from any number of bus modules (22) which have a substantially common shape and interior space volume. Each bus module (22) includes a structural frame (20) which is part of a structural subsystem and at least one and possibly all of a propulsion subsystem (28), a power subsystem (30), a thermal subsystem (32), an attitude, orientation and control subsystem (34), a telemetry, tracking and control subsystem (42) and a payload subsystem (44). Within each bus module (22), the subsystems are substantially non-redundant. Bus modules (22) attach together permanently or temporarily through attachment mechanisms (36). Permanent attachment is used to form large and/or redundancy within the satellites. Temporary attachment is used to increase the structural rigidity of individual bus modules (22) for launch purposes, then the assembly (60) is decomposed into individual satellites.