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David J Pels, 59Parker, CO

David Pels Phones & Addresses

Parker, CO   

77 Ohio Avenue Ext, Norwalk, CT 06851   

Littleton, CO   

4060 New Broad Cir #314, Oviedo, FL 32765   

Winter Springs, FL   

Kissimmee, FL   

Orlando, FL   

Seminole, FL   

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David J Pels

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Work

Company: Black magic design - teranex systems Feb 2003 Position: Senior development hardware engineer

Education

School / High School: Polytechnic University- Hawthorne, NY 1994 Specialities: Master of Science in Electrical Engineering

Mentions for David J Pels

David Pels resumes & CV records

Resumes

David Pels Photo 19

David Pels

David Pels Photo 20

David Pels - Oviedo, FL

Work:
Black Magic Design - Teranex Systems Feb 2003 to 2000
Senior Development Hardware Engineer
Philips Semiconductor - Briarcliff Manor, NY Aug 2002 to Oct 2002
FPGA Design Consultant
Transwitch Corporation - Shelton, CT Feb 2001 to Jul 2002
Senior Member Technical Staff
Philips Consumer Electronics - Briarcliff Manor, NY 1998 to 2001
Hardware Engineer
Northrop Grumman Norden Systems - Norwalk, CT 1986 to 1998
Electrical Design Engineer
Education:
Polytechnic University - Hawthorne, NY 1994 to 1995
Master of Science in Electrical Engineering
Berlitz Language Center - Westport, CT 1995
Spanish
Fairfield University School of Engineering - Fairfield, CT 1988 to 1993
Bachelor of Science in Electrical Engineering
Norwalk State Technical College - Norwalk, CT 1983 to 1985
Associate of Science in Electrical Engineering

Publications & IP owners

Us Patents

Emi-Suppression Plate For Use In Ieee-1394 Applications

US Patent:
6858793, Feb 22, 2005
Filed:
Jun 12, 2000
Appl. No.:
09/592058
Inventors:
David J. Pels - Norwalk CT, US
Viatcheslav Pronkine - Edgewater NJ, US
Sean Patrick Ryan - Carmel NY, US
Ronald C. Valenti - New Fairfield CT, US
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
H05K009/00
US Classification:
174 35C, 439 92, 439 95, 439939
Abstract:
An EMI suppression plate surrounds a galvanically isolated connector at the opening in a chassis that is provided for the connector. The plate is configured to provide an immediate high frequency coupling to the chassis ground. The plate comprises a circuit board that includes two conductors that are coupled by one or more capacitors. One conductor is in contact with an outer shell of the connector, and the other conductor is in contact with the chassis ground. By providing a high frequency coupling between the connector and chassis at the location of the connector opening on the chassis, the ground current path between the connector and chassis ground is minimized.

Isbn (Books And Publications)

Bad Software: What To Do When Software Fails

Author:
David Pels
ISBN #:
0471318264

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