David F Sachs, 9130 Nicole Ter, Edison, NJ 08820

2013006, Mar 21, 2013

Nov 9, 2012

13/673882

David SACHS - New York NY, US
Joseph SEEGER - Menlo Park CA, US

INVENSENSE, INC. - Sunnyvale CA

G06F 3/01

345156

Selectable communication interface configurations for motion sensing devices. In one aspect, a module for a motion sensing device includes a motion processor connected to a device component and a first motion sensor, and a multiplexer having first and second positions. Only one of the multiplexer positions is selectable at a time, where the first position selectively couples the first motion sensor and the device component using a first bus, and the second position selectively couples the first motion sensor and the motion processor using a second bus, wherein communication of information over the second bus does not influence a communication bandwidth of the first bus.

2013026, Oct 10, 2013

Jun 5, 2013

13/910485

David SACHS - New York NY, US

G06F 3/03

345156

Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.

2019022, Jul 25, 2019

Apr 2, 2019

16/373086

- San Jose CA, US
David Sachs - New York NY, US
Babak Taheri - San Francisco CA, US

G01C 19/5776
G01C 19/5769
G01P 15/08
G01P 15/125
G01P 1/02
G01P 15/18

A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

2015019, Jul 9, 2015

Mar 19, 2015

14/662711

- San Jose CA, US
David SACHS - New York NY, US
Babak TAHERI - San Francisco CA, US

G01C 19/5776

A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

2015019, Jul 9, 2015

Jan 6, 2015

14/590877

- San Jose CA, US
Joseph JIANG - Sunnyavle CA, US
David SACHS - New York NY, US

G06F 3/01
G06F 3/0346
A63F 13/211

Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.