David Lober resumes & CV records
Resumes
David Felicia Brya Lober
David L Lober
Location:
Gilbert, AZ
David L Lober, 54Gilbert, AZ
David Lober Phones & Addresses
Gilbert, AZ
Park Falls, WI
1096 Folley St, Chandler, AZ 85224 480-8216898
Phoenix, AZ
Maricopa, AZ
Lexington, IL
1096 W Folley St, Chandler, AZ 85224
Work
Position:
Protective Service Occupations
Education
Degree:
High school graduate or higher
Mentions for David L Lober
Publications & IP owners
Us Patents
Mounting A Voltage Regulator On Top Of A Processor
US Patent:
2005027, Dec 15, 2005
Filed:
Jun 14, 2004
Appl. No.:
10/866839
Inventors:
David Lober - Chandler AZ, US
International Classification:
H05K001/18
H01R012/16
H01R012/16
US Classification:
361769000, 361720000, 439074000
Abstract:
A voltage regulator board may be mounted over a processor package on a motherboard. In some embodiments, this on top mounting may save space and may improve voltage power delivery. A voltage regulator interconnect may have a first upper level which contacts the voltage regulator board, in one embodiment, and a second lower contact which receives contacts on the lower side of the processor package. The processor package may then make contact through the voltage regulator interconnect directly to the motherboard. The contacts on the voltage regulator interconnect simply short power from the voltage regulator board through appropriate contacts on the processor package.
Method Of Assembling Components Onto A Circuit Board
US Patent:
6492202, Dec 10, 2002
Filed:
Dec 28, 1999
Appl. No.:
09/473303
Inventors:
David Lober - Chandler AZ
Jay H. Barnes - Chandler AZ
Jay H. Barnes - Chandler AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2152
US Classification:
438122
Abstract:
An electronic component includes a semiconductor device ( ) over a circuit board ( ), a heat sink ( ) over the semiconductor device, a clip ( ) over the heat sink and coupling the heat sink to anchors ( ) adjacent to the semiconductor device. A method of assembling the electronic component includes using an automated tool to couple the anchors to the circuit board, reflowing solder to electrically couple the semiconductor device and the anchors to a ground plane in the circuit board, and removably coupling the heat sink to the anchors.
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